| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/30/2011 | DE102010063850A1 Verfahren zum Herstellen einer vergrabenen Materialschicht in einem Halbleiterkörper und Halbleiteranordnung mit einer vergrabenen Materialschicht A method of manufacturing a buried layer of material in a semiconductor body and the semiconductor device having a buried layer of material |
| 06/30/2011 | DE102010063806A1 Herstellungsverfahren für eine Halbleitervorrichtung Manufacturing method of a semiconductor device |
| 06/30/2011 | DE102010056020A1 Verfahren und Vorrichtung zum Ausbilden einer dielektrischen Schicht auf einem Substrat Method and apparatus for forming a dielectric layer on a substrate |
| 06/30/2011 | DE102010044157A1 Prüfkarte und Testvorrichtung Probe card and test device |
| 06/30/2011 | DE102010020900B3 Verfahren zur Herstellung von Leistungshalbleitersubstraten A process for producing power semiconductor substrates |
| 06/30/2011 | DE102010000092A1 Halbleiterpackage mit wedge-gebondetem Chip Semiconductor package with wedge-Bonded chip |
| 06/30/2011 | DE102009060931A1 Verfahren und Vorrichtung zur Behandlung von Siliziumsubstraten Method and apparatus for the treatment of silicon substrates |
| 06/30/2011 | DE102009060575A1 Method for separating silicon wafer from ingot, involves deactivating or releasing connection layer between wafer and carrier plate by directed electromagnetic energy input for separation of wafer from carrier plate |
| 06/30/2011 | DE102009060072A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation |
| 06/30/2011 | DE102009059937A1 Gripper for robot arm for contactless retaining silicon based wafer during manufacturing of solar cell of photovoltaic system, has suction point formed as central suction point and another suction point formed as auxiliary suction points |
| 06/30/2011 | DE102009059304A1 Electronic/optical component i.e. electronic sensor, for use as catheter for examining hollow organs of e.g. animals, has wedge-shaped nano-objects penetrated into insulation to mount electrical or optical conductor on component |
| 06/30/2011 | DE102009059303A1 Verfahren zur Herstellung eines elektronischen Bauteils und nach diesem Verfahren hergestelltes elektronisches Bauteil A method of manufacturing an electronic component and electronic component manufactured according to this method |
| 06/30/2011 | DE102009006884B4 Verfahren zur Herstellung eines Transistorbauelementes mit In-Situ erzeugten Drain- und Source-Gebieten mit einer verformungsinduzierenden Legierung und einem graduell variierenden Dotierstoffprofil und entsprechendes Transistorbauelement A method for producing a transistor component with in-situ generated drain and source regions with a strain-inducing alloy and a gradually varying doping profile and corresponding transistor device |
| 06/30/2011 | DE102008033410B4 Leistungselektronische Verbindungseinrichtung mit einem Leistungshalbleiterbauelement und Herstellungsverfahren hierzu Power electronic connection device with a power semiconductor device and manufacturing method therefor |
| 06/30/2011 | DE102006062831B4 Electronic component e.g. silicon controlled rectifier, manufacturing method, involves doping portion of body regions by introducing dopant atoms into portion through intermediate region formed between separate gate regions |
| 06/30/2011 | DE102006030645B4 Verfahren zum Behandeln eines Substrats beim Herstellen einer magnetoresistiven Speicherzelle A method for treating a substrate in manufacturing a magnetoresistive memory cell |
| 06/30/2011 | DE102005043913B4 Verfahren zur Herstellung einer dotierten Zone in einem Halbleiterkörper A process for producing a doped region in a semiconductor body |
| 06/30/2011 | CA2783211A1 Method and device for processing silicon substrates |
