Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2011
09/01/2011WO2011104904A1 Pressurizing-type lamp annealing device, method for producing thin film, and method for using pressurizing-type lamp annealing device
09/01/2011WO2011104894A1 Thin film semiconductor device, apparatus for manufacturing thin film semiconductor device, and method for manufacturing thin film semiconductor device
09/01/2011WO2011104865A1 Knockdown-type hermetically sealed chamber
09/01/2011WO2011104850A1 Semiconductor device and production method therefor
09/01/2011WO2011104806A1 Stage device
09/01/2011WO2011104803A1 Plasma generator
09/01/2011WO2011104790A1 Transfer device, and workpiece mounting device
09/01/2011WO2011104788A1 Method for manufacturing a semiconductor device
09/01/2011WO2011104782A1 Semiconductor device
09/01/2011WO2011104779A1 Semiconductor integrated circuit device
09/01/2011WO2011104777A1 Semiconductor device and production method thereof
09/01/2011WO2011104775A1 Semiconductor device
09/01/2011WO2011104773A1 Non-volatile semiconductor storage device
09/01/2011WO2011104550A2 Method of forming and patterning conformal insulation layer in vias and etched structures
09/01/2011WO2011104461A2 Method of eliminating fragments of material present on the surface of a multilayer structure
09/01/2011WO2011104231A1 Device for forming a reduced chamber space, and method for positioning multilayer bodies
09/01/2011WO2011104222A1 Arrangement, system, and method for processing multilayer bodies
09/01/2011WO2011104198A2 Method and apparatus for irradiating a semiconductor material surface by laser energy
09/01/2011WO2011104147A1 Method for oligomerizing hydridosilanes, the oligomers that can be produced by means of the method, and the use thereof
09/01/2011WO2011104096A1 Multijunction photovoltaic cell fabrication
09/01/2011WO2011103994A1 Wafer equivalent, method for producing it and use
09/01/2011WO2011103735A1 Fabricating method of copper interconnection structure with mim capacitor and structure fabricated thereby
09/01/2011WO2011084223A3 Wet oxidation process performed on a dielectric material formed from a flowable cvd process
09/01/2011WO2011076430A3 Method and apparatus for forming a dielectric layer on a substrate
09/01/2011WO2011071980A3 Ultra low silicon loss high dose implant strip
09/01/2011WO2011068621A3 Methods of patterning materials, and methods of forming memory cells
09/01/2011WO2011063932A8 Method for improving the quality of wafers, and use of the method
09/01/2011WO2011050171A3 Method for tunably repairing low-k dielectric damage
09/01/2011WO2011049318A3 Slurry composition for cmp, and polishing method
09/01/2011WO2011044115A4 Method for thin film thermoelectric module fabrication
09/01/2011WO2011043567A3 Wafer-supporting member, method for manufacturing same, and wafer-polishing unit comprising same
09/01/2011US20110214100 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices
09/01/2011US20110213075 Polyimide resin composition for semiconductor devices, method of forming film in semiconductor devices using the same and semiconductor devices
09/01/2011US20110212630 Method for preparing a self-supporting crystallized silicon thin film
09/01/2011US20110212629 Liquid composition containing aminoether for deposition of metal-containing films
09/01/2011US20110212628 Sequential pulse deposition
09/01/2011US20110212627 Low Temperature Dielectric Flow Using Microwaves
09/01/2011US20110212626 Substrate processing apparatus and semiconductor device producing method
09/01/2011US20110212625 Substrate processing apparatus and method of manufacturing semiconductor device
09/01/2011US20110212624 System, method and apparatus for plasma etch having independent control of ion generation and dissociation of process gas
09/01/2011US20110212623 Substrate treatment device
09/01/2011US20110212622 Surface texturing using a low quality dielectric layer
09/01/2011US20110212621 Abrasive composition and method for manufacturing semiconductor integrated circuit device
09/01/2011US20110212620 Post-planarization densification
09/01/2011US20110212619 Semiconductor Device Having Dummy Pattern and the Method for Fabricating the Same
09/01/2011US20110212618 Trench interconnect structure and formation method
09/01/2011US20110212617 Liquid for protecting copper wiring surface and method for manufacturing semiconductor circuit element
09/01/2011US20110212616 Metallization system of a semiconductor device comprising rounded interconnects formed by hard mask rounding
