Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2011
09/06/2011US8013338 Display device and electronic device having the display device, and method for manufacturing thereof
09/06/2011US8013335 Semiconductor apparatus and fabrication method of the same
09/06/2011US8013332 Portable memory devices
09/06/2011US8013326 Organic thin film transistor substrate and method of manufacture
09/06/2011US8013256 Printed wiring board
09/06/2011US8012888 Substrate processing apparatus and semiconductor device manufacturing method
09/06/2011US8012887 Precursor addition to silicon oxide CVD for improved low temperature gapfill
09/06/2011US8012886 Leadframe treatment for enhancing adhesion of encapsulant thereto
09/06/2011US8012885 Manufacturing method of semiconductor device
09/06/2011US8012884 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
09/06/2011US8012883 One-step removal of etch photoresist/residual post-etch metal in the manufacture of optical display devices, liquid crystal displays, by using mixture of polyhyddric alcohol, water, water-miscible amine and polar solvent; optical transmittance after stripping within 10% of that before the metal layer
09/06/2011US8012882 Method of manufacturing nitride substrate for semiconductors
09/06/2011US8012881 Method for forming contact holes in semiconductor device
09/06/2011US8012880 Method of manufacturing semiconductor device
09/06/2011US8012879 Etching method using an at least semi-solid media
09/06/2011US8012878 Atomic layer volatilization process for metal layers
09/06/2011US8012877 Backside nitride removal to reduce streak defects
09/06/2011US8012876 Delivery of vapor precursor from solid source
09/06/2011US8012875 Method and apparatus for workpiece surface modification for selective material deposition
09/06/2011US8012874 Semiconductor chip substrate with multi-capacitor footprint
09/06/2011US8012873 Method for providing temperature uniformity of rapid thermal annealing
09/06/2011US8012872 Planarising damascene structures
09/06/2011US8012871 Semiconductor device and manufacturing method thereof
09/06/2011US8012870 Wiring structure between steps and wiring method thereof
09/06/2011US8012868 Semiconductor device having EMI shielding and method therefor
09/06/2011US8012867 Wafer level chip scale package system
09/06/2011US8012866 Method of bonding semiconductor devices utilizing solder balls
09/06/2011US8012865 High temperature, stable SiC device interconnects and packages having low thermal resistance
09/06/2011US8012864 Manufacturing method for interconnection having stress-absorbing layer between the semiconductor substrate and the external connection terminal
09/06/2011US8012863 Transistors with gate stacks having metal electrodes
09/06/2011US8012862 Method for manufacturing semiconductor device using plasma doping
09/06/2011US8012861 Systems and methods for preparing epitaxially textured polycrystalline films
09/06/2011US8012860 Atomic layer deposition for functionalizing colloidal and semiconductor particles
09/06/2011US8012859 Atomic layer deposition of silicon and silicon-containing films
09/06/2011US8012858 Method of fabricating semiconductor device
09/06/2011US8012857 Semiconductor die singulation method
09/06/2011US8012856 Method of producing semiconductor components
09/06/2011US8012855 Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving process
09/06/2011US8012854 Semiconductor device and manufacturing method thereof
09/06/2011US8012852 Controlled process and resulting device
09/06/2011US8012851 Method and structure for fabricating solar cells
09/06/2011US8012850 Method of manufacturing semiconductor device and semiconductor device
09/06/2011US8012849 Semiconductor device and manufacturing method thereof
09/06/2011US8012848 Trench isolation and method of fabricating trench isolation
09/06/2011US8012847 Methods of forming trench isolation in the fabrication of integrated circuitry and methods of fabricating integrated circuitry
09/06/2011US8012846 Isolation structures and methods of fabricating isolation structures
09/06/2011US8012845 Insulating film pattern, method for manufacturing the same, and method for manufacturing thin film transistor substrate using the same
09/06/2011US8012844 Method of manufacturing an integrated circuit
09/06/2011US8012843 Optimized halo or pocket cold implants
