Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2009
12/30/2009EP1547136B1 Method for making a wire nanostructure in a semiconductor film
12/30/2009EP1361478B1 Method of manufacturing phase shift mask and phase shift mask
12/30/2009EP1192421B1 A non-invasive system and method for diagnosing potential malfunctions of semiconductor equipment components
12/30/2009EP1161309B1 A method for a repetitive ion beam processing with a by carbon containing ion beam
12/30/2009EP1128443B1 Field-effect semiconductor device and fabrication method thereof
12/30/2009CN201374873Y Mould structure for ball mounting machine
12/30/2009CN201374574Y Power failure alarm device, UPS power supply device and silicon wafer processing equipment
12/30/2009CN201374475Y Network exchanger protecting device and semiconductor processing control system
12/30/2009CN201374344Y Novel vacuum chuck
12/30/2009CN201374326Y Quartz boat
12/30/2009CN201374325Y TO-220S lead frame transmission clamp
12/30/2009CN201374324Y Conveying and combining mechanism used for conveying of silicon slice
12/30/2009CN201374323Y Compact type wafer automatic conveying device
12/30/2009CN201374322Y Translating and overturning type wafer automatic conveying device
12/30/2009CN201374321Y Wafer frame cassette and semiconductor processing device
12/30/2009CN201374320Y Automatic test and detection packaging machine of 49S/SMD crystals
12/30/2009CN201374319Y Device for indicating working state of machine station
12/30/2009CN201374318Y Semi-automatic epoxy resin membrane preparation machine used for wafer-level chip package
12/30/2009CN201374317Y Epoxy resin membrane coating station used for wafer-level chip package
12/30/2009CN201374316Y Rotating device for cleaning or eroding wafers
12/30/2009CN201371411Y Vehicle head and flexible membrane thereof for substrate chemical machine buffing device
12/30/2009CN101617399A Semiconductor storage unit, process for manufacturing the same, and method of forming package resin
12/30/2009CN101617398A Semiconductor integrated circuit device
12/30/2009CN101617397A Removable compartments for workpiece stocker
12/30/2009CN101617396A Copper die bumps with electromigration cap and plated solder
12/30/2009CN101617395A Thermosetting die bonding film
12/30/2009CN101617394A Process integration scheme to lower overall dielectric constant in BEoL interconnect structures
12/30/2009CN101617393A Etching method and apparatus, and subject to be processed
12/30/2009CN101617392A Method and apparatus for processing a substrate using plasma
12/30/2009CN101617391A Wire saw device and its machining method using thereof
12/30/2009CN101617390A Dicing/die bonding film
12/30/2009CN101617389A Methods of forming transistor contacts and via openings
12/30/2009CN101617388A Nitride semiconductor substrate
12/30/2009CN101617387A Method and apparatus for localized bonding
12/30/2009CN101617241A Device for pressing electronic component and device for testing electronic component
12/30/2009CN101616773A Process for producing polyurethane foam
12/30/2009CN101615764A Semiconductor element and method for fabrication thereof
12/30/2009CN101615619A Semiconductor device
12/30/2009CN101615597A Nonvolatile memory devices and methods of fabricating the same
12/30/2009CN101615596A Image sensor and method for fabricating the same
12/30/2009CN101615595A CMOS image sensor and method for manufacturing the sensor
12/30/2009CN101615594A Production method of thin film transistor array substrate
12/30/2009CN101615593A Semiconductor device, method of manufacturing the same, peeling method, and transfer method
12/30/2009CN101615592A Semiconductor device, method of manufacturing the same, peeling method, and transfer method
12/30/2009CN101615591A Copper plated high aspect ratio through holes and fabricating method thereof
12/30/2009CN101615590A Method for preparing silicon-on-insulator material using selective corrosion process
12/30/2009CN101615589A Semiconductor device producing method, semiconductor device producing apparatus and pin
12/30/2009CN101615588A Integrated circuit resistance and capacitance technological parameter fluctuation detector and application method
