Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2014
07/16/2014CN103928501A 基于m面GaN上的极性InN纳米线材料及其制作方法 Based on polar InN on m-plane GaN nano wire material and manufacturing method thereof
07/16/2014CN103928499A 一种缓冲型衬底结构及其上的侧向外延生长方法 A buffered substrate structure and the epitaxial lateral overgrowth method
07/16/2014CN103928487A 背照式图像传感器及其形成方法 Back-illuminated image sensor and method of forming
07/16/2014CN103928482A 一种cmos纳米线晶体管结构及制备方法 A nano-wire transistor structure and preparation method cmos
07/16/2014CN103928476A 显示装置及其制造方法 Display device and method of manufacturing
07/16/2014CN103928475A Tft阵列基板、显示面板及其制作方法 Tft array substrate, the display panel and manufacturing method thereof
07/16/2014CN103928473A 可挠式显示面板及可挠式显示面板的制作方法 The method of making a flexible display panel and a flexible display panel
07/16/2014CN103928472A 一种阵列基板及其制作方法和显示装置 One kind of array substrate and a display device and manufacturing method thereof
07/16/2014CN103928471A 一种阵列基板及其制备方法、显示装置 One kind of array substrate and its preparation method, a display device
07/16/2014CN103928470A 一种氧化物半导体tft阵列基板及其制造方法 An oxide semiconductor tft array substrate and a method of manufacturing
07/16/2014CN103928469A 一种tft阵列基板及其制造方法、显示面板 One kind tft array substrate and a method of manufacturing the display panel
07/16/2014CN103928464A 复合器件及开关电源 Composite devices and switching power supply
07/16/2014CN103928463A 高压ed nmos 元件嵌入高压横向njfet High Pressure ed nmos elements are embedded high voltage lateral njfet
07/16/2014CN103928457A 天线二极管电路及其制造方法 The antenna diode circuit and its manufacturing method
07/16/2014CN103928455A 一种tft阵列基板及其制造方法 One kind of a method of manufacturing the array substrate tft
07/16/2014CN103928453A 一种阵列基板及其制造方法 Substrate and a method of manufacturing an arrayed
07/16/2014CN103928448A 芯片装置和用于制造芯片装置的方法 Chip device and a method for producing chip device
07/16/2014CN103928445A 芯片装置和用于形成芯片装置的方法 Apparatus and methods for forming chips chip device
07/16/2014CN103928443A 堆叠式封装模块与其制造方法、电子装置 Stacked package module and its manufacturing method, electronic device
07/16/2014CN103928441A 一种基于胶膜的fcbga单芯片封装件及其制作工艺 Fcbga single chip package and a film based on the production process
07/16/2014CN103928440A 一种铜互连扩散阻挡层及其制备方法 A copper diffusion barrier layer interconnect its preparation method
07/16/2014CN103928439A 一种抗过载非硅mems厚金属悬空微电感 An anti-overload non-silicon mems thick metal dangling microinductance
07/16/2014CN103928436A 具有覆铜导体的接合系统 Copper conductors with a bonding system
07/16/2014CN103928434A 一种基于Flux的FCBGA单芯片封装件及其制作工艺 A Flux of FCBGA single chip package based on its production process
07/16/2014CN103928433A 半导体装置及其制法 Semiconductor device Jiqizhifa
07/16/2014CN103928430A 一种基于冲压框架带有通孔的扁平多芯片封装件 A flat multi-chip package with a hole punched framework based
07/16/2014CN103928418A 键合引线和用于产生键合连接的方法 A bonding wire and a method for producing a bonded connection
07/16/2014CN103928417A 一种低成本的圆片级csp封装方法及其封装结构 A low-cost method for wafer level encapsulation and packaging structure csp
07/16/2014CN103928416A 具有无源器件的半导体封装件及其堆叠方法 The semiconductor package having a passive device and stacking method
07/16/2014CN103928411A 芯片装置及其制造方法、集成电路及其制造方法 Chip device and its manufacturing method, an integrated circuit and its manufacturing method
07/16/2014CN103928410A 封装结构及其制作方法 Package structure and production methods
07/16/2014CN103928408A 功率半导体模块和用于制造功率半导体模块的方法 The method of manufacturing the power semiconductor module and a power semiconductor module
07/16/2014CN103928406A 阵列基板的制备方法、阵列基板、显示装置 The method for preparing the array substrate, the array substrate, a display device
