| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/24/2011 | CN102163590A Three-dimensional multi-chip encapsulation module based on buried substrate and method |
| 08/24/2011 | CN102163589A Wafer-level packaged device having self-assembled resilient leads |
| 08/24/2011 | CN102163588A Conductive pillar structure for semiconductor substrate and method of manufacture |
| 08/24/2011 | CN102163582A Chip package |
| 08/24/2011 | CN102163581A Semiconductor module |
| 08/24/2011 | CN102163580A Thin encapsulation body and manufacturing method thereof |
| 08/24/2011 | CN102163578A Semiconductor device, chip-on-chip mounting structure, method of manufacturing the semiconductor device, and method of forming the chip-on-chip mounting structure |
| 08/24/2011 | CN102163577A Semiconductor device and method of manufacturing semiconducter device |
| 08/24/2011 | CN102163576A Split-gate flash memory unit and manufacturing method thereof |
| 08/24/2011 | CN102163575A Display device and manufacturing method thereof |
| 08/24/2011 | CN102163574A Silicon-on-insulator device and manufacture method thereof |
| 08/24/2011 | CN102163573A Support structure, load lock apparatus, processing apparatus and transfer mechanism |
| 08/24/2011 | CN102163572A Six-degree-of-freedom locating device |
| 08/24/2011 | CN102163571A Substrate carrying device and substrate carrying method |
| 08/24/2011 | CN102163570A Substrate processing device and vacuum intake device |
| 08/24/2011 | CN102163569A Substrate conveyance device and substrate processing system |
| 08/24/2011 | CN102163568A Method for extracting charge distribution of metal oxide semiconductor (MOS) tube along channel |
| 08/24/2011 | CN102163567A Method and device for controlling end point of process |
| 08/24/2011 | CN102163566A Method for forming pad in wafer with three-dimensional stacking structure |
| 08/24/2011 | CN102163565A Chip welding device |
| 08/24/2011 | CN102163564A Bonded structure and manufacturing method for bonded structure |
| 08/24/2011 | CN102163563A Epoxy resin formulations for underfill applications |
| 08/24/2011 | CN102163562A Method for mounting power semiconductor element and synchronous buck converter |
| 08/24/2011 | CN102163561A Semiconductor device and method of forming tmv and tsv in wlcsp using same carrier |
| 08/24/2011 | CN102163560A Wireless communication device for remote authenticity verification of semiconductor chips, multi-chip modules and derivative products |
| 08/24/2011 | CN102163559A Temporary carrier bonding and detaching processes |
| 08/24/2011 | CN102163558A Method for manufacturing chip packaging structure |
| 08/24/2011 | CN102163557A Manufacturing method of semiconductor device |
| 08/24/2011 | CN102163556A Method for electric-lead-free electroplating by adopting buried circuit substrate |
| 08/24/2011 | CN102163555A Method for manufacturing multi-component films |
| 08/24/2011 | CN102163554A Method for manufacturing thin film transistor |
| 08/24/2011 | CN102163553A 薄膜晶体管及其制造方法 A thin film transistor and its manufacturing method |
| 08/24/2011 | CN102163552A Fabrication method for semiconductor device |
| 08/24/2011 | CN102163551A Reverse block-type insulated gate bipolar transistor manufacturing method |
| 08/24/2011 | CN102163550A Method for fabricating a semiconductor device |
| 08/24/2011 | CN102163549A Treating fluid for bad chip after crystalline silicon film coating and treating method thereof |
| 08/24/2011 | CN102163548A Method of fabricating semiconductor devices |
| 08/24/2011 | CN102163547A Method for depositing photoresist on microelectronic or photoelectronic chip |
| 08/24/2011 | CN102163546A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 08/24/2011 | CN102163545A Method for manufacturing micro-column array, array structure and method for growing crystalline material |
| 08/24/2011 | CN102163544A Package board carrying lath and mixing-preventing method thereof |
| 08/24/2011 | CN102163543A 蚀刻设备及其控制方法 Etching equipment and control method |
| 08/24/2011 | CN102163542A Single-chip method for thin-film electronic component and electronic component mounting adhesive thin sheet manufactured via the same |
| 08/24/2011 | CN102163541A Chip welding device |
| 08/24/2011 | CN102163540A Three-plate heating plate scanning device for annealing deep ultraviolet laser |
| 08/24/2011 | CN102163539A Device and method for processing substrate |
| 08/24/2011 | CN102163538A Multi inductively coupled plasma reactor and method thereof |
| 08/24/2011 | CN102163537A Method for recycling abandoned chip unit |
| 08/24/2011 | CN102163530A Plasma processing apparatus |
| 08/24/2011 | CN102163005A Exposure apparatus, device producing method, and optical component |
| 08/24/2011 | CN102163004A Exposure apparatus, exposure method and device producing method |
