| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/01/2011 | CA2783380A1 Spalling for a semiconductor substrate |
| 08/31/2011 | EP2362423A2 Vertical power semiconductor device and method of making the same |
| 08/31/2011 | EP2362422A2 Vertical power semiconductor device and method of making the same |
| 08/31/2011 | EP2362415A1 Electrostatic chuck device and method for determining adsorbed state of wafer |
| 08/31/2011 | EP2362414A1 Method for manufacturing a semiconductor device |
| 08/31/2011 | EP2362413A1 Method for manufacturing a semiconductor device |
| 08/31/2011 | EP2362412A1 Method of growing nitride semiconductor and nitride semiconductor substrate formed using the same |
| 08/31/2011 | EP2362411A1 Apparatus and method for reactive ion etching |
| 08/31/2011 | EP2362268A1 Polymer, chemically amplified positive resist composition and pattern forming process |
| 08/31/2011 | EP2362267A1 Chemically amplified negative resist composition and patterning process |
| 08/31/2011 | EP2361439A2 Ultra-thin chip packaging |
| 08/31/2011 | EP2361438A1 Electrically actuated device and method of controlling the formation of dopants therein |
| 08/31/2011 | EP2361322A1 Device and method for coating a substrate using cvd |
| 08/31/2011 | EP2232546B1 A method of fabricating epitaxially grown layers on a composite structure |
| 08/31/2011 | EP2154273B1 Method for production of ultraviolet light-emitting hexagonal boron nitride crystal |
| 08/31/2011 | EP2140486B1 Carrier system and method for processing a plurality of substrates fixed to the carrier system |
| 08/31/2011 | EP1707967B1 Electric connecting device and contactor |
| 08/31/2011 | EP1707298B1 Laser processing method and device |
| 08/31/2011 | EP1659130B1 Rare earth metal complex, material for thin-film formation, and process for producing thin film |
| 08/31/2011 | EP1623458B1 Separating and assembling semiconductor strips |
| 08/31/2011 | EP1611615B1 Method for the production of a bipolar semiconductor element, especially a bipolar transistor, and corresponding bipolar semiconductor component |
| 08/31/2011 | EP1588402B1 Chip transfer method and apparatus |
| 08/31/2011 | EP1522092B1 Semiconductor element with stress-carrying semiconductor layer and corresponding production method |
| 08/31/2011 | EP1483793B1 Schottky power diode comprising a sicoi substrate and the method of producing one such diode |
| 08/31/2011 | EP1427021B1 Semiconductor device |
| 08/31/2011 | EP1022775B1 Method of fabrication of semiconductor device and mounting structure thereof |
| 08/31/2011 | CN201956998U 一种基于BCD工艺的level shifter电路 Based on the level shifter circuit BCD process |
| 08/31/2011 | CN201956357U 一种瞬态电压抑制二极管 One kind of transient voltage suppression diodes |
| 08/31/2011 | CN201956355U 高压半导体终端器件 Terminal voltage semiconductor device |
| 08/31/2011 | CN201956343U 表面金属化陶瓷基板 Metallized ceramic substrate surface |
| 08/31/2011 | CN201956336U 改进型的pvc料条结构 Pvc strands structure modification |
| 08/31/2011 | CN201956335U 半导体芯片模板结构 The semiconductor chip template structure |
| 08/31/2011 | CN201956334U 搬运设备 Handling Equipment |
| 08/31/2011 | CN201956333U 基片对位上载装置 Upload substrate alignment apparatus |
| 08/31/2011 | CN201956332U 晶体闸流管阳极安装隔离片的翻转模具装置 Thyristors flip mold assembly spacer tube anode installation |
| 08/31/2011 | CN201956331U 复合式加热轨道模具 Composite mold heating track |
| 08/31/2011 | CN201956330U Chemical preparation treatment system |
| 08/31/2011 | CN201956329U Conducting wire molding device for diode |
| 08/31/2011 | CN201956328U 一种引线自动成型装置 A lead automatic molding equipment |
| 08/31/2011 | CN201956327U 一种同时可实现多槽蚀刻的装置 A simultaneous multi-grooves etched device can be realized |
| 08/31/2011 | CN201956326U 一种引线框架自动收片机 A lead frame for automatic closing machine |
| 08/31/2011 | CN201956325U Tank cover |
| 08/31/2011 | CN201956324U 半导体晶圆片的清洗设备 Semiconductor wafer cleaning equipment |
| 08/31/2011 | CN201956323U 晶片清洗设备 Wafer cleaning equipment |
| 08/31/2011 | CN201954009U Ventilation door device |
| 08/31/2011 | CN201950677U 插件机用头部气吸机构 Plug-in air-suction mechanism with head |
| 08/31/2011 | CN201950317U 电磁泵通孔元件返修装置 Electromagnetic pump through-hole component repair device |
| 08/31/2011 | CN1992152B Etching apparatus for use in manufacture of flat panel display device and manufacturing method using the same |
| 08/31/2011 | CN1988131B Through hole processing method in copper interconnection technology Damascus manufacturing process |
| 08/31/2011 | CN1947239B Laser processing apparatus |
| 08/31/2011 | CN1933141B Contact structure having silicide layers, semiconductor device employing the same, and methods of fabricating the contact structure and semiconductor device |
| 08/31/2011 | CN1892419B Mask pattern inspection method, exposure condition verification method, and manufacturing method of semiconductor device |
