Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2011
08/25/2011US20110204376 Growth of multi-junction led film stacks with multi-chambered epitaxy system
08/25/2011US20110204375 Thin film transistor structure, method of manufacturing the same, and electronic device
08/25/2011US20110204374 Thin film diode and method for fabricating the same
08/25/2011US20110204370 Thin-Film Transistor Substrate, Method of Manufacturing the Same, and Display Device Including the Same
08/25/2011US20110204367 Semiconductor device, method for manufacturing the same and image display
08/25/2011US20110204366 Semiconductor device, method for manufacturing the same and image display
08/25/2011US20110204364 Thin film transistor and manufacturing method thereof
08/25/2011US20110204362 Semiconductor device and method for manufacturing the same
08/25/2011US20110204357 Semiconductor device and penetrating electrode testing method
08/25/2011US20110204356 Method for staining sample
08/25/2011US20110204332 Semiconductor device and method of manufacturing the same
08/25/2011US20110204330 Joined nanostructures and methods therefor
08/25/2011US20110204329 NON-POLAR (Al,B,In,Ga)N QUANTUM WELL AND HETEROSTRUCTURE MATERIALS AND DEVICES
08/25/2011US20110204320 Methods of forming semiconductor devices and devices formed using such methods
08/25/2011US20110204319 Fullerene-doped nanostructures and methods therefor
08/25/2011US20110204316 Structure And Fabrication Method For Resistance-Change Memory Cell In 3-D Memory
08/25/2011US20110204315 Nonvolatile Memory Devices that Use Resistance Materials and Internal Electrodes, and Related Methods and Processing Systems
08/25/2011US20110204311 Non-volatile resistive-switching memories formed using anodization
08/25/2011US20110204309 Semiconductor memory device and method of manufacturing the same
08/25/2011US20110204029 Processing system and method for chemically treating a substrate
08/25/2011US20110204027 Slurry manufacturing method, slurry and polishing method and apparatus using slurry
08/25/2011US20110203736 Surface activation device
08/25/2011US20110203734 Plasma processing apparatus, magnetoresistive device manufacturing apparatus, magnetic thin film forming method, and film formation control program
08/25/2011US20110203659 Conductive compositions and processes for use in the manufacture of semiconductor devices
08/25/2011US20110203656 Nanoscale High-Aspect-Ratio Metallic Structure and Method of Manufacturing Same
08/25/2011US20110203646 Compound thin-film solar cell and process for producing the same
08/25/2011US20110203611 Mask cleaning method, mask cleaning apparatus, and pellicle
08/25/2011US20110203523 Method and apparatus for atomic layer deposition
08/25/2011US20110203518 Substrate processing method and apparatus
08/25/2011US20110203082 Press apparatus and method for manufacturing semiconductor device
08/25/2011DE102011004476A1 Halbleitereinrichtung und Verfahren zur Herstellung einer Halbleitereinrichtung A semiconductor device and method of manufacturing a semiconductor device
08/25/2011DE102011004475A1 Herstellungsverfahren für eine Halbleitereinrichtung Manufacturing method of a semiconductor device
08/25/2011DE102011004408A1 Halbleitervorrichtungsherstellungsverfahren The semiconductor device manufacturing method
08/25/2011DE102011004392A1 Siliziumcarbid-Halbleitervorrichtung mit einer Schottky-Sperrschichtdiode und Verfahren zum Herstellen derselben Silicon carbide semiconductor device with a Schottky barrier diode and method of manufacturing the same
08/25/2011DE102011004247A1 Verfahren zur Herstellung eines Siliziumkarbid-Substrats A method for producing a silicon carbide substrate
08/25/2011DE102011004195A1 Dünnfilm-Transistoraufbau, Verfahren zu dessen Herstellung, und elektronische Einrichtung A thin film transistor structure, processes for its preparation, and electronic device
08/25/2011DE102011000836A1 Bauelement mit einem eingekapselten Halbleiterchip und Herstellungsverfahren Component having an encapsulated semiconductor chip and manufacturing processes
