Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2011
08/25/2011US20110207269 Transistor and manufacturing method of the same
08/25/2011US20110207268 Thin Film Transistor, Method of Fabricating the Same and Organic Light Emitting Diode Display Device Having the Same
08/25/2011US20110207267 Reverse block-type insulated gate bipolar transistor manufacturing method
08/25/2011US20110207266 Printed circuit board (pcb) including a wire pattern, semiconductor package including the pcb, electrical and electronic apparatus including the semiconductor package, method of fabricating the pcb, and method of fabricating the semiconductor package
08/25/2011US20110207265 Nonvolatile memory devices and method of manufacturing the same
08/25/2011US20110207264 Manufacturing method of semiconductor device
08/25/2011US20110207263 Semiconductor device and method of manufacturing same
08/25/2011US20110207262 Method For Manufacturing A Semiconductor Structure
08/25/2011US20110207258 Method for forming pad in wafer with three-dimensional stacking structure
08/25/2011US20110207256 In-situ acceptor activation with nitrogen and/or oxygen plasma treatment
08/25/2011US20110207251 Semiconductor device and method of manufacturing the same
08/25/2011US20110207247 Method of correcting overlay and semiconductor device manufacturing method using the same
08/25/2011US20110207246 Methods for reducing the width of the unbonded region in soi structures
08/25/2011US20110207245 Stage, substrate processing apparatus, plasma processing apparatus, control method for stage, control method for plasma processing apparatus, and storage media
08/25/2011US20110207244 Apparatus for depositing and inspecting an organic light emitting display panel and method of depositing and inspecting an organic light emitting display panel using the apparatus
08/25/2011US20110207243 Plasma processing apparatus and plasma processing method
08/25/2011US20110207242 Method of manufacture of an integrated circuit package
08/25/2011US20110207241 Formation method of metallic electrode of semiconductor device and metallic electrode formation apparatus
08/25/2011US20110207240 Information storage devices using movement of magnetic domain walls and methods of manufacturing the same
08/25/2011US20110207239 Bicompatible electrodes
08/25/2011US20110207053 Exposure method and method of making a semiconductor device
08/25/2011US20110207032 Optically semitransmissive film, photomask blank and photomask, and method for designing optically semitransmissive film
08/25/2011US20110207031 Substrate processing method, manufacturing method of euv mask, and euv mask
08/25/2011US20110206833 Extension electrode of plasma bevel etching apparatus and method of manufacture thereof
08/25/2011US20110206486 Substrate processing apparatus and substrate processing method
08/25/2011US20110206270 Storage medium storing computer program for determining at least one of exposure condition and mask pattern
08/25/2011US20110206081 Semiconductor light-emitting device and method for manufacturing the same
08/25/2011US20110205816 Vertical type semiconductor device, method of manufacturing a vertical type semiconductor device and method of operating a vertical semiconductor device
08/25/2011US20110205794 Nonvolatile semiconductor memory device having protection function for each memory block
08/25/2011US20110205786 Memory design
08/25/2011US20110205774 Semiconductor memory device, driving method thereof, and method for manufacturing semiconductor device
08/25/2011US20110205720 Integrated chip package structure using organic substrate and method of manufacturing the same
08/25/2011US20110205708 Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate
08/25/2011US20110205534 Defect Inspection Apparatus and Its Method
08/25/2011US20110205215 Light-Emitting Device and Driving Method Thereof
08/25/2011US20110204996 Acoustic coupling layer for coupled resonator filters and method of fabricating acoustic coupling layer
08/25/2011US20110204969 Gated-varactors
08/25/2011US20110204913 Test section unit and test head
08/25/2011US20110204527 Wireless communication system
08/25/2011US20110204525 Semiconductor device and fabrication method for the same
08/25/2011US20110204524 Structures and methods of forming pre fabricated deep trench capacitors for soi substrates
08/25/2011US20110204522 Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
08/25/2011US20110204521 Chip-scale semiconductor device package and method of manufacturing the same
08/25/2011US20110204519 Semiconductor device and method of manufacturing the same
08/25/2011US20110204518 Scalability with reduced contact resistance
08/25/2011US20110204517 Semiconductor Device with Vias Having More Than One Material
08/25/2011US20110204516 Single chip semiconductor coating structure and manufacturing method thereof
08/25/2011US20110204515 Ic die including rdl capture pads with notch having bonding connectors or its ubm pad over the notch
08/25/2011US20110204514 Package device and fabrication method thereof
08/25/2011US20110204513 Device Including an Encapsulated Semiconductor Chip and Manufacturing Method Thereof
