| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/06/2011 | WO2011001583A1 Device and method for mounting electronic components |
| 01/06/2011 | WO2011001560A1 Semiconductor memory device |
| 01/06/2011 | WO2011001558A1 Semiconductor device and method of producing same |
| 01/06/2011 | WO2011001520A1 Semiconductor device and method for manufacturing same |
| 01/06/2011 | WO2011001499A1 Electronic part manufacturing method and electronic part manufactured by the method |
| 01/06/2011 | WO2011001494A1 Semiconductor device and manufacturing method thereof |
| 01/06/2011 | WO2011001240A1 Graphene device and method of fabricating a graphene device |
| 01/06/2011 | WO2011001007A1 Manufacturing of electronic components |
| 01/06/2011 | WO2011000923A1 Method for creating a crystalline area of metal, in particular in an integrated circuit |
| 01/06/2011 | WO2011000899A1 Method for modifying the crystalline structure of a copper element |
| 01/06/2011 | WO2011000758A1 Aqueous alkaline cleaning compositions and methods of their use |
| 01/06/2011 | WO2011000694A1 Aqueous alkaline cleaning compositions and methods of their use |
| 01/06/2011 | WO2011000689A1 Image-compensating addressable electrostatic chuck system |
| 01/06/2011 | WO2011000597A1 Method for producing an electronic component |
| 01/06/2011 | WO2011000544A1 Crystalline silicon layer on a substrate, method for the production thereof, and use thereof |
| 01/06/2011 | WO2011000442A1 Substrate processing system |
| 01/06/2011 | WO2010126232A3 Resistance-variable memory device and a production method therefor |
| 01/06/2011 | WO2010120784A8 Chemical mechanical polishing of silicon carbide comprising surfaces |
| 01/06/2011 | WO2010116698A3 Method of manufacturing semiconductor chip |
| 01/06/2011 | WO2010110990A3 Force reaction compensation system |
| 01/06/2011 | WO2010110987A3 Methods of forming patterns on substrates |
| 01/06/2011 | WO2010110551A3 Chemical vapor deposition reactor for preparation of polysilicon |
| 01/06/2011 | WO2010107571A3 Apparatus and methods for improving parallel conduction in a quantum well device |
| 01/06/2011 | WO2010104758A3 Methods for forming three-dimensional memory devices, and related structures |
| 01/06/2011 | WO2010104744A3 Electronic devices formed of two or more substrates bonded together, electronic systems comprising electronic devices and methods of making electronic devices |
| 01/06/2011 | WO2010102125A3 Inductively coupled plasma reactor having rf phase control and methods of use thereof |
| 01/06/2011 | WO2010101756A3 Web substrate deposition system |
| 01/06/2011 | WO2010099455A3 Glass substrate orientation inspection methods and systems for photo voltaics production |
| 01/06/2011 | WO2010099350A3 Low cost bonding technique for integrated circuit chips and pdms structures |
| 01/06/2011 | WO2010099216A3 Methods for fabrication of high aspect ratio micropillars and nanopillars |
| 01/06/2011 | WO2009099776A9 Closed loop mocvd deposition control |
| 01/06/2011 | WO2009014858A9 Method and apparatus for selectively patterning free standing quantom dot (fsqdt) polymer composites |
| 01/06/2011 | US20110003537 Polishing apparatus and polishing method |
| 01/06/2011 | US20110003485 Optical Cavity Furnace for Semiconductor Wafer Processing |
| 01/06/2011 | US20110003484 Mask for crystallizing silicon, apparatus having the mask and method of crystallizing with the mask |
| 01/06/2011 | US20110003483 Glass plate for display panels, process for producing it, and process for producing tft panel |
| 01/06/2011 | US20110003482 Method of manufacturing semiconductor device and substrate processing system |
| 01/06/2011 | US20110003481 Method for manufacturing a semiconductor device |
| 01/06/2011 | US20110003480 Silsesquioxane Resins |
| 01/06/2011 | US20110003479 Methods of making self-aligned nano-structures |
| 01/06/2011 | US20110003478 Polymer for organic anti-reflective coating layer and composition including the same |
| 01/06/2011 | US20110003477 Methods of forming a semiconductor device including a metal silicon nitride layer |
| 01/06/2011 | US20110003476 Methods of forming semiconductor devices including landing pads formed by electroless plating |
| 01/06/2011 | US20110003475 Semiconductor device and method for manufacturing the same |
| 01/06/2011 | US20110003474 Germanium-Containing Dielectric Barrier for Low-K Process |
| 01/06/2011 | US20110003473 Structure for metal cap applications |
| 01/06/2011 | US20110003472 Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package |
| 01/06/2011 | US20110003471 Fabrication of interconnects in a low-k interlayer dielectrics |
| 01/06/2011 | US20110003470 Methods and structures for a vertical pillar interconnect |
| 01/06/2011 | US20110003469 Methods Of Forming Memory Cells; And Methods Of Forming Vertical Structures |
