Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2010
02/11/2010US20100032653 Carbon Nanotube Electric Field Effect Transistor and Process for Producing the Same
02/11/2010US20100032650 Light emitting diode having algan buffer layer and method of fabricating the same
02/11/2010US20100032644 Nitride Semiconductor Light-Emitting Device and Nitride Semiconductor Light-Emitting Device Fabrication Method
02/11/2010US20100032643 Memory cell that includes a carbon-based memory element and methods of forming the same
02/11/2010US20100032642 Method of Manufacturing a Resistivity Changing Memory Cell, Resistivity Changing Memory Cell, Integrated Circuit, and Memory Module
02/11/2010US20100032641 Nonvolatile semiconductor memory apparatus and manufacturing method thereof
02/11/2010US20100032639 Memory cell that includes a carbon-based memory element and methods of forming the same
02/11/2010US20100032638 Memory cell that includes a carbon-based memory element and methods of forming the same
02/11/2010US20100032636 Non-volatile memory cell with enhanced filament formation characteristics
02/11/2010US20100032635 Array of low resistive vertical diodes and method of production
02/11/2010US20100032588 Writing apparatus and writing method
02/11/2010US20100032586 Uniform Large-Grained And Grain Boundary Location Manipulated Polycrystalline Thin Film Semiconductors Formed Using Sequential Lateral Solidification And Devices Formed Thereon
02/11/2010US20100032579 METHOD OF PASSIVATING AND ENCAPSULATING CdTe AND CZT SEGMENTED DETECTORS
02/11/2010US20100032339 Cover body and substrate receiving container
02/11/2010US20100032094 Ceiling plate and plasma process apparatus
02/11/2010US20100032013 Semiconductor component
02/11/2010US20100031998 Process for manufacturing combined solar panels of photovoltaic and thermal type and related solar panel
02/11/2010US20100031992 Large format thermoelectric infrared detector and method of fabrication
02/11/2010US20100031990 Cascaded Photovoltaic and Thermophotovoltaic Energy Conversion Apparatus with Near-Field Radiation Transfer Enhancement at Nanoscale Gaps
02/11/2010US20100031503 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
02/11/2010DE19824514B4 Diode Diode
02/11/2010DE19734985B4 Transistorbauelement Transistor device
02/11/2010DE112008001006T5 Verfahren und Vorrichtung zum Prüfen vereinzelter Halbleiterchips Method and apparatus for testing singulated semiconductor chips
02/11/2010DE112008000974T5 Durch Verformung verbesserte Halbleiterbauelemente und Verfahren zu deren Herstellung By deformation of improved semiconductor devices and processes for their preparation
02/11/2010DE112008000937T5 Prüfgerät und elektronische Vorrichtung Instrument and electronic device
02/11/2010DE112008000826T5 Verfahren und Struktur zum Herstellen eines oberseitigen Kontakts mit einem Substrat Method and structure for fabricating a top-side contact with a substrate
02/11/2010DE112008000571T5 Bilden eines nicht-planaren Transistors mit einem Quantentopfkanal Forming a non-planar transistor having a quantum well channel
02/11/2010DE10339939B4 Intergierte Schaltungsanordnung und Verfahren zur Herstellung und Beurteilung derselben Inter-alloy circuitry and method for producing the same and assessment
02/11/2010DE10333810B4 Verfahren zum Bearbeiten eines Halbleiterwafers einschließlich Schleifen der Rückseite A method of processing a semiconductor wafer including grinding the back
02/11/2010DE10250832B4 MOS-Transistor auf SOI-Substrat mit Source-Durchkontaktierung und Verfahren zur Herstellung eines solchen Transistors MOS transistor on an SOI substrate with source via and method for producing such a transistor
02/11/2010DE102009035623A1 Halbleitervorrichtung Semiconductor device
02/11/2010DE102009035391A1 Halbleiterbauelement und Verfahren zur Herstellung des Bauelementes Semiconductor device and process for the preparation of the component
02/11/2010DE102009035029A1 Halbleiterbauelement mit einer dynamischen Gate-Drain-Kapazität A semiconductor device having a dynamic gate-drain capacitance
