Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2011
01/18/2011US7871904 Wafer processing method for improving gettering capabilities of wafers made therefrom
01/18/2011US7871903 Method and system for high-speed, precise micromachining an array of devices
01/18/2011US7871902 Crack stop trenches
01/18/2011US7871901 Manufacturing method for semiconductor chips
01/18/2011US7871900 Quality of a thin layer through high-temperature thermal annealing
01/18/2011US7871899 Methods of forming back side layers for thinned wafers
01/18/2011US7871898 Method for low temperature bonding and bonded structure
01/18/2011US7871897 Method of forming shallow trench isolation regions in devices with NMOS and PMOS regions
01/18/2011US7871896 Precision trench formation through oxide region formation for a semiconductor device
01/18/2011US7871895 Method and structure for relieving transistor performance degradation due to shallow trench isolation induced stress
01/18/2011US7871894 Process for manufacturing thick suspended structures of semiconductor material
01/18/2011US7871893 Method for non-selective shallow trench isolation reactive ion etch for patterning hybrid-oriented devices compatible with high-performance highly-integrated logic devices
01/18/2011US7871892 Method for fabricating buried capacitor structure
01/18/2011US7871891 Method of manufacturing semiconductor devices including capacitor support pads
01/18/2011US7871890 Methods of fabricating semiconductor devices having resistors
01/18/2011US7871887 Semiconductor device with reduced resistance of bit lines and method for manufacturing the same
01/18/2011US7871886 Nanocrystal memory with differential energy bands and method of formation
01/18/2011US7871885 Manufacturing method of flash memory device
01/18/2011US7871884 Manufacturing method of dynamic random access memory
01/18/2011US7871883 Method of manufacturing semiconductor device includes the step of depositing the capacitor insulating film in a form of a hafnium silicate
01/18/2011US7871882 Method of fabricating a deep trench insulated gate bipolar transistor
01/18/2011US7871881 Method for fabrication of a capacitor, and a monolithically integrated circuit comprising such a capacitor
01/18/2011US7871880 Method for manufacturing electronic devices integrated in a semiconductor substrate and corresponding devices
01/18/2011US7871879 Method of manufacturing semiconductor memory device
01/18/2011US7871878 Method of fabricating PMOS and NMOS transistor on the same substrate
01/18/2011US7871877 Technique for strain engineering in silicon-based transistors by using implantation techniques for forming a strain-inducing layer under the channel region
01/18/2011US7871876 Method of forming a dual-plane complementary metal oxide semiconductor
01/18/2011US7871875 Fin field effect transistor and method of manufacturing the same
01/18/2011US7871874 Transistor of semiconductor device and method of fabricating the same
01/18/2011US7871873 Method of forming fin structures using a sacrificial etch stop layer on bulk semiconductor material
01/18/2011US7871872 Method of manufacturing thin film transistor having lightly doped drain regions
01/18/2011US7871871 Manufacturing method for semiconductor integrated circuit device
01/18/2011US7871870 Method of fabricating gate configurations for an improved contacts in nanowire based electronic devices
01/18/2011US7871869 Extremely-thin silicon-on-insulator transistor with raised source/drain
01/18/2011US7871868 LCD TFT array plate and fabricating method thereof
01/18/2011US7871867 Semiconductor device and method of manufacturing the same
01/18/2011US7871866 Method of manufacturing semiconductor device having transition metal oxide layer and related device
01/18/2011US7871865 Stress free package and laminate-based isolator package
01/18/2011US7871863 Integrated circuit package system with multiple molding
01/18/2011US7871862 Ball grid array package stacking system
01/18/2011US7871861 Stacked integrated circuit package system with intra-stack encapsulation
01/18/2011US7871860 Method of semiconductor packaging
01/18/2011US7871859 Vertical surface mount assembly and methods
01/18/2011US7871858 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
01/18/2011US7871857 Methods of forming multi-chip semiconductor substrates
01/18/2011US7871856 Method and apparatus for manufacturing stacked-type semiconductor device
01/18/2011US7871854 Method of making a vertical photodetector
01/18/2011US7871853 Plasma doping method and apparatus employed in the same
01/18/2011US7871852 Method for fabricating carbon-enriched film
01/18/2011US7871851 Method for integrating nanotube devices with CMOS for RF/analog SoC applications
01/18/2011US7871850 Light emitting device and manufacturing method thereof
01/18/2011US7871849 Method for manufacturing photoelectric conversion device
