Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2011
01/19/2011CN101952942A Apparatus for measuring beam characteristics and a method thereof
01/19/2011CN101952941A Plasma processing apparatus and plasma processing method
01/19/2011CN101952940A Apparatus and method for processing substrate
01/19/2011CN101952939A Apparatus and method for processing substrate
01/19/2011CN101952938A Apparatus and method for processing substrate
01/19/2011CN101952937A Semiconductor substrate, semiconductor substrate manufacturing method, and electronic device
01/19/2011CN101952936A Dual-layer light-sensitive developer-soluble bottom anti-reflective coatings for 193-nm lithography
01/19/2011CN101952935A Vacuum processing device, method for maintaining vacuum processing device and vacuum processing factory
01/19/2011CN101952934A Semiconductor substrate surface preparation method
01/19/2011CN101952933A Apparatus and methods for supplying fuel employed by abatement systems to effectively abate effluents
01/19/2011CN101952778A Photosensitive resin laminate
01/19/2011CN101952772A Active matrix substrate, liquid crystal panel, television receiver, and liquid crystal panel manufacturing method
01/19/2011CN101952485A Etching solution composition
01/19/2011CN101952193A Microfluidic device and methods of operation and making
01/19/2011CN101951802A Object comprising a graphics element transferred onto a support wafer and method of producing such an object
01/19/2011CN101950760A High-voltage VDMOS (Vertical Double-diffused Metal Oxide Semiconductor) device structure and manufacturing method thereof
01/19/2011CN101950758A Grid structure of high-K material based on silicon-on-insulator (SOI) substrate and preparation method thereof
01/19/2011CN101950757A High dielectric constant material grid structure based on SOI substrate and preparation method thereof
01/19/2011CN101950756A N-type field effect transistor, its metal gate and its manufacturing method
01/19/2011CN101950751A Image sensor and encapsulating method thereof
01/19/2011CN101950748A Semiconductor device and method for manufacturing the same
01/19/2011CN101950747A CMOS (Complementary Metal Oxide Semiconductors) semiconductor integrated circuit with high irradiation resistance and preparation method thereof
01/19/2011CN101950745A Semiconductor packaging structure and producing method thereof
01/19/2011CN101950743A Suppressing fractures in diced integrated circuits
01/19/2011CN101950741A Method for producing chip electrode multilevel interconnection structure
01/19/2011CN101950740A 半导体装置及其制造方法 Semiconductor device and manufacturing method
01/19/2011CN101950738A 集成电路结构 Integrated circuit structure
01/19/2011CN101950737A Production method of P-type silicon substrate back metallization
01/19/2011CN101950736A Surface-mounted silicon chip
01/19/2011CN101950735A High voltage device
01/19/2011CN101950734A Method of producing light emitting apparatus
01/19/2011CN101950733A Manufacturing method of pixel structure and manufacturing method of organic light-emitting component
01/19/2011CN101950732A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
01/19/2011CN101950731A Common line structure, display panel and manufacturing method thereof
01/19/2011CN101950730A STI structure and method of forming bottom void in same
01/19/2011CN101950729A Wafer level packaging of electronic component and manufacturing method thereof
01/19/2011CN101950728A Metal pillar bump structure and method of forming same
01/19/2011CN101950727A System and method for reducing inductance on integrated circuit
01/19/2011CN101950726A First-coating last-etching single package method for positively packaging double-sided graphic chip
01/19/2011CN101950725A Automatic packing equipment control system
01/19/2011CN101950724A Thyristor pressing mechanism for direct current power transmission converter valve
01/19/2011CN101950723A Method for manufacturing SOI MOS device capable of realizing ohmic contact with source body
01/19/2011CN101950722A Method for manufacturing microwave power device by using double level polysilicon device structure
01/19/2011CN101950721A Surface treatment method
01/19/2011CN101950720A Excessive round-hole shielded gate trench (SGT) MOSFET devices and manufacturing processes
01/19/2011CN101950719A Self-assembly pattern for semiconductor integrated circuit
01/19/2011CN101950131A Photomask processor and device producing method
01/19/2011CN101950125A Method of manufacturing a photomask
01/19/2011CN101950112A 液晶显示面板及其制造方法 The method of manufacturing a liquid crystal display panel and
