H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2011
08/18/2011	DE102010007970A1 Verfahren und Vorrichtung zum aktiven Keilfehlerausgleich zwischen zwei im wesentlichen zueinander parallel positionierbaren Gegenständen Method and device for active wedge error compensation between two substantially parallel repositionable articles
08/18/2011	DE102010001998A1 Gassensitiver Feldeffekttransistor und Verfahren zur Herstellung eines gassensitiven Feldeffekttransistors Gas-sensitive field-effect transistor and method for producing a gas-sensitive field-effect transistor
08/18/2011	DE102006015096B4 Verfahren zur Verringerung der durch Polieren hervorgerufenen Schäden in einer Kontaktstruktur durch Bilden einer Deckschicht A method of reducing the damages caused by polishing in a contact structure by forming a covering layer
08/18/2011	DE102006009721B4 Nanodraht (Nanowire)-Speicherzelle und Verfahren zu deren Herstellung Nanowire (Nanowire) memory cell and method for producing them
08/18/2011	DE102005040847B4 Single-Poly-EPROM-Baustein und Verfahren zur Herstellung Single-poly-EPROM chip and method for producing
08/18/2011	DE102005030675B4 Herstellungsverfahren eines organischen Dünnschichttransistors und einer Flüssigkristallanzeigenvorrichtung,ein organischer Dünnschichttransistor und eine Flüssigkristallanzeigevorrichtung Production method of an organic thin film transistor and a liquid crystal display device, an organic thin film transistor and a liquid crystal display device
08/18/2011	DE102005022884B4 Verfahren zur Inspektion einer Leiterbahnstruktur A method for inspection of a conductor track structure
08/18/2011	DE102005012144B4 Einspanntisch zur Verwendung in einer Laserstrahlbearbeitungsmaschine Chuck for use in a laser beam processing machine
08/18/2011	DE102005011348B4 Halbleitervorrichtung Semiconductor device
08/18/2011	DE102005004795B4 Konzept zur nass-chemischen Entfernung eines Opfermaterials in einer Materialstruktur Concept for the wet chemical removal of a sacrificial material in a material structure
08/18/2011	DE102005001718B4 Integrierte Schaltkreisanordnung und Verfahren zum Herstellen einer elektrisch leitfähigen Verbindung in einer Verdrahtungsebene in einer integrierten Schaltkreisanordnung Integrated circuit arrangement and method for producing an electrically conductive connection in a wiring layer in an integrated circuit arrangement
08/18/2011	DE102004051588B4 Halbleitereinrichtungsgruppe und Verfahren zum Herstellen derselben und Halbleitereinrichtung A semiconductor device group and methods for preparing the same, and semiconductor device
08/18/2011	DE102004041904B4 Verfahren zur Einstellung eines Serienwiderstandes am Gate eines Leistungstransistors Method for setting a resistance in series to the gate of a power transistor
08/18/2011	DE102004002181B4 Integrierter Transistor, insbesondere für Spannungen größer 40 Volt, und Herstellungsverfahren Integrated transistor, in particular for voltages greater than 40 volts, and manufacturing processes
08/17/2011	EP2357875A1 Method for manufacturing an electronic box
08/17/2011	EP2357672A1 Semiconductor layer and method for forming same
08/17/2011	EP2357671A1 Silicon carbide semiconductor device and method for manufacturing the same
08/17/2011	EP2357667A2 Radio frequency amplifier with effective decoupling
08/17/2011	EP2357665A2 Chip package and method for fabricating the same
08/17/2011	EP2357664A1 Composition for sealing semiconductor, semiconductor device, and process for manufacturing semiconductor device
08/17/2011	EP2357663A2 Apparatus and method for wet-processing object, and fluid diffusion plate and barrel used therein
08/17/2011	EP2357662A2 Electron blocking layers for gate stacks of nonvolatile memory devices
08/17/2011	EP2357661A1 Epitaxial substrate for electronic device and manufacturing method thereof
08/17/2011	EP2357660A1 Method for manufacturing composite substrate on which wide bandgap semiconductor is laminated
08/17/2011	EP2357659A1 Soi wafer manufacturing method
08/17/2011	EP2357629A1 Substrate for display panel, and display panel
08/17/2011	EP2357529A2 Optical imaging arrangement
08/17/2011	EP2357215A1 Use of an adhesive composition, a circuit connecting material, a process for the production of a circuit member connection structure and a semiconductor device
08/17/2011	EP2357205A1 Photocurable composition and method for manufacturing a molded body having a fine surface pattern
08/17/2011	EP2357204A1 Composition
08/17/2011	EP2357059A2 Method for chemical mechanical planarization of a tungsten-containing substrate
08/17/2011	EP2357056A1 Wafer bonding apparatus
08/17/2011	EP2356686A1 Photovoltaic devices including copper indium gallium selenide
08/17/2011	EP2356679A1 Integrated capacitor with interlinked lateral fins
08/17/2011	EP2356677A1 Interconnect structure with improved dielectric line to via electromigration resistant interfacial layer and method of fabricating same
08/17/2011	EP2356676A2 Methods and apparatus for producing semiconductor on insulator structures using directed exfoliation
08/17/2011	EP2356675A2 Methods and systems for manufacturing thin-film solar cells
08/17/2011	EP2356674A2 Dual metal interconnects for improved gap-fill, reliability, and reduced capacitance
08/17/2011	EP2356673A2 System and method for recycling a gas used to deposit a semiconductor layer
