| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/30/2011 | US8008216 Nitrogen profile in high-K dielectrics using ultrathin disposable capping layers |
| 08/30/2011 | US8008215 Integration of buried oxide layers with crystalline layers |
| 08/30/2011 | US8008214 Method of forming an insulation structure and method of manufacturing a semiconductor device using the same |
| 08/30/2011 | US8008213 Self-assembly process for memory array |
| 08/30/2011 | US8008212 Fabrication methods for integration CMOS and BJT devices |
| 08/30/2011 | US8008211 Pattern forming method, semiconductor device manufacturing apparatus and storage medium |
| 08/30/2011 | US8008210 Exposure mask with double patterning technology and method for fabricating semiconductor device using the same |
| 08/30/2011 | US8008209 Thermal gradient control of high aspect ratio etching and deposition processes |
| 08/30/2011 | US8008208 Method of cleaning and forming a negatively charged passivation layer over a doped region |
| 08/30/2011 | US8008207 Use of ion implantation in chemical etching |
| 08/30/2011 | US8008206 Double patterning strategy for contact hole and trench in photolithography |
| 08/30/2011 | US8008205 Methods for producing a semiconductor device having planarization films |
| 08/30/2011 | US8008204 Method of manufacturing semiconductor device |
| 08/30/2011 | US8008203 Substrate, method of polishing the same, and polishing apparatus |
| 08/30/2011 | US8008202 Ruthenium CMP compositions and methods |
| 08/30/2011 | US8008201 Aqueous cerium oxide dispersion |
| 08/30/2011 | US8008200 Poison-free and low ULK damage integration scheme for damascene interconnects |
| 08/30/2011 | US8008199 Microstructure modification in copper interconnect structure |
| 08/30/2011 | US8008198 Large scale method and furnace system for selenization of thin film photovoltaic materials |
| 08/30/2011 | US8008197 Method for manufacturing semiconductor device |
| 08/30/2011 | US8008196 Method to create a metal pattern using a damascene-like process |
| 08/30/2011 | US8008195 Method for manufacturing semiconductor device |
| 08/30/2011 | US8008194 Method of manufacturing semiconductor device |
| 08/30/2011 | US8008193 Manufacturing method of semiconductor device and semiconductor manufacturing apparatus therefor |
| 08/30/2011 | US8008192 Conductive interconnect structures and formation methods using supercritical fluids |
| 08/30/2011 | US8008191 Semiconductor device and method for manufacturing the same |
| 08/30/2011 | US8008190 Method of manufacturing semiconductor device |
| 08/30/2011 | US8008189 Semiconductor device manufacturing method, semiconductor device, and semiconductor wafer structure |
| 08/30/2011 | US8008188 Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials |
| 08/30/2011 | US8008187 Method for reducing dielectric overetch using a dielectric etch stop at a planar surface |
| 08/30/2011 | US8008186 Semiconductor device and method of fabricating the same |
| 08/30/2011 | US8008185 Semiconductor devices and methods of forming the same |
| 08/30/2011 | US8008184 Semiconductor device manufacturing method, semiconductor manufacturing apparatus and storage medium |
| 08/30/2011 | US8008183 Dual capillary IC wirebonding |
| 08/30/2011 | US8008182 Semiconductor device and method for manufacturing semiconductor device |
| 08/30/2011 | US8008181 Propagation of misfit dislocations from buffer/Si interface into Si |
| 08/30/2011 | US8008180 Method of forming an OHMIC contact on a P-type 4H-SIC substrate |
| 08/30/2011 | US8008179 Methods using silver compositions for micro-deposition direct writing silver conductor lines on photovoltaic wafers |
| 08/30/2011 | US8008178 Method for fabricating semiconductor device with an intermediate stack structure |
| 08/30/2011 | US8008177 Method for fabricating semiconductor device using a nickel salicide process |
| 08/30/2011 | US8008176 Masked ion implant with fast-slow scan |
| 08/30/2011 | US8008175 Semiconductor structure made using improved simultaneous multiple ion implantation process |
| 08/30/2011 | US8008174 Continuous feed chemical vapor deposition |
| 08/30/2011 | US8008173 III nitride single crystal and method of manufacturing semiconductor device incorporating the III nitride single crystal |
| 08/30/2011 | US8008172 Methods of forming semiconductor devices including multistage planarization and crystalization of a semiconductor layer |
| 08/30/2011 | US8008171 Method of fabricating polycrystalline semiconductor |
| 08/30/2011 | US8008170 Method for manufacturing semiconductor device |
| 08/30/2011 | US8008169 Method for manufacturing photoelectric conversion device |
| 08/30/2011 | US8008168 Method and apparatus for manufacturing semiconductor device |