02/11/2010DE102009034953A1 Halbleitervorrichtung und Verfahren zu deren Fertigung A semiconductor device and method of manufacturing
02/11/2010DE102009034951A1 Bildsensor und Verfahren zu seiner Herstellung Image sensor and method for its preparation
02/11/2010DE102009030325A1 Halbleiterchipbaugruppe Semiconductor chip assembly
02/11/2010DE102009030086A1 Feldeffekteinrichtung und Verfahren zum Herstellen derselben Field effect device and method of manufacturing the same
02/11/2010DE102009027309A1 Leiterplatten-Kugelmatrix-System mit verbesserter mechanischer Festigkeit PCB ball grid array system with improved mechanical strength
02/11/2010DE102009019684A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
02/11/2010DE102008050538A1 Optoelektronisches Bauelement und Verfahren zu dessen Herstellung Optoelectronic component and process for its preparation
02/11/2010DE102008049664B3 Method for producing semiconductor body of diode, involves forming n-conductive zone by implantation of protons in direction in semiconductor body in depth and by heating body for forming hydrogen-reduced donors
02/11/2010DE102008041135A1 Inspektionsvorrichtung- und Verfahren für die optische Untersuchung von Objektoberflächen, insbesondere einer Wafernotch Inspektionsvorrichtung- and methods for optical examination of surfaces of objects, in particular a wafer Notch
02/11/2010DE102008040970A1 Mikromechanische Vorrichtung mit Kavernen mit unterschiedlichem atmosphärischen Innendruck Micromechanical device with caverns with different internal atmospheric pressure
02/11/2010DE102008037051A1 Wafer separating method for solar panel, involves guiding separation tool i.e. saw, in profile parallel to normal direction by guiding device, and separating wafer from square-shaped ingot in normal direction
02/11/2010DE102008036766A1 Vorrichtung und Verfahren zum Erzeugen dielektrischer Schichten im Mikrowellenplasma Apparatus and method for producing dielectric layers in the microwave plasma
02/11/2010DE102008035816A1 Leistungssteigerung in PMOS- und NMOS-Transistoren auf der Grundlage eines Silizium/Kohlenstoff-Materials Improved performance in PMOS and NMOS transistors on the basis of a silicon / carbon material
02/11/2010DE102008035812A1 Flacher pn-Übergang, der durch in-situ-Dotierung während des selektiven Aufwachsens einer eingebetteten Halbleiterlegierung mittels eines zyklischen Aufwachs-Ätz-Abscheideprozesses gebildet wird Shallow pn junction formed by in-situ doping during the selective growth of an embedded semiconductor alloy by means of a cyclic nursery grounds etch-deposition process
02/11/2010DE102008034505A1 Vorrichtungen und Verfahren zum Prozessieren und Handhaben von Prozessgut Devices and methods for processing and handling of process material
02/11/2010DE102008034468A1 Leistungshalbleitermodul The power semiconductor module
02/11/2010DE102008034467A1 Anordnung mit einem Leistungshalbleitermodul und mit einer Verbindungseinrichtung Arrangement with a power semiconductor module and with a connecting device
02/11/2010DE102004063997B4 Verfahren zum Herstellen einer integrierten Schaltungsanordnung A method of fabricating an integrated circuit arrangement
02/11/2010DE102004063690B4 Nicht-volatiles Speicherbauelement vom SONOS-Typ mit leitendem Seitenwand-Spacer und Verfahren zur Herstellung desselben Of the same non-volatile memory device of SONOS type with conductive sidewall spacers and methods for making
02/11/2010DE102004045447B4 Mobiler, elektrostatischer Substrathalter und Verfahren zur Halterung eines Substrates auf einem mobilen, elektrostatischen Substrathalter Mobile, electrostatic substrate holder and method for supporting a substrate on a mobile electrostatic substrate holder
02/11/2010DE102004037007B4 Ätzverfahren zur Herstellung einer Halbleitervorrichtung Etching process of manufacturing a semiconductor device
02/11/2010DE10132668B4 Halbleitervorrichtung mit definierter Eingangs- /Ausgangsblockgröße und Verfahren zu deren Entwicklung A semiconductor device having a defined input / output block size, and methods for their development
