Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2011
01/25/2011US7875544 Method of producing a semiconductor interconnect architecture including generation of metal holes by via mutation
01/25/2011US7875543 Strain-silicon CMOS using etch-stop layer and method of manufacture
01/25/2011US7875542 Methods for forming wiring and manufacturing thin film transistor and droplet discharging method
01/25/2011US7875541 Shallow source MOSFET
01/25/2011US7875540 Method for manufacturing recess gate in a semiconductor device
01/25/2011US7875539 Semiconductor device
01/25/2011US7875538 Semiconductor device having schottky junction and method for manufacturing the same
01/25/2011US7875537 High temperature ion implantation of nitride based HEMTs
01/25/2011US7875536 Nanostructures formed of branched nanowhiskers and methods of producing the same
01/25/2011US7875535 Compound semiconductor device using SiC substrate and its manufacture
01/25/2011US7875534 Realizing N-face III-nitride semiconductors by nitridation treatment
01/25/2011US7875533 Package-integrated thin film LED
01/25/2011US7875532 Substrate for manufacturing semiconductor device and manufacturing method thereof
01/25/2011US7875531 Method for the production of thin substrates
01/25/2011US7875530 Method for manufacturing semiconductor device
01/25/2011US7875529 Semiconductor devices
01/25/2011US7875528 Method, system, program product for bonding two circuitry-including substrates and related stage
01/25/2011US7875527 Manufacturing method for semiconductor device and semiconductor device
01/25/2011US7875526 Semiconductor device with contact stabilization between contact plugs and BIT lines and method for manufacturing the same
01/25/2011US7875525 Method of manufacturing stack-type capacitor and semiconductor memory device having the stack-type capacitor
01/25/2011US7875524 Method of fabricating an inductor for a semiconductor device
01/25/2011US7875523 HBT with emitter electrode having planar side walls
01/25/2011US7875522 Silicon compatible integrated light communicator
01/25/2011US7875521 Semiconductor device and production method thereof
01/25/2011US7875520 Method of forming CMOS transistor
01/25/2011US7875519 Metal gate structure and method of manufacturing same
01/25/2011US7875518 Semiconductor device having silicon layer in a gate electrode
01/25/2011US7875517 Self-aligned complementary LDMOS
01/25/2011US7875516 Integrated circuit including a first gate stack and a second gate stack and a method of manufacturing
01/25/2011US7875515 Method for manufacturing capacitor of semiconductor device
01/25/2011US7875514 Technique for compensating for a difference in deposition behavior in an interlayer dielectric material
01/25/2011US7875513 Self-aligned bipolar junction transistors
01/25/2011US7875512 Method for manufacturing semiconductor device
01/25/2011US7875511 CMOS structure including differential channel stressing layer compositions
01/25/2011US7875510 Thin-film device, method for manufacturing the same, and electronic apparatus
01/25/2011US7875509 Manufacturing method of semiconductor apparatus and semiconductor apparatus, power converter using the same
01/25/2011US7875508 Semiconductor device and method for manufacturing the same
01/25/2011US7875506 Etching method and manufacturing method of semiconductor device
01/25/2011US7875505 Multi-die semiconductor package structure and method for manufacturing the same
01/25/2011US7875504 Method of adhering wire bond loops to reduce loop height
01/25/2011US7875503 Reducing underfill keep out zone on substrate used in electronic device processing
01/25/2011US7875502 Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners
01/25/2011US7875501 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure
01/25/2011US7875500 Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support
01/25/2011US7875499 Method of manufacturing a stacked semiconductor apparatus
01/25/2011US7875498 Chip module for complete power train
01/25/2011US7875497 Method of manufacturing a semiconductor package
01/25/2011US7875496 Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body
01/25/2011US7875495 Standoff height improvement for bumping technology using solder resist
01/25/2011US7875494 Semiconductor device and manufacturing method thereof
01/25/2011US7875493 Memory structure with reduced-size memory element between memory material portions