08/25/2011DE102010064214A1 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device
08/25/2011DE102010042544A1 Dünnfilmbauelemente für Oberflächenmontage Thin film components for surface mounting
08/25/2011DE102010038246A1 Oberflächenmontierbares drahtloses Package mit offenem Hohlraum für Hochleistungs-HF-Anwendungen Surface-mountable package with an open cavity for wireless high power RF applications
08/25/2011DE102010037490A1 Halbleitervorrichtung mit Metallsilizidschicht und Verfahren zum Herstellen derselben A semiconductor device having metal silicide layer, and methods for manufacturing the same
08/25/2011DE102010035864A1 Workpiece carrier for cleaning machine for cleaning solar wafer, has bearing portions which are arranged in such manner that to-be-replaced element is positioned outside of storage layer such that peeling of storage layer is omitted
08/25/2011DE102010009015A1 Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Halbleiterchips A method for fabricating a plurality of optoelectronic semiconductor chips
08/25/2011DE102010008942A1 Verfahren und elektronische Vorrichtung für eine vereinfachte Integration von hochgenauen Dünnfilmwiderständen Procedures and electronic device for simplified integration of high precision thin film resistors
08/25/2011DE102010002342A1 Verwendung der spezifischen Widerstandsmessung zur indirekten Bestimmung der Reinheit von Silanen und Germanen und ein entsprechendes Verfahren Use of the resistivity measurement for the indirect determination of the purity of silanes and Germans and method
08/25/2011DE102010002204A1 Halbleiterdiode und Verfahren zum Herstellen einer Halbleiterdiode Semiconductor diode and method of manufacturing a semiconductor diode
08/25/2011DE102010000520A1 Verfahren und Vorrichtung zum Aufbringen von Lot auf ein Werkstück Method and apparatus for applying solder to a workpiece
08/25/2011DE102008045023B4 Verfahren zum Ausbilden einer Zwischenisolierschicht in einem Halbleiterbauelement A method of forming an interlayer insulating layer in a semiconductor device
08/25/2011DE102008041135B4 Inspektionsvorrichtung- und Verfahren für die optische Untersuchung von Objektoberflächen, insbesondere einer Wafernotch Inspektionsvorrichtung- and methods for optical examination of surfaces of objects, in particular a wafer Notch
08/25/2011DE102008038752B4 NOR-Flash-Speicherbauteil und Verfahren zum Herstellen desselben Thereof NOR flash memory device and method for producing
08/25/2011DE102008035816B4 Leistungssteigerung in PMOS- und NMOS-Transistoren durch Verwendung eines eingebetteten verformten Halbleitermaterials Improved performance in PMOS and NMOS transistors by using an embedded strained semiconductor material
08/25/2011DE102008034148B4 Leistungshalbleitermodulsystem und Verfahren zur Herstellung einer Leistungshalbleiteranordnung Power semiconductor module system and method for manufacturing a power semiconductor arrangement
08/25/2011DE102007058503B4 Verfahren zur nasschemischen Behandlung einer Halbleiterscheibe Process for wet-chemical treatment of a semiconductor wafer
08/25/2011DE102007057684B4 Verfahren und Teststruktur zur Überwachung von CMP-Prozessen in Metallisierungsschichten von Halbleiterbauelementen The method and test structure for monitoring of CMP processes in metallization of semiconductor components
08/25/2011DE102007011247B4 Halbleiteranordnung, Verfahren zur Herstellung derselben und Verfahren zur Herstellung eines Transistors A semiconductor device, method for producing the same and method of manufacturing a transistor
08/25/2011DE102006040281B4 Halbleitervorrichtung mit eingebetteten Flash-Speicherzellen auf SOI-Substrat, Verfahren der Anfertigung derselben und Verfahren zum Betreiben eines Flash-Speicherzellenfeldes A semiconductor device with embedded flash memory cells on an SOI substrate, the production method thereof, and method of operating a flash memory cell array
08/25/2011CA2789682A1 Method of fabricating micro-devices
08/25/2011CA2766981A1 Silicon carbide insulating gate type semiconductor device and fabrication method thereof
