H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2011
08/17/2011	CN102157448A Method of forming a semiconductor die
08/17/2011	CN102157447A Method for dicing a semiconductor wafer, a chip diced from a semiconductor wafer, and an array of chips diced from a semiconductor wafer
08/17/2011	CN102157446A Method for processing wafer
08/17/2011	CN102157445A Method for increasing connection strength of integrated circuit package
08/17/2011	CN102157444A Manufacturing method of organic electroluminescence element and image display system
08/17/2011	CN102157443A Manufacturing method of protection circuit for array unit of image sensor
08/17/2011	CN102157442A Method for forming interconnection among microelectronic chips
08/17/2011	CN102157441A Method for manufacturing composite covering layer
08/17/2011	CN102157440A Method for producing a multifunctional dielectric layer on a substrate
08/17/2011	CN102157439A Ultra-low dielectric constant material film and preparation method thereof
08/17/2011	CN102157438A Method for manufacturing wafer-level patch panel
08/17/2011	CN102157437A Method for forming semiconductor structure
08/17/2011	CN102157436A Copper electroplating method capable of reducing metal damage
08/17/2011	CN102157435A Contact hole forming method
08/17/2011	CN102157434A Method for manufacturing SOI (silicon on insulator) LIGBT (lateral insulated gate bipolar transistor) device unit with p buried layer and longitudinal channel
08/17/2011	CN102157433A Manufacturing method of VC SOI nLDMOS (Vertical Channel Silicon-on-insulator n Lateral Double-diffused Metal Oxide Semiconductor) device unit with p-type buried layer
08/17/2011	CN102157432A GeOI structure and formation method thereof
08/17/2011	CN102157431A Semiconductor device and manufacturing method thereof
08/17/2011	CN102157430A Method of forming shallow trench isolation structure
08/17/2011	CN102157429A Manufacturing method of shallow trench isolation structure
08/17/2011	CN102157428A Method for forming shallow trench isolation (STI) structure
08/17/2011	CN102157427A Table structure, and processing apparatus
08/17/2011	CN102157426A Wafer support device and wafer processing process
08/17/2011	CN102157425A Ring assembly for substrate processing chamber
08/17/2011	CN102157424A Substrate conveying apparatus and substrate conveying method
08/17/2011	CN102157423A Substrate mounting table and method for manufacturing the same, and substrate processing apparatus
08/17/2011	CN102157422A Winding core and wafer-processing belt wound on same
08/17/2011	CN102157421A Silicon wafer prealignment device and prealignment method
08/17/2011	CN102157420A Vacuum treating apparatus, method of operating the same and recording medium
08/17/2011	CN102157419A Push rod device for discharging of chip loader
08/17/2011	CN102157418A Automation for high throughput semiconductor batch-wafer processing equipment
08/17/2011	CN102157417A Silicon slice transmission robot
08/17/2011	CN102157416A Automatic detection method of dry etching silicon slice
08/17/2011	CN102157415A Method for testing wafer parameters of bare chips
08/17/2011	CN102157414A Process monitoring method and device for channel MOS devices
08/17/2011	CN102157413A On-line measuring device for frictional force generated during polishing of small-sized wafer
08/17/2011	CN102157412A Optical emission spectrum signal-based method for detecting fault of plasma etching process
08/17/2011	CN102157411A Structure and method for measuring electric property change of MOSFET (metal-oxide-semiconductor field effect transistor) device
08/17/2011	CN102157410A Device and method for substrate analysis
08/17/2011	CN102157409A Bonder
08/17/2011	CN102157408A Through hole-interconnected wafer level MOSFET packaging structure and realization method
08/17/2011	CN102157407A Use method of adhesive for circuit member connection
08/17/2011	CN102157406A Method for bonding chip with resin substrate through ultrasonic vibration
08/17/2011	CN102157405A Melting sealing cap-sealing process-based chip vacuum eutectic welding method
08/17/2011	CN102157404A Method for manufacturing semiconductor device
08/17/2011	CN102157403A Multiple chip ball mounting device and method
08/17/2011	CN102157402A System-in-package method
08/17/2011	CN102157401A High-density SIP (system in package) method of chip
08/17/2011	CN102157400A Method for encapsulating high-integration wafer fan-out