| 01/06/2011 | US20110003468 Method for fabricating semiconductor device with buried gates |
| 01/06/2011 | US20110003467 Method of manufacturing semiconductor device |
| 01/06/2011 | US20110003466 Methods of forming a multi-doped junction with porous silicon |
| 01/06/2011 | US20110003465 Methods of forming a multi-doped junction with silicon-containing particles |
| 01/06/2011 | US20110003464 Methods of using a silicon nanoparticle fluid to control in situ a set of dopant diffusion profiles |
| 01/06/2011 | US20110003463 Doping method |
| 01/06/2011 | US20110003462 Method for manufacturing soi wafer |
| 01/06/2011 | US20110003461 Method for manufacturing semiconductor substrate and method for manufacturing semiconductor device |
| 01/06/2011 | US20110003460 Method for treating surface of soi substrate |
| 01/06/2011 | US20110003459 Method for fabricating buried gate using pre landing plugs |
| 01/06/2011 | US20110003458 Method of forming device isolation layer and method of fabricating semiconductor device |
| 01/06/2011 | US20110003457 Semiconductor component with trench insulation and corresponding production method |
| 01/06/2011 | US20110003456 Silicon carbide and related wide-bandgap transistors on semi insulating epitaxy |
| 01/06/2011 | US20110003455 Methods for fabricating improved gate dielectrics |
| 01/06/2011 | US20110003454 Lateral phase change memory |
| 01/06/2011 | US20110003453 Manufacturing method of capacitor in semiconductor |
| 01/06/2011 | US20110003452 HIGH-k CAPPED BLOCKING DIELECTRIC BANDGAP ENGINEERED SONOS AND MONOS |
| 01/06/2011 | US20110003451 Intermediate product for a multichannel fet and process for obtaining an intermediate product |
| 01/06/2011 | US20110003450 Method for manufacturing semicondutor device with strained channel |
| 01/06/2011 | US20110003449 Power Device With Trenches Having Wider Upper Portion Than Lower Portion |
| 01/06/2011 | US20110003448 Method for fabricating semiconductor device having vertical-type channel |
| 01/06/2011 | US20110003447 Method for fabricating semiconductor device with vertical transistor |
| 01/06/2011 | US20110003446 Semiconductor Device and Method for Manufacturing the Same |
| 01/06/2011 | US20110003445 Manufacturing method of semiconductor device |
| 01/06/2011 | US20110003444 Process of forming an electronic device including insulating layers having different strains |
| 01/06/2011 | US20110003443 Method for producing a transistor with metallic source and drain |
| 01/06/2011 | US20110003442 Method for manufacturing flexible semiconductor device |
| 01/06/2011 | US20110003441 Light activated silicon controlled switch |
| 01/06/2011 | US20110003440 Method of manufacturing a semiconductor device |
| 01/06/2011 | US20110003439 Semiconductor device package having features formed by electroplating |
| 01/06/2011 | US20110003438 Three-dimensional integrated circuit structure |
| 01/06/2011 | US20110003437 Method of making a semiconductor chip assembly with a post/base/flange heat spreader and a cavity in the flange |
| 01/06/2011 | US20110003436 Placement Method of an Electronic Module on a Substrate |
| 01/06/2011 | US20110003435 Electromagnetic shield formation for integrated circuit die package |
| 01/06/2011 | US20110003434 Semiconductor chip package structure for achieving face-up electrical connection without using a wire-bonding process and method for making the same |
| 01/06/2011 | US20110003433 Manufacturing method of semiconductor device |
| 01/06/2011 | US20110003432 Flip chip mlp with folded heat sink |
| 01/06/2011 | US20110003431 Method of die rearrangement package structure having patterned under bump metallurgic layer connecting metal lead |
| 01/06/2011 | US20110003430 Manufacturing method of semiconductor device |
| 01/06/2011 | US20110003429 Method for manufacturing semiconductor device |
| 01/06/2011 | US20110003428 Method for manufacturing semiconductor device |
| 01/06/2011 | US20110003427 Method for manufacturing semiconductor device |
| 01/06/2011 | US20110003422 Method of forming monolithic cmos-mems hybrid integrated, packaged structures |
| 01/06/2011 | US20110003421 Method of forming monolithic cmos-mems hybrid integrated, packaged structures |
| 01/06/2011 | US20110003420 Fabrication method of gallium nitride-based compound semiconductor |
| 01/06/2011 | US20110003417 Active matrix substrate, method of making the substrate, and display device |
| 01/06/2011 | US20110003413 Manufacturing method of semiconductor photonic device substrate |
| 01/06/2011 | US20110003405 Surface Micromachining Process of MEMS Ink Jet Drop Ejectors On Glass Substrates |
| 01/06/2011 | US20110003404 Dry high potential tester and solar simulator tool |
| 01/06/2011 | US20110003403 Testing method of surface-emitting laser device and testing device thereof |