| 06/30/2011 | CA2776403A1 Silicon carbide substrate |
| 06/29/2011 | EP2339650A1 Production method for light emitting devices |
| 06/29/2011 | EP2339637A1 Power MOSFET device and method of making the same |
| 06/29/2011 | EP2339636A1 Power semiconductor device and manufacturing method |
| 06/29/2011 | EP2339634A2 GaN based FET and method for producing the same |
| 06/29/2011 | EP2339626A2 Semiconductor device and production method thereof |
| 06/29/2011 | EP2339622A1 Wirebonding Process |
| 06/29/2011 | EP2339621A2 Method for flattening a heat dissipating tube and device for performing the same |
| 06/29/2011 | EP2339618A2 Method for assembling at least one chip with a wired element, electronic chip with deformable connection element, method for manufacturing a plurality of chips and assembly of at least one chip with a wired element |
| 06/29/2011 | EP2339617A1 Method for producing a substrate for use in semiconductor processing |
| 06/29/2011 | EP2339616A1 Hybrid substrate with improved insulation and method for simplified production of a hybrid substrate |
| 06/29/2011 | EP2339615A1 Method for manufacturing a heterostructure with stress minimisation |
| 06/29/2011 | EP2339614A1 Method for stacking semiconductor chips |
| 06/29/2011 | EP2339613A1 Power semiconductor device and method for producing same |
| 06/29/2011 | EP2339612A1 Semiconductor processing component |
| 06/29/2011 | EP2339611A1 Wafer handler comprising a vision system |
| 06/29/2011 | EP2339331A1 Inspection and positioning systems and methods |
| 06/29/2011 | EP2339052A1 Silicon wafer and manufacturing method thereof |
| 06/29/2011 | EP2339049A1 Precursors for providing materials with low dielectric constant and superior integration attributes |
| 06/29/2011 | EP2338179A2 Method for the treatment of substrates, substrate and treatment device for carrying out said method |
| 06/29/2011 | EP2338177A1 Semiconductor device and method of manufacturing such a device |
| 06/29/2011 | EP2338175A1 Assembly of a grooved microelectronic chip with a toroidal wire element and method of assembling it |
| 06/29/2011 | EP2338172A1 Method of reducing voids in encapsulant |
| 06/29/2011 | EP2338171A1 Method for making via interconnection |
| 06/29/2011 | EP2338170A1 Improved wafer level chip scale packaging |
| 06/29/2011 | EP2338168A2 Method of making a split gate memory cell |
| 06/29/2011 | EP2338167A2 Support for a semiconductor wafer in a high temperature environment |
| 06/29/2011 | EP2338166A2 Method and apparatus for metal silicide formation |
| 06/29/2011 | EP2338165A1 Rapid thermal processing lamphead with improved cooling |
| 06/29/2011 | EP2338164A2 Wafer carrier with varying thermal resistance |
| 06/29/2011 | EP2338163A1 Improved metal-on-metal capacitor with diagonal feedline |
| 06/29/2011 | EP2338089A1 Positive photosensitive composition and pattern forming method using the same |
| 06/29/2011 | EP2337876A1 Film formation method, film formation device,piezoelectric film, piezoelectric device and liquid discharge device |
| 06/29/2011 | EP2206154B1 Trench gate MOSFET and method of manufacturing the same |
| 06/29/2011 | EP2200936B1 Silicon dioxide dispersion and process for coating substrates |
| 06/29/2011 | EP2191508B1 Liner for tungsten/silicon dioxide interface in memory |
| 06/29/2011 | EP2188407B1 Method for reducing porosity of a metal deposit by ionic bombardment |
| 06/29/2011 | EP2024990B1 Method of increasing the quality factor of an inductor in a semiconductor device |
| 06/29/2011 | EP1869697B1 Method for removing particles from a semiconductor surface |
| 06/29/2011 | EP1787322B1 A method for low temperature plasma-enhanced bonding |
| 06/29/2011 | EP1654752B1 Holder for supporting wafers during semiconductor manufacture |