08/17/2011	CN102157399A Automatic charging system of semiconductor packaging equipment
08/17/2011	CN102157398A Resin seal device for metal die
08/17/2011	CN102157397A Method of forming an em protected semiconductor die
08/17/2011	CN102157396A Apparatus and method for embedding components in small-form-factor, system-on-packages
08/17/2011	CN102157395A Electronic tag volume winding process and device thereof
08/17/2011	CN102157394A High-density system-in-a-package method
08/17/2011	CN102157393A Fan-out high-density packaging method
08/17/2011	CN102157392A Method for encapsulating low-cost chip fan-out structures
08/17/2011	CN102157391A Semiconductor device and method of forming thin profile wlcsp with vertical interconnect over package footprint
08/17/2011	CN102157390A Machine station and method for automatically removing defective semiconductor packaged products
08/17/2011	CN102157389A Method for assembling radio-frequency power field effect transistor
08/17/2011	CN102157388A Apparatus and method for manufacturing substrate
08/17/2011	CN102157387A Thin film transistor and manufacture method thereof
08/17/2011	CN102157386A Manufacturing method of TFT (Thin Film Transistor)
08/17/2011	CN102157385A LDMOS (Lateral Double-diffused Metal Oxide Semiconductor) device and manufacturing method thereof
08/17/2011	CN102157384A Method for manufacturing transistor
08/17/2011	CN102157383A Manufacturing method of SOI (Silicon On Insulator) nLDMOS (n Laterally Diffused Metal Oxide Semiconductor) device unit with P buried layer
08/17/2011	CN102157382A Hyperconjugation forming method
08/17/2011	CN102157381A Method of manufacturing semiconductor device
08/17/2011	CN102157380A Methods of manufacturing semiconductor devices
08/17/2011	CN102157379A High-performance semiconductor device and manufacturing method thereof
08/17/2011	CN102157378A Semiconductor device manufacturing method
08/17/2011	CN102157377A Super-junction VDMOS (Vertical Double-diffused Metal Oxide Semiconductor) device and manufacturing method thereof
08/17/2011	CN102157376A Glass passivation process for diode
08/17/2011	CN102157375A Dual wavelength thermal flux laser anneal
08/17/2011	CN102157374A Method for manufacturing trapezoid field oxide layer
08/17/2011	CN102157373A Method for planing semiconductor structure
08/17/2011	CN102157372A Plasma processing apparatus and method
08/17/2011	CN102157371A Method for producing monocrystalline silicon nanometer structure
08/17/2011	CN102157370A Cleaning method and method for manufacturing electronic device
08/17/2011	CN102157369A Reduced twisting in ultra-high aspect ratio dielectric etch
08/17/2011	CN102157368A Method for removing residues after chemical mechanical polishing
08/17/2011	CN102157367A Optical device wafer processing method
08/17/2011	CN102157366A Method for reducing warping degree of thinned wafer
08/17/2011	CN102157365A Method for thinning a wafer
08/17/2011	CN102157364A Scribe-line draining during wet-bench etch and clean processes
08/17/2011	CN102157363A Ion implantation method of substrate back of power device
08/17/2011	CN102157362A Metal gate electrode using silicidation and method of formation thereof
08/17/2011	CN102157361A Method for preparing semiconductor T-shaped gate electrode by utilizing photon beam super-diffraction technology
08/17/2011	CN102157360A Method for manufacturing gate
08/17/2011	CN102157359A Method for manufacturing 6-inch POWERMOS transistor epitaxial layer
08/17/2011	CN102157358A Method for synthesizing carbon nano tube and zinc oxide heterostructure by hydrothermal method
08/17/2011	CN102157357A Method for cleaning semiconductor silicon wafer
08/17/2011	CN102157356A Method for preparing lower electrode of metal-insulator-metal semiconductor device
08/17/2011	CN102157355A Method of cleaning and micro-etching semiconductor wafers
08/17/2011	CN102157354A Method for preparing polymer-sylvine composite material with high dielectric constant
08/17/2011	CN102157353A Method for preparing diamond substrate for high-heat-conductivity integrated circuit
08/17/2011	CN102157352A Wet etching method and device for micro-nano structure
08/17/2011	CN102157351A Chip pickup and placement control method
08/17/2011	CN102157350A Manufacturing method for semiconductor device
08/17/2011	CN102157349A Method of manufacyuring semiconductor device

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