01/18/2011US7871848 Semiconductor power module package without temperature sensor mounted thereon and method of fabricating the same
01/18/2011US7871847 System and method for high temperature compact thermoelectric generator (TEG) device construction
01/18/2011US7871846 Thin-film transistor, TFT-array substrate, liquid-crystal display device and method of fabricating the same
01/18/2011US7871845 Nitride-based semiconductor light emitting device and method of manufacturing the same
01/18/2011US7871843 Method of preparing light emitting device
01/18/2011US7871842 Production process for surface-mounting ceramic LED package, surface-mounting ceramic LED package produced by said production process, and mold for producing said package
01/18/2011US7871841 Method for manufacturing semiconductor light-emitting device
01/18/2011US7871840 Method for manufacturing semiconductor optical device using inductive coupled plasma-enhance CVD
01/18/2011US7871839 Light emitting element with a plurality of cells bonded, method of manufacturing the same, and light emitting device using the same
01/18/2011US7871838 Rubbing system for alignment layer of LCD and method thereof
01/18/2011US7871837 Display panel manufacturing method
01/18/2011US7871836 Method of manufacturing bendable solid state lighting
01/18/2011US7871835 Method for packaging light-emitting diode
01/18/2011US7871834 Combined semiconductor apparatus with thin semiconductor films
01/18/2011US7871833 Determining chip separation by comparing coupling capacitances
01/18/2011US7871832 Generating an integrated circuit identifier
01/18/2011US7871831 Method for connecting flip chip components
01/18/2011US7871830 End point detection method for plasma etching of semiconductor wafers with low exposed area
01/18/2011US7871829 Metal wiring of semiconductor device and method of fabricating the same
01/18/2011US7871828 In-situ dose monitoring using optical emission spectroscopy
01/18/2011US7871751 Resist composition
01/18/2011US7871705 suitable for transferring flat panel displays without energy absorption; metal film covering the top and bottom surfaces of the composite body and forming a reflective sruface; a glass fiber epoxy resin forming a layer on the metal film covering top and bottom surfaces of the body
01/18/2011US7871677 photo-excitation with ultraviolet radiation from low pressure mercury lamp; cost efficiency
01/18/2011US7871676 Activation energy from impinging high energy ion flux; kinetic energy rather than thermal energy drives the reaction of gases; plasma power modulation or wafer bias; low temperature; higher density, superior purity and adhesion
01/18/2011US7871543 Material for a functional layer of an organic electronic component, method for the production thereof, and use thereof
01/18/2011US7871536 stabilized cyclic alkene composition comprising cyclic alkenes and antioxidant compound to reduce or eliminate residue formation upon evaporation of such compositions; used to form dielectric films
01/18/2011US7871530 Near-field optical probe based on SOI substrate and fabrication method thereof
01/18/2011US7871505 Sputtering target transport box
01/18/2011US7871490 Inductively coupled plasma generation system with a parallel antenna array having evenly distributed power input and ground nodes and improved field distribution
01/18/2011US7871471 Substrate processing apparatus inspection method and method for reducing quantity of particles on substrate
01/18/2011US7871470 Substrate support lift mechanism
01/18/2011US7871308 Abrasive, method of polishing target member and process for producing semiconductor device
01/18/2011US7871236 Automated paper turner for work and turn printing operation
01/18/2011US7871211 Coating and developing system, coating and developing method and storage medium
01/18/2011US7871171 Focusing-device for the radiation from a light source
01/13/2011WO2011006146A2 Substantially rigid collapsible liner and flexible gusseted or non-gusseted liners and methods of manufacturing the same and methods for limiting choke-off in liners
01/13/2011WO2011005895A1 Aluminum porous media
01/13/2011WO2011005620A2 Tunable gas flow equalizer
01/13/2011WO2011005484A2 High speed low power magnetic devices based on current induced spin-momentum transfer
01/13/2011WO2011005456A2 Cmp compositions and methods for suppressing polysilicon removal rates
01/13/2011WO2011005445A1 Applying chiplets to substrates
01/13/2011WO2011005444A1 Gallium nitride for liquid crystal electrodes
01/13/2011WO2011005433A2 Boron film interface engineering
01/13/2011WO2011005389A2 Methods of utilizing block copolymer to form patterns
01/13/2011WO2011005284A2 Encapsulated phase change cell structures and methods
01/13/2011WO2011005256A1 Printhead fabrication methods and printheads
01/13/2011WO2011005255A1 Printhead fabrication methods, printhead substrate assembly fabrication methods, and printheads
01/13/2011WO2011005057A2 Vacuum dryer and drying method using the same