| 06/29/2011 | EP1617966B1 Method of diffusion bonding a microchannel plate to a dielectric insulator ; diffusion bonded microchannel plate body assembly |
| 06/29/2011 | EP1500286B1 Temporal transition network protocol (ttnp) in a mobile ad hoc network |
| 06/29/2011 | EP1450153B1 Inspection device and inspection method for pattern profiles |
| 06/29/2011 | EP1396030B1 Vertical power semiconductor device and method of making the same |
| 06/29/2011 | EP1312114B1 Method of forming spacers in cmos devices |
| 06/29/2011 | EP1280193B1 Method of manufacturing integrated circuit, and substrate with integrated circuit formed by the method of manufacturing integrated circuit |
| 06/29/2011 | EP1226294B1 Methods of oxidizing multiwalled carbon nanotubes |
| 06/29/2011 | EP1166363B1 Trench dmos transistor structure having a low resistance path to a drain contact located on an upper surface |
| 06/29/2011 | CN201887047U N-type super-junction laterally double-diffused metal-oxide transistor |
| 06/29/2011 | CN201887034U Chip absorption device with chip turning function |
| 06/29/2011 | CN201887033U Jig and cleaning machine |
| 06/29/2011 | CN201887032U Connector of product encapsulation type inner lead bonding machine |
| 06/29/2011 | CN201887031U Device for adjusting position of glass substrate |
| 06/29/2011 | CN201887030U Quartz boat support |
| 06/29/2011 | CN201887029U Automatic silicon wafer charging system |
| 06/29/2011 | CN201887028U Unpacking clamp |
| 06/29/2011 | CN201887027U Semiconductor encapsulated product bur clearing device with metal detection function |
| 06/29/2011 | CN201887026U Burr removal device for semi-conductor encapsulation product |
| 06/29/2011 | CN201887025U Multi-row frame type scrap cut-off device |
| 06/29/2011 | CN201880705U Cleaning device for silicon chip |
| 06/29/2011 | CN1979833B Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device |
| 06/29/2011 | CN1956196B biCMOS device and method of manufacturing a biCMOS device |
| 06/29/2011 | CN1943020B Semiconductor oxidation apparatus |
| 06/29/2011 | CN1930927B A method of creating electronic packages |
| 06/29/2011 | CN1913128B Methods of forming dual-damascene metal wiring patterns for integrated circuit devices and wiring patterns formed thereby |
| 06/29/2011 | CN1841780B Thin film transistor, thin film transistor display panel, and manufacturing method thereof |
| 06/29/2011 | CN1835654B Wiring board and method of manufacturing the same |
| 06/29/2011 | CN1831192B Film formation method and apparatus for semiconductor process |
| 06/29/2011 | CN1777955B Methods for contracting conducting layers overlying magnetoelectronic elements of MRAM devices |
| 06/29/2011 | CN1577083B Stencil mask having main and auxiliary strut and method of forming the same |
| 06/29/2011 | CN102113423A 基板模块及其制造方法 Base module and its manufacturing method |
| 06/29/2011 | CN102113413A 装置的制造方法 Device manufacturing method |
| 06/29/2011 | CN102113140A Method for manufacturing iii nitride semiconductor light emitting element, iii nitride semiconductor light emitting element and lamp |
| 06/29/2011 | CN102113123A Method for texturing silicon surfaces and wafers thereof |
| 06/29/2011 | CN102113120A Hybrid dielectric material for thin film transistors |
| 06/29/2011 | CN102113115A Through wafer via and method of making same |
| 06/29/2011 | CN102113114A Complementary logical gate device |
| 06/29/2011 | CN102113113A Manufacturing method of dielectric thin-film capacitor and dielectric thin-film capacitor |
| 06/29/2011 | CN102113112A Method of making multiple implantations in a substrate |
| 06/29/2011 | CN102113111A Shallow trench isolation |
| 06/29/2011 | CN102113110A Semiconductor devices with extended active regions |