| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/15/2010 | US20100090227 Method for the formation of a gate oxide on a sic substrate and sic substrates and devices prepared thereby |
| 04/15/2010 | US20100090224 Thin film transistor, method of fabricating the same, and organic light emitting diode display device having the thin film transistor |
| 04/15/2010 | US20100090223 Semiconductor device and manufacturing method thereof |
| 04/15/2010 | US20100090222 Thin film transistor; method of manufacturing same; and organic light emitting device including the thin film transistor |
| 04/15/2010 | US20100090221 Distortion tolerant processing |
| 04/15/2010 | US20100090220 Thin film transistor and semiconductor device using the same |
| 04/15/2010 | US20100090219 Method for fabrication of semiconductor device |
| 04/15/2010 | US20100090217 Semiconductor device and manufacturing method thereof |
| 04/15/2010 | US20100090215 Thin film transistor and method for preparing the same |
| 04/15/2010 | US20100090214 Oxide thin film and oxide thin film device |
| 04/15/2010 | US20100090212 Memory cell |
| 04/15/2010 | US20100090208 Thin film transistor substrate, method of manufacturing the same, and display apparatus having the same |
| 04/15/2010 | US20100090207 Electroluminescent Organic Semiconductor Element and a Method for Repair of an Electroluminescent Organic Semiconductor Element |
| 04/15/2010 | US20100090197 Method of manufacturing semiconductor nanowire sensor device and semiconductor nanowire sensor device manufactured according to the method |
| 04/15/2010 | US20100090195 Quantum dot optoelectronic devices with enhanced performance |
| 04/15/2010 | US20100090192 Method for controlled formation of the resistive switching material in a resistive switching device and device obtained thereof |
| 04/15/2010 | US20100090191 Cross point memory arrays, methods of manufacturing the same, masters for imprint processes, and methods of manufacturing masters |
| 04/15/2010 | US20100090190 Phase change memory device having dielectric layer for isolating contact structure formed by growth, semiconductor device having the same, and methods for manufacturing the devices |
| 04/15/2010 | US20100090159 Semiconductor polishing composition |
| 04/15/2010 | US20100090125 Method for manufacturing a semiconductor device and laser irradiation apparatus |
| 04/15/2010 | US20100090103 Mass spectrometer |
| 04/15/2010 | US20100090095 Image sensor and method for manufacturing the same |
| 04/15/2010 | US20100090093 Image Sensor and Method For Manufacturing the Same |
| 04/15/2010 | US20100089881 Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows |
| 04/15/2010 | US20100089851 Devices and methods for handling microelectronic assemblies |
| 04/15/2010 | US20100089607 Semiconductor power conversion apparatus and method of manufacturing the same |
| 04/15/2010 | US20100089533 Ashing apparatus |
| 04/15/2010 | US20100089532 Plasma processing apparatus for performing accurate end point detection |
| 04/15/2010 | US20100089491 Gas Filling Socket, Gas Filling Socket Set, and Gas Filling Apparatus |
| 04/15/2010 | US20100089451 Curable Liquid Composition, Method Of Coating, Inorganic Substrate, and Semiconductor Device |
| 04/15/2010 | US20100089432 Photovoltaic module comprising layer with conducting spots |
| 04/15/2010 | US20100089323 Method for coating internal member having holes in vacuum processing apparatus and the internal member having holes coated by using the coating method |
| 04/15/2010 | US20100089321 Generation and distribution of a fluorine gas |
| 04/15/2010 | US20100089314 Substrate support system for reduced autodoping and backside deposition |
| 04/15/2010 | US20100089156 Mechanical quantity sensor and method of manufacturing the same |
| 04/15/2010 | DE19961135B4 Spannungsdetektor zur Verwendung in einem Halbleiterbauelement Voltage detector for use in a semiconductor device |
| 04/15/2010 | DE19756530B4 Verfahren zur Herstellung einer Halbleitereinrichtung A process for producing a semiconductor device |
| 04/15/2010 | DE19654577B4 Verfahren zum Ansteuern von Wortleitungen in Halbleiter-Speichervorrichtungen A method of driving word lines in the semiconductor memory devices |
| 04/15/2010 | DE112008001389T5 Schneidbearbeitungsverfahren Cutting machining process |
| 04/15/2010 | DE112008001372T5 Verfahren und Vorrichtung zum Bilden eines Metalloxid-Dünnfilms Method and apparatus for forming a metal oxide thin film |