08/25/2011US20110204510 Chip structure and method for fabricating the same
08/25/2011US20110204509 Semiconductor Device and Method of Forming IPD in Fan-Out Level Chip Scale Package
08/25/2011US20110204508 Semiconductor packaging system with an aligned interconnect and method of manufacture thereof
08/25/2011US20110204505 Semiconductor Device and Method of Forming TMV and TSV in WLCSP Using Same Carrier
08/25/2011US20110204504 Reducing Susceptibility to Electrostatic Discharge Damage during Die-To-Die Bonding for 3-D Packaged Integrated Circuits
08/25/2011US20110204503 Microelectronic package assembly, method for disconnecting a microelectronic package
08/25/2011US20110204502 Method of Manufacturing A Semiconductor Device
08/25/2011US20110204500 Power device packages having thermal electric modules using peltier effect and methods of fabricating the same
08/25/2011US20110204497 Semiconductor integrated circuit and method for manufacturing the same
08/25/2011US20110204496 Circuit module, electronic device including the same, and circuit module manufacturing method
08/25/2011US20110204494 Integrated circuit packaging system with shield and method of manufacture thereof
08/25/2011US20110204492 Microelectronic structure including a low K dielectric and a method of controlling carbon distribution in the structure
08/25/2011US20110204490 Film forming apparatus, film forming method, and semiconductor device
08/25/2011US20110204489 Silicon substrate having nanostructures and method for producing the same and application thereof
08/25/2011US20110204488 Semiconductor wafer and manufacturing method of semiconductor device
08/25/2011US20110204486 Method of manufacturing a semiconductor integrated circuit device
08/25/2011US20110204485 Semiconductor device and fabrication method of semiconductor device
08/25/2011US20110204484 Sub-Wavelength Segmentation in Measurement Targets on Substrates
08/25/2011US20110204483 Electroluminescent device for the production of ultra-violet light
08/25/2011US20110204482 Method and Electronic Device for a Simplified Integration of High Precision Thinfilm Resistors
08/25/2011US20110204481 Semiconductor device and semiconductor device fabrication
08/25/2011US20110204480 3d integration of a mim capacitor and a resistor
08/25/2011US20110204478 Insulator layer based mems devices
08/25/2011US20110204474 Memory cell with silicon-containing carbon switching layer and methods for forming the same
08/25/2011US20110204472 Semiconductor Device and Method of Forming 3D Inductor from Prefabricated Pillar Frame
08/25/2011US20110204469 Semiconductor device and a method of manufacturing the same
08/25/2011US20110204454 Semiconductor device including sion gate dielectric with portions having different nitrogen concentrations
08/25/2011US20110204453 Methods Of Forming Electrically Conductive Lines, Methods Of Forming An Electrically Conductive Buried Line And An Electrical Contact Thereto, Electrically Conductive Lines, And Integrated Circuitry Comprising A Line Of Recessed Access Devices
08/25/2011US20110204451 Semiconductor device and manufacturing method thereof
08/25/2011US20110204450 Semiconductor device and manufacturing method thereof
08/25/2011US20110204444 Semiconductor intergrated device and method of manufacturing same
08/25/2011US20110204443 Semiconductor-on-insulator (soi) structure and method of forming the soi structure using a bulk semiconductor starting wafer
08/25/2011US20110204437 Semiconductor device and semiconductor device manufacturing method
08/25/2011US20110204435 Vertical capacitive depletion field effect transistor
08/25/2011US20110204433 Nonvolatile semiconductor storage device and method of manufacturing the same
08/25/2011US20110204431 Fully depleted silicon-on-insulator cmos logic
08/25/2011US20110204428 Implementing edram stacked fet structure
08/25/2011US20110204423 Semiconductor device and manufacturing method thereof
08/25/2011US20110204419 Integrated circuits including multi-gate transistors locally interconnected by continuous fin structure and methods for the fabrication thereof
08/25/2011US20110204417 Semiconductor device and method of manufacturing the semiconductor device
08/25/2011US20110204413 Semiconductor device and manufacturing method of the same
08/25/2011US20110204412 Method for manufacturing semiconductor light emitting element
08/25/2011US20110204408 High thermal performance packaging for optoelectronics devices
08/25/2011US20110204400 Light emitting device, method for manufacturing the same and apparatus for manufacturing light emitting device
08/25/2011US20110204396 Semiconductor light emitting device and method for manufacturing same
08/25/2011US20110204383 Sic semiconductor device having schottky barrier diode and method for manufacturing the same
08/25/2011US20110204382 Layered structures comprising silicon carbide layers, a process for their manufacture and their use
08/25/2011US20110204381 Semiconductor device and method for manufacturing same
08/25/2011US20110204379 Nitride semiconductor device and method of manufacturing the same
08/25/2011US20110204377 Methods of growing nitride semiconductors and methods of manufacturing nitride semiconductor substrates