12/30/2009CN101615587A Conducting wire stack type suture joint in semiconductor device
12/30/2009CN101615586A Method for producing transient voltage suppression diode
12/30/2009CN101615585A Method for stacking devices
12/30/2009CN101615584A Chip reconfiguration structure provided with analog baseplate and packaging method thereof
12/30/2009CN101615583A Chip stacking structure and forming method thereof
12/30/2009CN101615582A Method for preparing transparent thin-film transistor of alloyed oxide
12/30/2009CN101615581A Method for manufacturing display device
12/30/2009CN101615580A Method for manufacturing GaAs-based MHEMT device with grid length of 200nm
12/30/2009CN101615579A Semiconductor plasma etching technology
12/30/2009CN101615578A Faraday cup for detecting plasma immersion-injection dose
12/30/2009CN101615577A Epitaxial wafer and production method thereof
12/30/2009CN101615576A Substrate treating apparatus and substrate treating method using the same
12/30/2009CN101615575A Baffle plate and substrate processing apparatus
12/30/2009CN101615574A Processing device
12/30/2009CN101615573A Vacuum heating apparatus
12/30/2009CN101615572A Substrate treating apparatus and method for selectively etching substrate surface
12/30/2009CN101615571A Vacuum chamber for processing substrate and apparatus including the same
12/30/2009CN101615570A Vacuum processing apparatus
12/30/2009CN101615569A Vacuum processor
12/30/2009CN101615568A Substrate cleaning method and developing apparatus
12/30/2009CN101615567A Substrate treatment apparatus
12/30/2009CN101615566A substrate processing apparatus
12/30/2009CN101615565A Method for processing exception of online workbench and system thereof
12/30/2009CN101615564A Crack-free heteroepitaxial growth technology based on intermediate grooving process
12/30/2009CN101615563A Trapezoidal-structure semiconductor wafer processing equipment
12/30/2009CN101615562A Novel-structure glue-spreading development equipment
12/30/2009CN101615561A Process wall for glue spreading development equipment
12/30/2009CN101614968A Lithographic apparatus and device manufacturing method
12/30/2009CN101614920A Method for manufacturing liquid crystal display device
12/30/2009CN101612719A Polishing apparatus and polishing method
12/30/2009CN100576975C Film pattern forming method and application of the same
12/30/2009CN100576966C Control method of plasma treatment device and plasma treatment device
12/30/2009CN100576664C Method for wet method corrosion of Terahertz quantum cascaded laser crestiform structure
12/30/2009CN100576589C Manufacture method of LED
12/30/2009CN100576584C Method for producing an area having reduced electrical conductivity within a semiconductor layer and optoelectronic semiconductor element
12/30/2009CN100576583C Gap epitaxial wafer and gap light-emitting component
12/30/2009CN100576579C Method for manufacturing indium column
12/30/2009CN100576570C Semiconductor device and method for manufacturing same
12/30/2009CN100576569C Schottky device and method of forming
12/30/2009CN100576568C Split gate memory unit and method for manufacturing split gate memory unit array
12/30/2009CN100576567C Thin-film transistor substrate, electronic device and preparation method thereof
12/30/2009CN100576566C Semiconductor device and manufacturing method thereof, and contact etching stop layer
12/30/2009CN100576565C Insulated gate semiconductor device and manufacturing method thereof
12/30/2009CN100576563C Superjunction semiconductor device structure and method
12/30/2009CN100576561C Electro-optical device and electronic apparatus
12/30/2009CN100576559C Flat panel display device and method for fabricating same
12/30/2009CN100576558C Light emitting device
12/30/2009CN100576556C Solid-state imaging device and method for manufacturing said solid-state imaging device
12/30/2009CN100576554C Image sensor package and fabrication method thereof
12/30/2009CN100576553C Solid shooting apparatus and method for manufacturing the same
12/30/2009CN100576552C Solid shooting apparatus, solid shooting element collection box
12/30/2009CN100576550C Thin film transistor array substrate and method for fabricating the same
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