| 08/31/2011 | CN1841791B Image sensor pixel having photodiode with indium pinning layer |
| 08/31/2011 | CN1788340B System, method and apparatus for improved global dual-damascene planarization |
| 08/31/2011 | CN1710718B Semiconductor device and method of manufacture thereof |
| 08/31/2011 | CN1692314B Chemical-amplification positive-working photoresist composition |
| 08/31/2011 | CN102172104A Plasma source and methods for depositing thin film coatings using plasma enhanced chemical vapor deposition |
| 08/31/2011 | CN102171847A Semiconductor color-tunable broadband light sources and full-color microdisplays |
| 08/31/2011 | CN102171830A Normally-off semiconductor devices and methods of fabricating the same |
| 08/31/2011 | CN102171828A Insulated gate bipolar transistor |
| 08/31/2011 | CN102171827A 碳化硅半导体器件 Silicon carbide semiconductor device |
| 08/31/2011 | CN102171825A Power module and encapsulation and integration method thereof |
| 08/31/2011 | CN102171821A Waterproof structure for bonding pad, waterproof bonding pad and method for forming waterproof structure |
| 08/31/2011 | CN102171818A Heat radiation device of chip, electronic device and fixing method of radiator |
| 08/31/2011 | CN102171813A Trigate static random-access memory with indepenent source and drain engineering, and devices made therefrom |
| 08/31/2011 | CN102171812A Semiconductor device |
| 08/31/2011 | CN102171811A Semiconductor device |
| 08/31/2011 | CN102171810A Discontinuous/non-uniform metal cap structure and process for interconnect integration |
| 08/31/2011 | CN102171809A System and method for testing an electrostatic chuck |
| 08/31/2011 | CN102171808A Method of refurbishing bipolar electrostatic chuck |
| 08/31/2011 | CN102171807A Method and apparatus for thermally processing plastic discs, in particular mould wafers |
| 08/31/2011 | CN102171806A Substrate detection device and method |
| 08/31/2011 | CN102171805A Bump stress mitigation layer for integrated circuits |
| 08/31/2011 | CN102171804A Method of enabling selective area plating on a substrate |
| 08/31/2011 | CN102171803A Doping of lead-free solder alloys and structures formed thereby |
| 08/31/2011 | CN102171802A Pressure bonding device and pressure bonding method |
| 08/31/2011 | CN102171801A Resin sealing compression molding method for electronic component and device therefor |
| 08/31/2011 | CN102171800A Semiconductor device and method for manufacturing same |
| 08/31/2011 | CN102171799A Silicon oxide film, method for forming silicon oxide film, and plasma CVD apparatus |
| 08/31/2011 | CN102171798A Method for chemically treating a substrate |
| 08/31/2011 | CN102171797A Dual metal interconnects for improved gap-fill, reliability, and reduced capacitance |
| 08/31/2011 | CN102171796A Methods for forming silicon nitride based film or silicon carbon based film |
| 08/31/2011 | CN102171795A Vapor phase epitaxy system |
| 08/31/2011 | CN102171794A Graded high germanium compound films for strained semiconductor devices |
| 08/31/2011 | CN102171793A Semiconductor substrate, electronic device and method for manufacturing semiconductor substrate |
| 08/31/2011 | CN102171792A Semiconductor device wafer,semiconductor device, design system, manufacturing method and design method |
| 08/31/2011 | CN102171791A Semiconductor substrate, electronic device and method for manufacturing semiconductor substrate |
| 08/31/2011 | CN102171790A Semiconductor substrate, electronic device and method for manufacturing semiconductor substrate |
| 08/31/2011 | CN102171789A Semiconductor substrate, electronic device and method for manufacturing semiconductor substrate |
| 08/31/2011 | CN102171788A Same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning (SAP) |
| 08/31/2011 | CN102171787A Silicon carbide substrate and method for production thereof |
| 08/31/2011 | CN102171786A Lavacoat pre-clean and pre-heat |
| 08/31/2011 | CN102171764A 半导体器件 Semiconductor devices |
| 08/31/2011 | CN102171546A Method and device for measuring physical parameters |
| 08/31/2011 | CN102171116A Conveyor assembly and method for conveying a substrate carrier |
| 08/31/2011 | CN102171013A Compression molding method and device |
| 08/31/2011 | CN102171000A Method for measuring the thickness of a discoidal workpiece |
| 08/31/2011 | CN102170757A Method of forming circuit interconnection, circuit board, and circuit interconnection film having film thickness larger than width thereof |
| 08/31/2011 | CN102170529A Three-dimensional MOS transistor, solid-state imaging device, method of manufacturing the same and electronic apparatus |
| 08/31/2011 | CN102170080A Multi-wire-diameter component lead forming device and control method thereof |