07/16/2014CN103928405A 一种tft阵列基板的制造方法 A method of manufacturing an array substrate tft
07/16/2014CN103928404A 静态存储单元及其形成方法 Static memory cell and method of forming
07/16/2014CN103928403A 含应变硅层的半导体器件的形成方法 The method for forming the strained Si layer of a semiconductor device comprising
07/16/2014CN103928402A 共用栅极的半导体结构及对应的形成方法 The common gate of the semiconductor structure and a corresponding method of forming
07/16/2014CN103928401A 阵列基板及其制备方法、显示装置 Array substrate and its preparation method, a display device
07/16/2014CN103928400A 阵列基板及其制作方法、显示装置 Array substrate and method of manufacturing a display device
07/16/2014CN103928399A Tft阵列基板的制作方法、tft阵列基板以及显示装置 Tft array substrate manufacturing method, tft array substrate and a display device
07/16/2014CN103928398A 一种柔性显示面板及其制备方法、柔性显示装置 A flexible display panel and a preparation method, a flexible display device
07/16/2014CN103928397A 一种tft阵列基板及其制备方法和显示装置 One kind tft array substrate preparation method and display device
07/16/2014CN103928396A 扩大沟槽开口的方法 The method of expanding the trench opening
07/16/2014CN103928395A 三维叠层半导体装置及其制造方法 A three-dimensional stack of semiconductor device and manufacturing method
07/16/2014CN103928394A 金属互连结构的制作方法 Production method for a metal interconnect structure
07/16/2014CN103928393A 连接件及其制造方法 Connecting member and its manufacturing method
07/16/2014CN103928392A 局部互连结构的制作方法 The method of making a local interconnect structure
07/16/2014CN103928391A 半导体结构的形成方法 The method for forming a semiconductor structure
07/16/2014CN103928390A 互连结构的制作方法 The method of making an interconnect structure
07/16/2014CN103928389A 半导体结构的形成方法 The method for forming a semiconductor structure
07/16/2014CN103928388A 互连结构及其制造方法 Interconnection structure and its manufacturing method
07/16/2014CN103928387A 浅沟槽隔离结构的填充方法、半导体器件的制备方法 The method of filling shallow trench isolation structure, the semiconductor device production method
07/16/2014CN103928386A 一种浅沟槽隔离结构的制造方法 A method for manufacturing a shallow trench isolation structure
07/16/2014CN103928385A 浅沟槽隔离结构及其制备方法 Shallow trench isolation structure and preparation method
07/16/2014CN103928384A 半导体结构的形成方法和半导体结构 The method for forming a semiconductor structure and the semiconductor structure
07/16/2014CN103928383A 半导体结构的形成方法和半导体结构 The method for forming a semiconductor structure and the semiconductor structure
07/16/2014CN103928382A 基底支撑装置和使用该基底支撑装置的热处理装置 Substrate holding means and the support means of the use of the substrate heat treatment apparatus
07/16/2014CN103928381A 一种测量晶圆接触角的辅助工具 A wafer contact angle measurement aids
07/16/2014CN103928380A 一种利用辅助工具来测量晶圆接触角的方法 A use of an auxiliary tool to measure the contact angle of the wafer method
07/16/2014CN103928379A 基板装卸载单元及基板处理系统 Substrate loading and unloading unit and substrate processing system
07/16/2014CN103928378A 双层传片腔体 Double-pass piece cavity
07/16/2014CN103928377A 基板收纳处理装置和基板收纳处理方法以及基板收纳处理用存储介质 Accommodating the substrate processing apparatus and a substrate processing method and a substrate storage container with a storage medium processing
07/16/2014CN103928376A 树酯上料系统 Resin feeding system
07/16/2014CN103928375A 一种适用于大气压炉的新型石英舟 One for a new type of furnace atmospheres quartz boat
07/16/2014CN103928374A 用于制作传感器的自动化设备及制作传感器的方法 The method for making the sensor automation equipment and production sensors
07/16/2014CN103928373A 一种半导体热处理设备 A semiconductor heat treatment equipment
07/16/2014CN103928372A 一种抗腐蚀的晶圆清洗装置 An anti-corrosion wafer cleaning device
07/16/2014CN103928371A 一种湿法刻蚀设备 One kind of wet etching equipment