01/19/2011CN101950102A Low-cost large-screen wide-angle fast-response liquid crystal display apparatus
01/19/2011CN101949058A Group III nitride semiconductor free-standing substrate and method of manufacturing the same, group III nitride semiconductor device and method of manufacturing the same
01/19/2011CN101949008A Carrier plate, method for performing deposition processing by using carrier plate, and plasma deposition processing equipment
01/19/2011CN101947526A Megasonic precision cleaning of semiconductor process equipment components and parts
01/19/2011CN101947525A Megasonic precision cleaning of semiconductor process equipment components and parts
01/19/2011CN101692431B Turning device
01/19/2011CN101667568B Preparation method of refrigeration structure for three-dimensional encapsulation of micro-electronics
01/19/2011CN101661938B Novel CMOS integrated circuit resisting total dose radiation
01/19/2011CN101635311B Multi-threshold field MOSFET and multi-threshold field MOSFET unit
01/19/2011CN101625981B High pixel density LED display module and preparation method thereof
01/19/2011CN101611485B Mounting apparatus for electronic part
01/19/2011CN101592834B Method for preparing nano-silicon thin film transistor liquid crystal display
01/19/2011CN101582389B Flexible expansion link mechanism
01/19/2011CN101578689B Structures and methods for forming shielded gate field effect transistors
01/19/2011CN101552218B Process for manufacturing semiconductor device and semiconductor device manufactured by such process
01/19/2011CN101533855B Insulated gate semiconductor device and method for manufacturing the same
01/19/2011CN101533776B Method for fabricating semiconductor memory device
01/19/2011CN101527281B Active element array substrate and method for manufacturing same
01/19/2011CN101499408B Substrate processing apparatus and substrate processing method
01/19/2011CN101498940B Method and apparatus for protecting bottom electrode component in plasma etching equipment
01/19/2011CN101477977B Wafer stage encapsulation structure and lead pad electric signal leading process
01/19/2011CN101477945B Method and apparatus for preventing/reducing substrate back polymer deposition
01/19/2011CN101471366B Image sensor and method for manufacturing the sensor
01/19/2011CN101471353B Image sensor and method for manufacturing the sensor
01/19/2011CN101461067B Semiconductor field-effect transistor, memory cell and memory device
01/19/2011CN101454875B Semiconductor on insulator structure made using radiation annealing
01/19/2011CN101447458B Hard mask patterns of a semiconductor device and a method for forming the same
01/19/2011CN101442028B Method for manufacturing planar display
01/19/2011CN101442000B Crystallizing method for the semiconductor thin film
01/19/2011CN101432898B Semiconductor light emitting element and wafer
01/19/2011CN101431053B Electroluminescence element forming method
01/19/2011CN101431009B Shower plate and substrate processing apparatus
01/19/2011CN101427359B Work clamp and wire bonding device
01/19/2011CN101414162B Fluid flow distribution and supply unit and flow distribution control program
01/19/2011CN101410957B High aspect ratio contacts
01/19/2011CN101409255B Method for forming double-mosaic pattern of semiconductor device
01/19/2011CN101399280B Image sensor and method for manufacturing the same
01/19/2011CN101383299B Wafer level package of electronic element and manufacturing method thereof
01/19/2011CN101373721B Method for making IC structure and method for processing inner-inserting plate wafer
01/19/2011CN101359619B Interconnecting process
01/19/2011CN101359608B Integrate circuit packaging, forming method thereof and structure of wafer-level ball integrate circuit packaging
01/19/2011CN101350302B GaN基板 GaN substrates
01/19/2011CN101340058B Nitride semiconductor stacked structure and semiconductor optical device, and methods for manufacturing the same
01/19/2011CN101335330B Memory device with tungsten compound memory unit and processing method thereof
01/19/2011CN101329998B Semiconductor treating device
01/19/2011CN101320710B Lateral DMOS device structure and fabrication method therefor
01/19/2011CN101320681B Methods for forming capacitor structures
01/19/2011CN101312211B Semiconductor device and its manufacture method
01/19/2011CN101308862B Image sensor and method for manufacturing the same
01/19/2011CN101304029B Semiconductor device and manufacturing method thereof
01/19/2011CN101276814B Semiconductor device and method of manufacturing the same