08/24/2011EP2360999A1 Structure of conductive holes of multilayer board and manufacturing method thereof
08/24/2011EP2360727A1 Semiconductor device and semiconductor device manufacturing method
08/24/2011EP2360723A1 Semiconductor device with copper wirings
08/24/2011EP2360722A1 Assembly for depositing air sensitive material
08/24/2011EP2360721A1 Device for positioning at least two objects, assemblies in particular multi-layer body assemblies, assembly for processing, in particular selenization, of objects, method for positioning at least two objects
08/24/2011EP2360720A1 Device for positioning at least two objects, assemblies in particular multi-layer body assemblies, assembly for processing, in particular selenization, of objects, method for positioning at least two objects
08/24/2011EP2360719A1 Epitaxial substrate for electronic devices and manufacturing method therefor
08/24/2011EP2360718A1 Semiconductor device and manufacturing method therefor
08/24/2011EP2360717A1 Method for producing a semiconductor device using laser annealing for selectively activating implanted dopants
08/24/2011EP2360716A1 Plasma processing apparatus
08/24/2011EP2360715A1 Method for manufacturing metal laminated substrate for semiconductor element formation and metal laminated substrate for semiconductor element formation
08/24/2011EP2360542A1 Method for projecting a process image on an operating and observation device
08/24/2011EP2360527A1 Chemically amplified positive resist composition for EB or EUV lithography and patterning process
08/24/2011EP2360526A1 Chemically amplified negative resist composition for E beam or EUV lithography and patterning process
08/24/2011EP2360525A1 Chemically amplified positive resist composition and pattern forming process
08/24/2011EP2360298A2 Method for depositing a semiconductor nanowire
08/24/2011EP2359416A1 A nanostructured device
08/24/2011EP2359410A1 Enhanced vision system for screen printing pattern alignment
08/24/2011EP2359405A2 Group iii-v devices with delta-doped layer under channel region
08/24/2011EP2359400A2 Methods and apparatus for producing semiconductor on insulator structures using directed exfoliation
08/24/2011EP2359399A1 Glass-ceramic-based semiconductor-on-insulator structures and method for making the same
08/24/2011EP2359398A1 Method for detaching and removing a semiconductor chip from a tape
08/24/2011EP2359397A1 Modular carrier
08/24/2011EP2359396A2 Bump stress mitigation layer for integrated circuits
08/24/2011EP2359395A1 Methods for protecting a die surface with photocurable materials
08/24/2011EP2359394A2 Metal-insulator-semiconductor tunneling contacts
08/24/2011EP2359393A2 Tape-based epitaxial lift off apparatuses and methods
08/24/2011EP2359392A2 Concentric showerhead for vapor deposition
08/24/2011EP2359391A1 Preparing a surface of a sapphire substrate for fabricating heterostructures
08/24/2011EP2359390A1 Method and system for stripping the edge of a semiconductor wafer
08/24/2011EP2359389A2 Laser ablation tooling via sparse patterned masks
08/24/2011EP2359388A1 Device and method for coating a substrate using cvd
08/24/2011EP2359387A1 High temperature sheet handling system and methods
08/24/2011EP2359386A1 Infrared radiator arrangement for high-temperature vacuum processes
08/24/2011EP2358926A2 Electrodeposition of copper in microelectronics with dipyridyl-based levelers
08/24/2011EP2250670B1 Method for the electrical connection of a component provided with protrusions comprising blocks with compensating effect
08/24/2011EP2238615B1 A method for fabricating a dual-orientation group-iv semiconductor substrate
08/24/2011EP1955366B1 Dielectric interface for group iii-v semiconductor device
08/24/2011EP1790006B1 A semiconductor device with a high-k gate dielectric and a metal gate electrode
08/24/2011EP1783103B1 Method for forming quartz glass
08/24/2011EP1746641B1 Method of manufacturing a group III nitride semiconductor device and epitaxial substrate
08/24/2011EP1728284B1 Etching of substrates of light emitting devices