| 04/15/2010 | DE112008000492T5 Elektrischer Kompressor mit Integralinverter The electric compressor with integral inverter |
| 04/15/2010 | DE112008000476T5 Elektrischer Kompressor mit Integralinverter The electric compressor with integral inverter |
| 04/15/2010 | DE112006002055B4 Verfahren zur Herstellung eines verspannten MOS-Bauelements A method for producing a stressed MOS device |
| 04/15/2010 | DE112006000148B4 Transistor-Bauteil mit gestuftem Profil im Quellen/Senken-Bereich sowie Verfahren zur Herstellung desselben Of the same transistor device having a stepped profile in the source / drain regions and methods of making |
| 04/15/2010 | DE10346609B4 Verfahren zum Herstellen von Seitenwand-Oxidfilmen an einer Seitenwand einer Gateelektrode in einer Flash-Speicherzelle A method for producing side-wall oxide films on a side wall of a gate electrode in a flash memory cell |
| 04/15/2010 | DE102009043442A1 Maskenrohlingssubstrat und Maskenrohlingssatz Mask blank substrate and mask blank record |
| 04/15/2010 | DE102009043202A1 Eine elektronische Komponente, ein Halbleiterwafer und ein Verfahren zur Herstellung einer elektronischen Komponente An electronic component, a semiconductor wafer and a method of manufacturing an electronic component |
| 04/15/2010 | DE102009039227A1 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device |
| 04/15/2010 | DE102009039226A1 Verfahren zum Herstellen eines Stacked-Die-Moduls A method of manufacturing a stacked die module |
| 04/15/2010 | DE102009038702A1 Halbleiteranordnung und Herstellungsverfahren A semiconductor device and manufacturing method |
| 04/15/2010 | DE102009036412A1 Entspannung einer Schicht aus gespanntem Material unter Anwendung eines Versteifungsmittels Relaxation of a layer of strained material using a stiffening agent |
| 04/15/2010 | DE102009035688A1 Halbleiterbauelement mit Trenchgatestruktur und Verfahren zur Herstellung desselben Of the same semiconductor device having a trench gate structure and methods for preparing |
| 04/15/2010 | DE102009034838A1 Verfahren und Vorrichtung zur Fehleranalyse von integrierten Halbleiterschaltungsvorrichtungen Method and apparatus for fault analysis of semiconductor integrated circuit devices |
| 04/15/2010 | DE102009034404A1 Transformatoren und Verfahren zum Herstellen derselben Transformers and methods of manufacturing the same |
| 04/15/2010 | DE102009027292A1 Inverterleistungsmodul mit verteilter Stütze zur direkten Substratkühlung Inverter power module with distributed support for the direct substrate cooling |
| 04/15/2010 | DE102009026480A1 Modul mit einer gesinterten Fügestelle Module with a sintered joint |
| 04/15/2010 | DE102009021021A1 Bauelement mit verringerter freier Ladungsträger-Lebensdauer Component with a reduced free charge carrier lifetime |
| 04/15/2010 | DE102008063353A1 Widerstandsspeicherbauelement und Verfahren zu seiner Herstellung Resistance memory device and method for its preparation |
| 04/15/2010 | DE102008052100A1 Flexibly deformable retaining element e.g. electrostatic retaining element, for retaining e.g. wafer, has actuator exerting compressive- and/or tractive force for expansion and constriction of recess and/or deformation of element |
| 04/15/2010 | DE102008050798A1 Method for positioning and fixing e.g. semiconductor chip, on e.g. direct copper Bonding substrate, involves pressing components together such that electrical connection and mechanical fixing of components are obtained |
| 04/15/2010 | DE102008049552A1 Sensor-chip unit has chip body which has front side, rear side and side surfaces adjacent to front side and rear side, where auxiliary structure is arranged on surface area of front side in proximity to edge in form-fit manner |
| 04/15/2010 | DE102008048081A1 Verfahren zur Prüfung elektronischer Bauelemente einer Wiederholstruktur unter definierten thermischen Bedingungen Method for testing electronic components of a repetitive pattern under defined thermal conditions |
| 04/15/2010 | DE102008044985A1 Verfahren zur Herstellung eines Halbleiterbauelements mit einem kohlenstoffenthaltenden leitenden Material für Durchgangskontakte A process for producing a semiconductor device with a carbon-containing conductive material for vias |
| 04/15/2010 | DE102007030321B4 Halbleiterbauelement mit Gatestruktur und Herstellungsverfahren des Halbleiterbauelements A semiconductor device having gate structure and manufacturing method of the semiconductor component |
