| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/28/2010 | DE112007002213T5 Symetrischer bipolarer Flächentransistorentwurf für Fertigungsprozesse im tiefen Submikrometerbereich Symmetrical bipolar junction transistor design in deep submicron processes for manufacturing |
| 01/28/2010 | DE112006003402B4 Verspannte Silizium-MOS-Vorrichtung mit BOX-Schicht(Burried Oxide-layer)zwischen den Source- und Drain-Gebieten und Herstellungsverfahren dafür Strained silicon MOS device with BOX layer (Buried Oxide Layer) between the source and drain regions and production method thereof |
| 01/28/2010 | DE112004000578B4 Verfahren zur Herstellung eines Gates in einem FinFET-Bauelement und Dünnen eines Stegs in einem Kanalgebiet des FinFET-Bauelements Process for the preparation of a gate in a FinFET device and thinning of a fin in a channel region of the FinFET device |
| 01/28/2010 | DE10358556B4 Ausbildung selbstjustierender Kontakte unter Verwendung von Doppelten-SiN-Abstandschichten Training self-aligning contacts using double-SiN spacer layers |
| 01/28/2010 | DE10323400B4 Verfahren zum Löschen eines nichtflüchtigen Speichers unter Verwendung sowohl des Sourcebereichs als auch des Kanalbereichs einer Speicherzelle A method of erasing a nonvolatile memory using both the source region and the channel region of a memory cell |
| 01/28/2010 | DE10255889B4 Verfahren zur Aufbereitung eines elektrostatischen Haltekörpers A process for the preparation of an electrostatic holding body |
| 01/28/2010 | DE10208577B4 Flash-Speicher mit geteilter Gate-Elektrode und Verfahren zu seiner Herstellung Flash memory split-gate electrode and method for its preparation |
| 01/28/2010 | DE102009033442A1 Halbleiterbauelement mit einer Copolymerschicht A semiconductor device comprising a copolymer |
| 01/28/2010 | DE102009032274A1 Siliciumcarbid-Halbleitervorrichtung und Verfahren zu ihrer Herstellung Silicon carbide semiconductor device and process for their preparation |
| 01/28/2010 | DE102009030281A1 Aktive Abschirmung von Leitern in MEMS-Vorrichtungen Active shielding conductors in MEMS devices |
| 01/28/2010 | DE102009025070A1 Verfahren zum Kapseln eines Chips A method for encapsulating a chip |
| 01/28/2010 | DE102009024756A1 Elektronisches Bauelement und Verfahren zu dessen Herstellung An electronic device and method for its production |
| 01/28/2010 | DE102009018396A1 Halbleiterbauelement und Herstellung des Halbleiterbauelements A semiconductor device and manufacturing of the semiconductor component |
| 01/28/2010 | DE102008048420A1 Chip-Anordnung und Verfahren zum Herstellen einer Chip-Anordnung Chip arrangement and method of manufacturing a chip arrangement |
| 01/28/2010 | DE102008040147A1 Verfahren zur Herstellung einer Monokornmembran für eine Solarzelle sowie Monokornmembran nebst Solarzelle A process for producing a mono-particle membrane for a solar cell and mono-particle membrane together with solar cell |
| 01/28/2010 | DE102008035304A1 Optical system for illuminating substrate with light, particularly for use in microelectronics or in display technology, comprises light source for producing light, which is directed on substrate under angle of incidence |
| 01/28/2010 | DE102008034953A1 Edelmetallverbindungsmittel und Verwendungsverfahren hierzu Precious metal connecting means and methods of use for this purpose |
| 01/28/2010 | DE102008034952A1 Edelmetallverbindungsmittel und Verwendungsverfahren hierzu Precious metal connecting means and methods of use for this purpose |
| 01/28/2010 | DE102008034946A1 Edelmetallverbindungsmittel sowie Herstellungs- und Verwendungsverfahren hierzu Precious metal, fasteners, manufacture and use of this method |
| 01/28/2010 | DE102008026214B3 Verringerung der Metallsiliziddiffusion in einem Halbleiterbauelement durch Schützen von Seitenwänden eines aktiven Gebiets Reducing the Metallsiliziddiffusion in a semiconductor device by protecting the active region of side walls of a |