07/16/2014CN103928370A 用于多孔低k介质的紫外线照射装置和照射方法 An ultraviolet irradiation apparatus and irradiation method for the porous low-k dielectric
07/16/2014CN103928369A 磷化铟晶片退火盒 Indium phosphide wafer annealing box
07/16/2014CN103928368A 一种在线实时控制硅片背压的结构及方法 Structure and method for an on-line real-time control of silicon backpressure
07/16/2014CN103928367A 降低炉管工艺中Cu污染的炉管装置及其方法 Reduce pollution Cu tube furnace process tube apparatus and method
07/16/2014CN103928366A 基板握持装置 Substrate holding apparatus
07/16/2014CN103928365A 一个光罩内的单元芯片存在不同图像条件的缺陷扫描方法 A defective unit chip mask scanning methods exist within different image conditions
07/16/2014CN103928364A 一种用于检测共晶键合中合金化程度的结构 A eutectic alloy bonding structure for detecting the degree of
07/16/2014CN103928363A 一种硅片晶向检测方法及检测装置 Crystalline silicon wafers to the detection method and detection device
07/16/2014CN103928362A 监测氧化硅沉积工艺中硅损耗的方法 A silicon oxide deposition process to monitor the loss of silicon Method
07/16/2014CN103928361A 一种监测芯片保护区图案偏移的方法 A method of monitoring chip protection zone pattern offset method
07/16/2014CN103928360A 提高焊接垫性能的工艺 Improve process performance bond pads
07/16/2014CN103928359A 一种垂直碳纳米管阵列与金属基底键合的方法 A method of vertical carbon nanotube array is bonded to the metal substrate
07/16/2014CN103928358A 一种垂直碳纳米管阵列向金属衬底转移的方法 A method of vertical carbon nanotube arrays transferred to the metal substrate
07/16/2014CN103928357A 一种低应力自动焊接机的压盖装配机构 A low stress automatic welding machines gland assembly facility
07/16/2014CN103928356A 一种低应力自动焊接机的组合装配机构 A low stress automatic welding machines and assembled bodies
07/16/2014CN103928355A 一种大功率半导体模块混合封装结构及其方法 Power Hybrid semiconductor module package structure and method
07/16/2014CN103928354A 一种半导体芯片粘接方法 A method of bonding a semiconductor chip
07/16/2014CN103928353A 无外引脚封装构造及其制造方法与导线框架 No external pin package and method for manufacturing the wire frame
07/16/2014CN103928352A 用于制作半导体芯片面板的方法 The method for fabricating a semiconductor chip panel
07/16/2014CN103928351A 半导体引线框架生产工艺 The semiconductor lead frame production process
07/16/2014CN103928350A 一种双沟道层薄膜晶体管的制备方法 Preparation method of double channel thin film transistor
07/16/2014CN103928349A 鳍式场效晶体管中栅极的分离方法 A fin field effect transistor gate separation method
07/16/2014CN103928348A 双栅极的分离方法 Method for separating a double-gate
07/16/2014CN103928347A 改善finFET鳍结构表面氧化层形貌的方法 Methods to improve the structure of the surface oxide layer finFET fin morphology
07/16/2014CN103928346A 外延生长形成n型重掺杂漂移层台面的umosfet器件制备方法 Heavily doped n-type drift layer mesa preparation umosfet device epitaxial growth
07/16/2014CN103928345A 离子注入形成n型重掺杂漂移层台面的碳化硅umosfet器件制备方法 Formed by ion implantation n-type heavily doped drift layer mesa device production method of silicon carbide umosfet
07/16/2014CN103928344A 一种基于N型纳米薄层来提高N型DiMOSFET沟道迁移率方法 Based on the N-type nano-thin layer to improve the mobility of the N-channel method DiMOSFET
07/16/2014CN103928343A 薄膜晶体管及有机发光二极管显示器制备方法 A thin film transistor and an organic light emitting diode display Preparation
07/16/2014CN103928342A 一种硅纳米线隧穿场效应晶体管及其制作方法 A silicone nanowire tunneling field effect transistor and manufacturing method thereof
07/16/2014CN103928341A 能提高晶粒尺寸的多晶硅制造方法 Can increase the grain size of the polycrystalline silicon manufacturing method
07/16/2014CN103928340A 一种直接生长二维的二硫化钼背栅器件的方法 A direct two-dimensional growth of the back-gate device molybdenum disulfide method
07/16/2014CN103928339A SiGe PMOS半导体器件的制作方法 SiGe PMOS semiconductor device production method of
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