| 04/15/2010 | DE102006037512B4 Modul und Verfahren zur Herstellung eines Moduls mit übereinander gestapelten Bauelementen Module and method for manufacturing a module having stacked components |
| 04/15/2010 | DE102006012416B4 Halbleiterbauelement (FET) mit einem runden Nano-Leitungstransistorkanal A semiconductor device (FET) with a round nano-line transistor channel |
| 04/15/2010 | DE102006010273B4 Verfahren zur Herstellung einer verspannten Schicht auf einem spannungskompensierten Schichtstapel mit geringer Defektdichte, Schichtstapel und dessen Verwendung A process for producing a strained layer on a voltage compensated layer stack having a low defect density, layer stack and the use thereof |
| 04/15/2010 | DE102005045371B4 Halbleiterspeicher, die Herstellung davon und Verfahren zum Betreiben des Halbleiterspeichers A semiconductor memory, the preparation thereof and methods of operating the semiconductor memory |
| 04/15/2010 | DE102005028202B4 Verfahren zur Herstellung von Halbleiterscheiben aus Silizium A process for producing semiconductor wafers from silicon |
| 04/15/2010 | DE102005026228B4 Transistor vom GAA-Typ und Verfahren zu dessen Herstellung Transistor of the ATM type and process for its preparation |
| 04/15/2010 | DE102005018108B4 Verfahren zur Herstellung eines Halbleiterbauelements mit einer Lötschicht A process for producing a semiconductor device with a solder layer |
| 04/15/2010 | DE102004037186B4 Bipolares Halbleiterbauelement mit Kaskodenstruktur und Verfahren zur Herstellung desselben Of the same bipolar semiconductor component with cascode structure and methods for preparing |
| 04/15/2010 | DE102004024344B4 Verfahren zur Herstellung eines Leistungs-Halbleiterbauteils sowie Leistungs-Halbleiterbauteil A method for producing a power semiconductor component and the power semiconductor component |
| 04/15/2010 | DE10121502B4 Verfahren zum Unterteilen eines Halbleiterwafers A method for dividing a semiconductor wafer |
| 04/15/2010 | CA2740027A1 Aqueous acidic formulations for copper oxide etch residue removal and prevention of copper electrodeposition |
| 04/15/2010 | CA2739327A1 Mesa etch method and composition for epitaxial lift off |
| 04/14/2010 | EP2175694A1 Method for forming thin film, method for manufacturing organic electroluminescent device, method for manufacturing semiconductor device, and method for manufacturing optical device |
| 04/14/2010 | EP2175495A1 Sealed device |
| 04/14/2010 | EP2175492A1 Semiconductor device and method for manufacturing the same |
| 04/14/2010 | EP2175489A1 Semiconductor device |
| 04/14/2010 | EP2175488A1 Semiconductor device and method for manufacturing the same |
| 04/14/2010 | EP2175487A2 Semiconductor device and method for fabricating the same |
| 04/14/2010 | EP2175486A2 Semiconductor device and method for fabricating the same |
| 04/14/2010 | EP2175485A2 Connection between two soldered inserts and method of manufacturing the same |
| 04/14/2010 | EP2175483A2 Device for holding a semiconductor disc and method for its use |
| 04/14/2010 | EP2175482A1 Vacuum processing device and vacuum processing method |
| 04/14/2010 | EP2175480A1 Group iii nitride semiconductor substrate and method for cleaning the same |
| 04/14/2010 | EP2175479A1 A method for processing a semiconductor substrate surface and a chemical processing device for the semiconductor substrate surface |
| 04/14/2010 | EP2175478A2 Method for transferring a thin film comprising a step of generating inclusions |
| 04/14/2010 | EP2175477A1 Bonded wafer manufacturing method |
| 04/14/2010 | EP2175319A1 Positive photosensitive resin composition for spray coating, method for forming cured film using the same, cured film and semiconductor device |
| 04/14/2010 | EP2175234A1 Method of measuring a three-dimensional shape |
| 04/14/2010 | EP2175053A2 Branched nanowire and method for fabrication of the same |
| 04/14/2010 | EP2175049A1 Method for improving the adhesion between silver surfaces and resin materials |
| 04/14/2010 | EP2175046A2 Fluorine process for cleaning semiconductor process chamber |
| 04/14/2010 | EP2174772A1 Structuring on the surface of thin layers by localised ejection of non-miscible liquid |
| 04/14/2010 | EP2174358A2 Semiconductor light emitting device and method of manufacturing the same |
| 04/14/2010 | EP2174357A1 Method of producing large area sic substrates |
| 04/14/2010 | EP2174348A1 Method for producing an electronic component and electronic component |
| 04/14/2010 | EP2174347A1 Charge reservoir structure |