| 08/24/2011 | CN102162996A Manufacture method for negative type photosensitive resin composition and cured relief pattern |
| 08/24/2011 | CN102162995A Photoresist composition |
| 08/24/2011 | CN102162744A Flow sensor, method for manufacturing flow sensor and flow sensor module |
| 08/24/2011 | CN102162533A Ball valve for vacuum exhaust and vacuum exhaust apparatus |
| 08/24/2011 | CN102162531A Air door device |
| 08/24/2011 | CN102162139A Texturing semiconductor substrates |
| 08/24/2011 | CN102162134A Method of manufacturing silicon carbide substrate |
| 08/24/2011 | CN102161879A Polishing composition and polishing method using the same |
| 08/24/2011 | CN102161875A Attach film composition for semiconductor assembly, attach film for semiconductor assembly using the same and attach belt |
| 08/24/2011 | CN102161873A Adhesive composition, circuit connecting material and connecting structure of circuit member |
| 08/24/2011 | CN102161869A Dicing tape-integrated film for semiconductor back surface |
| 08/24/2011 | CN102161866A Adhesive composition, circuit connecting material and connecting structure of circuit member |
| 08/24/2011 | CN102161199A W-axis coaxial transmission mechanism for silicon wafer transmission robot |
| 08/24/2011 | CN102161141A Welding wire machine |
| 08/24/2011 | CN101924052B Method for quickly detecting drift defects of epitaxial patterns |
| 08/24/2011 | CN101887847B Method for forming monocrystal silicon structure with alternated P types and N types |
| 08/24/2011 | CN101831248B Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device |
| 08/24/2011 | CN101802257B Substrate placing mechanism and substrate processing apparatus |
| 08/24/2011 | CN101777499B Method for self-aligned preparation of tunneling field-effect transistors (TFETs) on basis of planar technology |
| 08/24/2011 | CN101771076B Full transparent AlGaN/GaN high electron mobility transistor and manufacturing method thereof |
| 08/24/2011 | CN101770942B Method and device for measuring temperature by P-type substrate silicon wafer |
| 08/24/2011 | CN101770123B Thin film transistor liquid crystal display (TFT-LCD) array substrate and manufacturing method thereof |
| 08/24/2011 | CN101752429B High-stability Zener diode and manufacturing method thereof |
| 08/24/2011 | CN101740467B Processing procedure of semiconductor manufactured aluminium metal wire |
| 08/24/2011 | CN101740454B Shallow slot isolation process for precisely controlling line width |
| 08/24/2011 | CN101740362B Gate forming method |
| 08/24/2011 | CN101734613B SOI wafer-based MEMS structure manufacturing and dicing method |
| 08/24/2011 | CN101728379B Organic light-emitting diode display device and its manufacture method |
| 08/24/2011 | CN101728328B Semiconductor apparatus and method for making semiconductor apparatus with stack metal grids |
| 08/24/2011 | CN101714526B Method for fabricating semiconductor device |
| 08/24/2011 | CN101714518B Method for fabricating semiconductor device |
| 08/24/2011 | CN101697345B Hot-pressing heads and hot-pressing device consisting of same |
| 08/24/2011 | CN101695696B Method for cleaning silicon chip |
| 08/24/2011 | CN101694831B Position adjusting mechanism |
| 08/24/2011 | CN101683723B Dead halt alarm device for CMP equipment |
| 08/24/2011 | CN101673762B LDMOS transistor structure and preparation method |
| 08/24/2011 | CN101640174B Method for etching semiconductor structure and method for forming metal interconnection layer |
| 08/24/2011 | CN101615603B Mounting structure and mounting method |
| 08/24/2011 | CN101609815B Semiconductor element and manufacturing method thereof |
| 08/24/2011 | CN101609799B Plasma-etching method and plasma-etching apparatus |
| 08/24/2011 | CN101593688B Semiconductor manufacturing method and semiconductor mask structure |
| 08/24/2011 | CN101577265B Test structure of breakdown voltage, analytic procedure applying same and wafer |
| 08/24/2011 | CN101577228B Method for preparing heterojunction device with three-dimensional structure |
| 08/24/2011 | CN101572251B Semiconductor device, n-type MOS transistor and manufacturing method thereof |
| 08/24/2011 | CN101568994B Laser dicing sheet and method for manufacturing chip body |
| 08/24/2011 | CN101562148B Method for carbon nano tube to achieve vertical interconnection of upper and lower layers of conductive material |
| 08/24/2011 | CN101556414B Semitransparent and half-reflection type liquid crystal display array base plate and manufacturing method thereof |
| 08/24/2011 | CN101552195B Method for manufacturing ohmic electrode on light-doped SiC matrix used for Hall effect measurement |
| 08/24/2011 | CN101540343B 4H-SiC PiN /schottky diode of offset field plate structure and manufacturing method of 4H-SiC PiN /schottky diode |