| 01/28/2010 | DE102007049160B4 Verfahren zum Vereinzeln von zu einer Gruppe zusammengefassten, einen Kunststoffvergusskörper aufweisenden Chipgehäusen A method for separating a group summarized, a Kunststoffvergusskörper having chip packages |
| 01/28/2010 | DE102007043710B4 Tiefe Durchkontaktierungskonstruktion für eine Halbleitereinrichtung und ein Verfahren zu Ihrer Herstellung Depth Durchkontaktierungskonstruktion for a semiconductor device and a method for their preparation |
| 01/28/2010 | DE102006058819B4 Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Werkstück A method for separating a plurality of wafers from a workpiece |
| 01/28/2010 | DE102005034182B4 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof |
| 01/28/2010 | DE102005021190B4 Verfahren zur Herstellung eines Flash-Speicherbauelements und Flash-Speicherbauelement A method for producing a flash memory device and flash memory device |
| 01/28/2010 | DE102004032917B4 Verfahren zum Herstellen eines Doppel-Gate-Transistors A method of manufacturing a double gate transistor |
| 01/28/2010 | DE10164950B4 Verfahren zur Herstellung einer integrierten Halbleiterschaltung A process for producing a semiconductor integrated circuit |
| 01/28/2010 | CA2731592A1 Devices and methods for processing and handling process goods |
| 01/27/2010 | EP2148556A2 Noble metal connection and application method thereof |
| 01/27/2010 | EP2148373A2 Method for applying simultaneous tensile and compressive stress to NMOS and PMOS transistor channels respectively |
| 01/27/2010 | EP2148372A1 Device Structures with a Self-Aligned Damage Layer and Methods for Forming such Device Structures |
| 01/27/2010 | EP2148366A1 Device having plurality of integrated circuits in a matrix |
| 01/27/2010 | EP2148365A2 Semiconductor device and manufacturing method thereof |
| 01/27/2010 | EP2148364A2 Contacting method for substrate-based switches and accompanying switch assembly |
| 01/27/2010 | EP2148363A2 Nobel metal based connection means with a solid fraction and a fluid fraction and application method for same |
| 01/27/2010 | EP2148362A1 Direct contact to area efficient body tie process flow |
| 01/27/2010 | EP2148361A1 Dry etching apparatus and dry etching method |
| 01/27/2010 | EP2148360A1 Dry etching method |
| 01/27/2010 | EP2147948A1 Polyimide precursor, polyimide, and coating solution for under layer film for image formation |
| 01/27/2010 | EP2147739A2 Nobel metal based connection means in the form of a foil with a solid faction and a liquid fraction and application and production method for same |
| 01/27/2010 | EP2147463A2 Connecting microsized devices using ablative films |
| 01/27/2010 | EP2147461A1 Nonvolatile memory cell comprising a nanowire and manufacturing method thereof |
| 01/27/2010 | EP2147452A2 Treatment system for flat substrates |
| 01/27/2010 | EP2147017A1 Functional protein crystals containing a core nano-particle and uses thereof |
| 01/27/2010 | EP2146925A1 Extensions of self-assembled structures to increased dimensions via a "bootstrap" self-templating method |
| 01/27/2010 | EP1885658B1 Method of making scratch resistant coated glass article including layer(s) resistant to fluoride-based etchant(s) |
| 01/27/2010 | EP1644981B1 Semiconductor device including band-engineered superlattice and method of manufacturing the same |
| 01/27/2010 | EP1573799B1 Three-dimensional device fabrication method |
| 01/27/2010 | EP1369928B1 Method for manufacturing a thin-film transistor structure |
| 01/27/2010 | EP1313134B1 Semiconductor polysilicon component and method of manufacture thereof |
| 01/27/2010 | CN201392844Y Solar energy assembly laminator |
| 01/27/2010 | CN201392821Y Clamp |
| 01/27/2010 | CN201392820Y Improved manual laser printing clamp |