01/25/2011US7875492 Integrated circuit including a memory fabricated using self-aligned processing
01/25/2011US7875491 CMOS image sensors and methods of manufacturing the same
01/25/2011US7875490 Image sensor and method for manufacturing the same
01/25/2011US7875489 CMOS image sensor and fabricating method thereof
01/25/2011US7875488 Method of fabricating image sensor having inner lens
01/25/2011US7875487 Passivation planarization
01/25/2011US7875486 Solar cells and methods and apparatuses for forming the same including I-layer and N-layer chamber cleaning
01/25/2011US7875485 Methods of fabricating MEMS devices having overlying support structures
01/25/2011US7875484 Monolithic IC and MEMS microfabrication process
01/25/2011US7875483 Manufacturing method of microelectromechanical system
01/25/2011US7875482 Substrate with multiple encapsulated pressures
01/25/2011US7875481 Semiconductor apparatus and method for manufacturing the same
01/25/2011US7875480 Sensor and method for making the same
01/25/2011US7875479 Integration structure of semiconductor circuit and microprobe sensing elements and method for fabricating the same
01/25/2011US7875478 Method for controlling color contrast of a multi-wavelength light-emitting diode
01/25/2011US7875477 Manufacturing method of liquid crystal display
01/25/2011US7875476 High power LED package and fabrication method thereof
01/25/2011US7875475 Flat panel display and method of fabricating the same
01/25/2011US7875474 Gallium nitride-based compound semiconductor light-emitting device and production method thereof
01/25/2011US7875473 Method of manufacturing light emitting diode device
01/25/2011US7875472 Method of manufacturing light emitting diode device
01/25/2011US7875471 Method of manufacturing light emitting diode device
01/25/2011US7875470 Method of forming buffer layer for nitride compound semiconductor light emitting device and nitride compound semiconductor light emitting device having the buffer layer
01/25/2011US7875469 Method of operating and process for fabricating an electron source
01/25/2011US7875468 Body to be plated, method of determining plated film thickness, and method of manufacturing semiconductor device
01/25/2011US7875420 after exposing and developing substrate, supplying solvent gas of treatment film to dissolve surface, supplying solvent gas (vapor of acetone); surface treatment; photoresists; photolithography; semiconductors
01/25/2011US7875419 Cleaning after doping or etching without leaving residue; decomposing photosensitizer with light exposure prior to nonaqueous solvent treatment
01/25/2011US7875418 Method for a multiple exposure, microlithography projection exposure installation and a projection system
01/25/2011US7875414 Cyclic structure formation method and surface treatment method
01/25/2011US7875409 Method of manufacturing semiconductor device, mask and semiconductor device
01/25/2011US7875406 photomasks; photolithography; semiconductors; integrated circuits
01/25/2011US7875317 Composition for forming insulating film, method for producing same, silica-based insulating film, and method for forming same
01/25/2011US7875230 Method of manipulating a sheet of thermoplastic material
01/25/2011US7875199 Radical generating method, etching method and apparatus for use in these methods
01/25/2011US7875197 Methods of etching articles via microcontact printing
01/25/2011US7875158 Plating apparatus
01/25/2011US7874894 Polishing pad
01/25/2011US7874783 Multi-chamber vacuum processing and transfer system
01/25/2011US7874782 Wafer transfer apparatus and substrate transfer apparatus
01/25/2011US7874781 Substrate processing apparatus
01/25/2011US7874066 Method of manufacturing a device-incorporated substrate
01/25/2011CA2500898C Method for forming thin film and apparatus therefor
01/25/2011CA2464832C Semiconductor liquid crystal composition and methods for making the same
01/25/2011CA2401187C Substrate having character/symbol section and processing method of character/symbol section
01/20/2011WO2011009093A2 A method of forming a group iii-nitride crystalline film on a patterned substrate by hydride vapor phase epitaxy (hvpe)
01/20/2011WO2011009063A1 Barrier layer on polymer passivation for integrated circuit packaging
01/20/2011WO2011009007A2 Improved lift pin guides
01/20/2011WO2011009002A2 Flow control features of cvd chambers
01/20/2011WO2011008943A2 Storage device temperature sensing