| 08/30/2011 | US8008167 Phase change memory device having an increased sensing margin for cell efficiency and method for manufacturing the same |
| 08/30/2011 | US8008166 Method and apparatus for cleaning a substrate surface |
| 08/30/2011 | US8008165 Nitride semiconductor wafer and method of processing nitride semiconductor wafer |
| 08/30/2011 | US8008164 Wafer bonding method and wafer structure |
| 08/30/2011 | US8008163 Method of fabricating semiconductor device |
| 08/30/2011 | US8008162 Select devices including an open volume, memory devices and systems including same, and methods for forming same |
| 08/30/2011 | US8008161 Capacitor assemblies |
| 08/30/2011 | US8008160 Method and structure for forming trench DRAM with asymmetric strap |
| 08/30/2011 | US8008159 Semiconductor device and semiconductor device manufacturing method |
| 08/30/2011 | US8008158 Dopant implantation method using multi-step implants |
| 08/30/2011 | US8008157 CMOS device with raised source and drain regions |
| 08/30/2011 | US8008156 Nitride read only memory device with buried diffusion spacers and method for making the same |
| 08/30/2011 | US8008155 Gate electrode structure |
| 08/30/2011 | US8008154 Methods of forming impurity containing insulating films and flash memory devices including the same |
| 08/30/2011 | US8008153 Methods of fabricating nonvolatile memory devices having gate structures doped by nitrogen |
| 08/30/2011 | US8008152 Method of manufacturing semiconductor device |
| 08/30/2011 | US8008151 Shallow source MOSFET |
| 08/30/2011 | US8008150 Methods of fabricating flash memory devices including substantially uniform tunnel oxide layers |
| 08/30/2011 | US8008149 Non-volatile semiconductor memory device and method of manufacturing the same |
| 08/30/2011 | US8008148 Method of manufacturing M-I-M capacitor of semiconductor device |
| 08/30/2011 | US8008147 Semiconductor device and method for manufacturing the same |
| 08/30/2011 | US8008146 Different thickness oxide silicon nanowire field effect transistors |
| 08/30/2011 | US8008145 High-K metal gate structure fabrication method including hard mask |
| 08/30/2011 | US8008143 Method to form a semiconductor device having gate dielectric layers of varying thicknesses |
| 08/30/2011 | US8008142 Self-aligned Schottky diode |
| 08/30/2011 | US8008141 Method of fabricating a semiconductor device with multiple channels |
| 08/30/2011 | US8008140 Method for manufacturing semiconductor device including hat-shaped electrode |
| 08/30/2011 | US8008139 Method of manufacturing thin film transistor array substrate |
| 08/30/2011 | US8008138 Extremely thin semiconductor on insulator semiconductor device with suppressed dopant segregation |
| 08/30/2011 | US8008137 Method for fabricating 1T-DRAM on bulk silicon |
| 08/30/2011 | US8008136 Fully silicided gate structure for FinFET devices |
| 08/30/2011 | US8008135 Method for manufacturing pixel structure |
| 08/30/2011 | US8008133 Chip package with channel stiffener frame |
| 08/30/2011 | US8008132 Etched surface mount islands in a leadframe package |
| 08/30/2011 | US8008131 Semiconductor chip package assembly method and apparatus for countering leadfinger deformation |
| 08/30/2011 | US8008130 Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board |
| 08/30/2011 | US8008129 Method of making semiconductor device packaged by sealing resin member |
| 08/30/2011 | US8008128 Thin quad flat package with no leads (QFN) fabrication methods |
| 08/30/2011 | US8008127 Method of fabricating an integrated circuit having a multi-layer structure with a seal ring |
| 08/30/2011 | US8008126 Castellation wafer level packaging of integrated circuit chips |
| 08/30/2011 | US8008125 System and method for stacked die embedded chip build-up |
| 08/30/2011 | US8008124 Adhesive film for semiconductor and semiconductor device using the adhesive film |
| 08/30/2011 | US8008123 Manufacturing method of semiconductor device |
| 08/30/2011 | US8008122 Pressurized underfill cure |
| 08/30/2011 | US8008121 Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate |
| 08/30/2011 | US8008120 Method for producing electronic part package |
| 08/30/2011 | US8008119 Surface mount optoelectronic component with lens having protruding structure |
| 08/30/2011 | US8008117 Antimony and germanium complexes useful for CVD/ALD of metal thin films |
| 08/30/2011 | US8008114 Phase change memory device and manufacturing method |
| 08/30/2011 | US8008113 Technique and apparatus for depositing layers of semiconductors for solar cell and module fabrication |
| 08/30/2011 | US8008112 Bulk chloride species treatment of thin film photovoltaic cell and manufacturing method |