| 01/27/2010 | CN201392819Y Sealed module |
| 01/27/2010 | CN201392818Y Glue extruding cylinder of semiconductor encapsulation die |
| 01/27/2010 | CN201392817Y Cleaning device for gluing developing machine |
| 01/27/2010 | CN201392743Y Pure water timing control device |
| 01/27/2010 | CN201392450Y Mask plate |
| 01/27/2010 | CN201392350Y Probe card for anti-interference asynchronous trimming wafer test |
| 01/27/2010 | CN201389845Y Element cold-sealing mould table |
| 01/27/2010 | CN101636836A Semiconductor device and method of manufacturing same |
| 01/27/2010 | CN101636835A Semiconductor device and method of manufacturing semiconductor device |
| 01/27/2010 | CN101636834A Semiconductor device and method of manufacturing the same |
| 01/27/2010 | CN101636833A Method for transferring an epitaxial layer |
| 01/27/2010 | CN101636832A Patterned thin SOI |
| 01/27/2010 | CN101636831A Solder bump interconnect for improved mechanical and thermo mechanical performance |
| 01/27/2010 | CN101636830A Semiconductor device and method for manufacturing the same |
| 01/27/2010 | CN101636829A Method of forming openings in selected material |
| 01/27/2010 | CN101636828A Active matrix substrate |
| 01/27/2010 | CN101636827A Active matrix substrate |
| 01/27/2010 | CN101636826A Semiconductor arrangement with trench capacitor and method for production thereof |
| 01/27/2010 | CN101636825A Substrate heat treatment device and substrate heat treatment method |
| 01/27/2010 | CN101636824A High power electrical connector for a laminated heater |
| 01/27/2010 | CN101636823A Multicrystalline silicon solar cells |
| 01/27/2010 | CN101636822A Pulsed plasma system with pulsed reaction gas replenish for etching semiconductor structures |
| 01/27/2010 | CN101636821A High-density power mosfet with planarized metalization |
| 01/27/2010 | CN101636820A Ohmic electrode structure and semiconductor element |
| 01/27/2010 | CN101636819A Dopant host and process for producing the dopant host |
| 01/27/2010 | CN101636818A Electrode isolation method and nanowire-based device having isolated electrode pair |
| 01/27/2010 | CN101636248A Polishing pad |
| 01/27/2010 | CN101636247A Polishing pad |
| 01/27/2010 | CN101635279A Manufacturing method for protecting interval wall of bipolar transistor circuit |
| 01/27/2010 | CN101635278A Ion doping method for memory cell in DRAM |
| 01/27/2010 | CN101635277A Spacer shape engineering for void-free gap-filling process |
| 01/27/2010 | CN101635276A Touch control panel of organic luminous diode and manufacture method thereof |
| 01/27/2010 | CN101635275A Semiconductor device, semiconductor chip, manufacturing methods thereof, and stack package |
| 01/27/2010 | CN101635274A Method for eliminating cavity in filling of metal gap |
| 01/27/2010 | CN101635273A Preparation method of tungsten plug |
| 01/27/2010 | CN101635272A Method for forming interconnect structures |
| 01/27/2010 | CN101635271A Fabricating method of shallow trench isolation structure |
| 01/27/2010 | CN101635270A Sti film property using sod post-treatment |
| 01/27/2010 | CN101635269A Method for processing shallow trench area of high-voltage MOS device |
| 01/27/2010 | CN101635268A Vacuum clamping sucking disk of improved semiconductor wafer |
| 01/27/2010 | CN101635267A Device for taking and putting crystalline grain and method thereof |
| 01/27/2010 | CN101635266A Structure and method for connecting three-dimensional interconnect between crystalline grain and wafer |
| 01/27/2010 | CN101635265A 电子封装结构及其制造方法 Electronic packaging structure and manufacturing method |
| 01/27/2010 | CN101635264A Method of producing semiconductor module |
| 01/27/2010 | CN101635263A Method of manufacturing display device |
| 01/27/2010 | CN101635262A Preparation method of germanium-base schottky transistor |
| 01/27/2010 | CN101635261A Semiconductor device and method for manufacturing the same |