09/01/2011US20110212615 Manufacturing method of a bump structure having a reinforcement member
09/01/2011US20110212614 Microelectronic workpieces and method for manufacturing microelectronic devices using such workpieces
09/01/2011US20110212613 Semiconductor devices having a fuse and methods of cutting a fuse
09/01/2011US20110212612 Memory devices including dielectric thin film and method of manufacturing the same
09/01/2011US20110212611 Methods of forming dual gate of semiconductor device
09/01/2011US20110212610 Methods of forming dual gate of semiconductor device
09/01/2011US20110212609 Method of manufacturing a semiconductor device
09/01/2011US20110212608 Sputtering-Less Ultra-Low Energy Ion Implantation
09/01/2011US20110212607 Method for fabricating semiconductor device
09/01/2011US20110212606 Method of Fabricating Thin Film Transistor Structure
09/01/2011US20110212605 Method for manufacturing semiconductor element and deposition apparatus
09/01/2011US20110212604 Method of fabricating transistor
09/01/2011US20110212603 Methods for improving the quality of structures comprising semiconductor materials
09/01/2011US20110212602 Semiconductor device and method for manufacturing same
09/01/2011US20110212601 Stress-Enhanced Performance Of A Finfet Using Surface/Channel Orientations And Strained Capping Layers
09/01/2011US20110212600 Method for forming channel layer with high ge content on substrate
09/01/2011US20110212599 Method of manufacturing semiconductor device, method of manufacturing substrate and substrate processing apparatus
09/01/2011US20110212598 Method for manufacturing bonded wafer
09/01/2011US20110212597 Method for manufacturing semiconductor device
09/01/2011US20110212596 Method for manufacturing soi substrate
09/01/2011US20110212595 Semiconductor device structure and methods of making
09/01/2011US20110212594 Semiconductor device having element isolation region
09/01/2011US20110212593 CMP Process Flow for MEMS
09/01/2011US20110212592 Method of forming ultra-shallow junctions in semiconductor devices
09/01/2011US20110212591 Method for fabricating transistor of semiconductor device
09/01/2011US20110212590 High temperature implantation method for stressor formation
09/01/2011US20110212589 Semiconductor device manufacturing method
09/01/2011US20110212588 Replacing Symmetric Transistors with Asymmetric Transistors
09/01/2011US20110212587 Asymmetric source and drain stressor regions
09/01/2011US20110212586 Method for Forming Shielded Gate Field Effect Transistors
09/01/2011US20110212585 Semiconductor Device with Reliable High-Voltage Gate Oxide and Method of Manufacture Thereof
09/01/2011US20110212584 Phosphorus Activated NMOS Using SiC Process
09/01/2011US20110212583 Method For Providing Semiconductors Having Self-Aligned Ion Implant
09/01/2011US20110212582 Method Of Manufacturing High Electron Mobility Transistor
09/01/2011US20110212581 Array substrate for liquid crystal display device and method of fabricating the same
09/01/2011US20110212580 Thin film transistor, method of manufacturing the same, and flat panel display device having the same
09/01/2011US20110212579 Fully Depleted SOI Multiple Threshold Voltage Application
09/01/2011US20110212578 Semiconductor device with copper wirebond sites and methods of making same
09/01/2011US20110212577 Semiconductor power device having a stacked discrete inductor structure
09/01/2011US20110212576 Semiconductor heterostructure nanowire devices
09/01/2011US20110212575 Method for manufacturing thin film integrated circuit, and element substrate
09/01/2011US20110212574 Processing method for package substrate
09/01/2011US20110212573 Rigid-backed, membrane-based chip tooling
09/01/2011US20110212572 Semiconductor device support for bonding
09/01/2011US20110212571 Semiconductor device and manufacturing method thereof
09/01/2011US20110212570 Method for manufacturing semiconductor device
09/01/2011US20110212569 Method for manufacturing semiconductor device
09/01/2011US20110212568 Phase change memory devices including phase change layer formed by selective growth methods and methods of manufacturing the same
09/01/2011US20110212563 Apparatus and Method of Wafer Bonding Using Compatible Alloy
09/01/2011US20110212562 Method of producing a biosensor
09/01/2011US20110212558 Liquid crystal display device and method for manufacturing the same
09/01/2011US20110212555 Flexible substrate with electronic devices and traces