02/11/2010DE10121657B4 Mikroelektronische Struktur mit Wasserstoffbarrierenschicht Microelectronic structure with hydrogen barrier layer
02/10/2010EP2151861A1 Passivation of etched semiconductor structures
02/10/2010EP2151860A2 Dicing die-bonding film
02/10/2010EP2151859A2 Method of determining characteristics of a transistor in an integrated circuit
02/10/2010EP2151858A2 Dicing die-bonding film
02/10/2010EP2151857A2 Dicing die-bonding film
02/10/2010EP2151856A1 Relaxation of strained layers
02/10/2010EP2151855A1 Plasma-processing device and method of manufacturing adhesion-preventing member
02/10/2010EP2151854A2 Method to direct pattern metals on a substrate
02/10/2010EP2151853A1 Compound-type thin film, method for compound-type thin film formation, and electronic apparatus using the thin film
02/10/2010EP2151852A1 Relaxation and transfer of strained layers
02/10/2010EP2151851A1 Method for forming silicon oxide film of soi wafer
02/10/2010EP2151848A1 Method of machining a work piece with a focused particle beam
02/10/2010EP2151847A1 Method of machining a work piece with a focused particle beam
02/10/2010EP2151715A1 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor device
02/10/2010EP2151714A2 Original data generation program and original data generation method
02/10/2010EP2151712A1 Method of manufacturing a wavelength converter and wavelength converter
02/10/2010EP2151482A1 Chemical mechanical polishing composition comprising a copolymer of poly(ethylene glycol) methyl ether (meth)acrylate and 1 -vinylimidazole and methods for polishing a copper substrate
02/10/2010EP2151025A1 Methods of fabricating metal contact structures for laser diodes using backside uv exposure
02/10/2010EP2150981A1 Mos transistor with a p-field implant overlying each end of a gate thereof
02/10/2010EP2150978A1 Semiconductor constructions, electronic systems, and methods of forming cross-point memory arrays
02/10/2010EP2150977A1 Cmos circuits with high-k gate dielectric
02/10/2010EP2150973A1 Non-destructive wafer-scale sub-surface ultrasonic microscopy employing near field afm detection
02/10/2010EP2150972A2 Method for assembling a member of a holder by sintering a conducting powder mass
02/10/2010EP2150970A2 Nitride semi-conductor component layer structure on a group iv substrate surface
02/10/2010EP2150969A1 Apparatus and method for ultrasonic wet treatment of plate-like articles
02/10/2010EP2150632A1 Method for eliminating defects from semiconductor materials
02/10/2010EP1958244B1 Method of fabricating self aligned schottky junctions for semiconductors devices
02/10/2010EP1768172B1 Projection exposure apparatus
02/10/2010EP1018135B1 Vacuum plasma processor having coil with added conducting segments to its peripheral part
02/10/2010CN201402818Y Solar cell slice conveying and receiving device
02/10/2010CN201402816Y Silicon chip carrying basket
02/10/2010CN201402815Y Thin-film solar battery marking apparatus
02/10/2010CN201402801Y Adhesive sealing device of thick film integrated circuit
02/10/2010CN201402800Y Chip ball-planting fixture
02/10/2010CN201402799Y Dispensing device with mounting adhesive for packaging
02/10/2010CN201402798Y Mounting dispensing head for packaging
02/10/2010CN201399434Y Throttle type separating device
02/10/2010CN101647114A Semiconductor memory device and method for manufacturing the same
02/10/2010CN101647113A 半导体装置及其制造方法 Semiconductor device and manufacturing method
02/10/2010CN101647112A Semiconductor constructions, methods of forming multiple lines, and methods of forming high density structures and low density structures with a single photomask
02/10/2010CN101647111A Capacitor cell, integrated circuit, integrated circuit designing method, and integrated circuit manufacturing method
02/10/2010CN101647110A Fabrication method of a semiconductor device and a semiconductor device
02/10/2010CN101647109A Semiconductor device
02/10/2010CN101647108A Structure and method for forming asymmetrical overlap capacitance in field effect transistors