08/17/2011	EP2356672A2 Chemical vapor deposition flow inlet elements and methods
08/17/2011	EP2356671A2 Chemical vapor deposition with elevated temperature gas injection
08/17/2011	EP2356670A2 Graded high germanium compound films for strained semiconductor devices
08/17/2011	EP2356431A2 A method for forming a nanostructure penetrating a layer
08/17/2011	EP2356424A1 Method of evaluating the ageing of an electronic assembly
08/17/2011	EP2356415A1 Method of preparing detectors for oxide bonding to readout integrated chips
08/17/2011	EP2356353A1 Configurable pressure vessel
08/17/2011	EP2356192A2 Barrier slurry for low-k dielectrics
08/17/2011	EP2356186A1 An antireflective coating composition comprising fused aromatic rings
08/17/2011	EP2356177A1 An antireflective coating composition comprising fused aromatic rings
08/17/2011	EP2355936A1 Reactor to form solar cell absorbers
08/17/2011	EP2355920A1 Improved drum design for web processing
08/17/2011	EP2165358B1 Susceptor for improving throughput and reducing wafer damage
08/17/2011	EP1922751B1 Method for making a semiconductor-on-insulation heterostructure
08/17/2011	EP1887611B1 Opening/closing structure for container for conveying thin plate
08/17/2011	EP1745505B1 Process for the singulation of integrated devices in thin semiconductor chips
08/17/2011	EP1662557B1 Heterojunction bipolar transistor
08/17/2011	EP1636842B1 Stackable semiconductor device and method of manufacturing the same
08/17/2011	EP1625336B1 Use of a layer of solid fuel, method for producing such a layer and associated heating unit
08/17/2011	EP1389407B1 Method for producing a contact substrate, and corresponding contact substrate
08/17/2011	EP1371751B1 Film forming device
08/17/2011	EP1260125B1 Thermal management system
08/17/2011	EP1243016B1 Method and apparatus for ionized physical vapor deposition
08/17/2011	CN201936875U Double-sided graphic chip normal-mounting module packaging structure
08/17/2011	CN201936874U Double-sided graphics chip positive single packaging structure
08/17/2011	CN201936870U 二极管安装固定结构 Diode mounting structure
08/17/2011	CN201936865U 半导体制冷片p、n型晶粒自动排粒机 Semiconductor refrigeration tablets p, n-type grains automatic discharge granulator
08/17/2011	CN201936864U 半导体封装行业使用的带弹力的顶针 Semiconductor packaging industries with elastic thimble
08/17/2011	CN201936863U 用于湿式制程的可调整基材定位孔径式输送载板 Adjustable base for the wet process of locating apertures conveyor carrier board
08/17/2011	CN201936862U 用于湿式制程的可调整基材定位孔径式输送载板 Adjustable base for the wet process of locating apertures conveyor carrier board
08/17/2011	CN201936861U 一种应用于晶固机的旋转型输送盘装置 Applied to a rotary-type crystalline solid machine conveyor disk device
08/17/2011	CN201936860U 集成电路封装片打标机上料模块 IC package marking sheet feeding module
08/17/2011	CN201936859U 晶圆盒连动定位装置 Wafer cassette positioning means gearing
08/17/2011	CN201936858U Transverse plastic packaged diode lead-out wire straightening machine
08/17/2011	CN201936857U 半导体封装产品的定形压块装置 Amorphous semiconductor packaging products briquetting unit
08/17/2011	CN201936856U 一种便于除胶的改良型模具成型镶件 An easy addition to the rubber-modified molding inserts
08/17/2011	CN201936855U 半导体封合装置及其直式封合器模块 Semiconductor sealing device and straight sealing module
08/17/2011	CN201936854U 测试打印编带一体机及六线形分类料桶 Test print taping one machine and six linear classification Tank
08/17/2011	CN201936853U 一种晶片打线的压固机构 A wafer playing solid body pressure line
08/17/2011	CN201936852U 自动去除半导体封装不良品的机台 Automatic removal of defective semiconductor packaging machine
08/17/2011	CN201936851U Thickness detecting device for diode base pin
08/17/2011	CN201935527U Quick drying device used after cleaning of silicon chip
08/17/2011	CN201934976U 半导体硅集成制造工艺中硅片目检照明用的强光灯 Integrated semiconductor silicon wafer manufacturing process visual inspection lighting with bright lights
08/17/2011	CN201932704U 支架自动抓取装置及支架自动装载系统 Automatic capture device and stent stent automatic loading system
08/17/2011	CN201931182U BGA (ball grid array) rework station removal, moving and heating device
08/17/2011	CN201930874U 晶圆表面液体喷出装置 The wafer surface of the liquid ejection apparatus
08/17/2011	CN201930863U 基板喷淋装置 Substrate sprinklers
08/17/2011	CN1996153B Heating device and heating method
08/17/2011	CN1981368B Process liquid for semiconductor device, processing method
08/17/2011	CN1956151B Manufacturing method for semiconductor and accessorial device
08/17/2011	CN1897270B Wire structure, method for fabricating wire, thin film transistor substrate, and method for fabricating thin film transistor substrate
08/17/2011	CN1804725B Apparatus and method for supporting and thermally conditioning a substrate, a support table, a chuck
08/17/2011	CN1763933B Printing circuit board and circuit unit introduced to same
08/17/2011	CN1716575B Method for manufacturing semiconductor device
08/17/2011	CN1716530B Method and apparatus for stable plasma processing
08/17/2011	CN1702024B Vacuum treating device
08/17/2011	CN1690866B Device and method for treating panel
08/17/2011	CN1653326B Vision system
08/17/2011	CN1577112B Slushing composition for removing color etch - resistant agent in tft-lcd producing technology
08/17/2011	CN1249368B Single crystal substrate of gallium arsenide, and epitaxial wafer using same
08/17/2011	CN102160187A Support for solar cells and method for producing a group of solar cells

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