09/06/2011US8012842 Method for fabricating isolated integrated semiconductor structures
09/06/2011US8012841 Laser annealing method and laser annealing device
09/06/2011US8012840 Semiconductor device and method of manufacturing semiconductor device
09/06/2011US8012839 Method for fabricating a semiconductor device having an epitaxial channel and transistor having same
09/06/2011US8012838 Method for fabricating lateral double diffused metal oxide semiconductor (LDMOS) transistor
09/06/2011US8012837 Method of manufacturing semiconductor device
09/06/2011US8012836 Semiconductor devices and methods for fabricating the same
09/06/2011US8012835 Method of high voltage operation of field effect transistor
09/06/2011US8012834 Method of fabricating semiconductor apparatus having saddle-fin transistor and semiconductor apparatus fabricated thereby
09/06/2011US8012833 Semiconductor device and method of fabricating the same
09/06/2011US8012832 Process for manufacturing a multi-drain electronic power device integrated in semiconductor substrate and corresponding device
09/06/2011US8012831 Method of forming isolation layer of flash memory device
09/06/2011US8012830 ORO and ORPRO with bit line trench to suppress transport program disturb
09/06/2011US8012829 Semiconductor device and method of manufacturing the same
09/06/2011US8012828 Recess gate transistor
09/06/2011US8012826 Semiconductor device and manufacturing method of same
09/06/2011US8012825 Method of manufacturing the double-implant nor flash memory structure
09/06/2011US8012824 Process to make high-K transistor dielectrics
09/06/2011US8012823 Methods of fabricating stack type capacitors of semiconductor devices
09/06/2011US8012821 Semiconductor embedded resistor generation
09/06/2011US8012820 Ultra-thin SOI CMOS with raised epitaxial source and drain and embedded SiGe PFET extension
09/06/2011US8012818 Method for improving inversion layer mobility in a silicon carbide MOSFET
09/06/2011US8012817 Transistor performance improving method with metal gate
09/06/2011US8012816 Double pass formation of a deep quantum well in enhancement mode III-V devices
09/06/2011US8012815 Array substrate and method for fabricating thereof
09/06/2011US8012814 Method of forming a high performance fet and a high voltage fet on a SOI substrate
09/06/2011US8012813 Display substrate and method of manufacturing the same
09/06/2011US8012812 Semiconductor device and method for manufacturing the same
09/06/2011US8012811 Methods of forming features in integrated circuits
09/06/2011US8012810 Low parasitic capacitance bit line process for stack DRAM
09/06/2011US8012809 Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
09/06/2011US8012808 Integrated micro-channels for 3D through silicon architectures
09/06/2011US8012807 Method for producing chip packages, and chip package produced in this way
09/06/2011US8012806 Multi-directional trenching of a die in manufacturing superjunction devices
09/06/2011US8012805 Manufacturing method for semiconductor chips, and semiconductor chip
09/06/2011US8012804 Method and system for mounting lasers on energy assisted magnetic recording heads
09/06/2011US8012803 Vertically stacked pre-packaged integrated circuit chips
09/06/2011US8012802 Method of manufacturing layered chip package
09/06/2011US8012801 Flip chip mounting process and flip chip assembly
09/06/2011US8012800 Method of fabricating a stacked type chip package structure and a stacked type package structure
09/06/2011US8012799 Method of assembling semiconductor device with heat spreader
09/06/2011US8012798 Method of fabricating stacked semiconductor chips
09/06/2011US8012797 Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries
09/06/2011US8012796 Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers
09/06/2011US8012795 Method and device for fabricating an assembly of at least two microelectronic chips
09/06/2011US8012794 Capping layers for metal oxynitride TFTS
09/06/2011US8012793 Nonvolatile memory cell comprising a chalcogenide and a transition metal oxide
09/06/2011US8012791 Electronic components and methods for producing same
09/06/2011US8012790 Chemical mechanical polishing stop layer for fully amorphous phase change memory pore cell
09/06/2011US8012789 Nonvolatile memory device and method of manufacturing the same
09/06/2011US8012787 Photovoltaic device and manufacturing method thereof