Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2012
02/08/2012CN101011846B 切削装置 Cutting device
02/08/2012CN101005727B 等离子体发生用电极和等离子体处理装置 Electrode plasma generating apparatus and a plasma processing
02/07/2012USRE43159 Semiconductor light emitting device
02/07/2012US8112725 Writing pattern producing method, photomask manufacturing method, and semiconductor device manufacturing method
02/07/2012US8112183 Substrate processing apparatus and substrate processing method
02/07/2012US8112171 Substrate apparatus calibration and synchronization procedure
02/07/2012US8112167 Process controller for semiconductor manufacturing, utilizing dangerous pattern identification and process capability determination
02/07/2012US8111551 Nonvolatile semiconductor memory device having protection function for each memory block
02/07/2012US8111500 Wall crawling robots
02/07/2012US8111499 System and method of sensing and removing residual charge from a processed wafer
02/07/2012US8111378 Exposure method and apparatus, and device production method
02/07/2012US8111373 Exposure apparatus and device fabrication method
02/07/2012US8111372 Coating film forming apparatus and coating film forming method for immersion light exposure
02/07/2012US8111361 Method of fabricating liquid crystal display panels having various sizes
02/07/2012US8110933 Semiconductor device mounted structure and semiconductor device mounted method
02/07/2012US8110925 Power semiconductor component with metal contact layer and production method therefor
02/07/2012US8110918 Flexible substrate for a semiconductor package, method of manufacturing the same, and semiconductor package including flexible substrate
02/07/2012US8110915 Open cavity leadless surface mountable package for high power RF applications
02/07/2012US8110914 Wafer level package with removable chip protecting layer
02/07/2012US8110913 Integrated circuit package system with integral inner lead and paddle
02/07/2012US8110911 Semiconductor chip package with post electrodes
02/07/2012US8110909 Semiconductor package including top-surface terminals for mounting another semiconductor package
02/07/2012US8110908 Integrated circuit packaging system using bottom flip chip die bonding and method of manufacture thereof
02/07/2012US8110906 Semiconductor device including isolation layer
02/07/2012US8110905 Integrated circuit packaging system with leadframe interposer and method of manufacture thereof
02/07/2012US8110897 Semiconductor device with carbon-containing region
02/07/2012US8110891 Method of increasing deposition rate of silicon dioxide on a catalyst
02/07/2012US8110890 Method of fabricating semiconductor device isolation structure
02/07/2012US8110889 MOCVD single chamber split process for LED manufacturing
02/07/2012US8110888 Edge termination for high voltage semiconductor device
02/07/2012US8110877 Metal-insulator-semiconductor tunneling contacts having an insulative layer disposed between source/drain contacts and source/drain regions
02/07/2012US8110873 High voltage transistor
02/07/2012US8110867 Semiconductor device and method of manufacturing the same
02/07/2012US8110862 Semiconductor structure including trench capacitor and trench resistor
02/07/2012US8110856 Solid-state imaging device and method for manufacturing the same
02/07/2012US8110848 Substrate for epitaxy and method of preparing the same
02/07/2012US8110840 Light emitting apparatus and method for the same
02/07/2012US8110839 Lighting device, display, and method for manufacturing the same
02/07/2012US8110833 Display device with impurities formed within connection regions
02/07/2012US8110830 Thin film transistor array substrate and method of manufacturing the same
02/07/2012US8110800 Scanning electron microscope system and method for measuring dimensions of patterns formed on semiconductor device by using the system
02/07/2012US8110780 Photoirradiation type heat treatment apparatus
02/07/2012US8110777 Method and device for dividing a plane-parallel plate made of a brittle material into a plurality of individual plates by means of a laser
02/07/2012US8110750 Multilayer printed wiring board
02/07/2012US8110748 Wiring, display device and method of manufacturing the same
02/07/2012US8110511 Methods and systems of transferring a substrate to minimize heat loss
02/07/2012US8110510 Low temperature synthesis of nanowires in solution
02/07/2012US8110509 Method of fabricating light emitting devices
02/07/2012US8110508 Method of forming a bump structure using an etching composition for an under bump metallurgy layer
02/07/2012US8110507 Method for patterning an active region in a semiconductor device using a space patterning process
02/07/2012US8110506 Methods of forming fine patterns in semiconductor devices
02/07/2012US8110505 Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor package
02/07/2012US8110504 Method of manufacturing semiconductor device
02/07/2012US8110503 Surface preparation for thin film growth by enhanced nucleation
02/07/2012US8110502 Method of improving adhesion strength of low dielectric constant layers
02/07/2012US8110501 Method of fabricating landing plug with varied doping concentration in semiconductor device
02/07/2012US8110500 Mitigation of plating stub resonance by controlling surface roughness
02/07/2012US8110499 Method of forming a contact structure
02/07/2012US8110498 Method for passivating exposed copper surfaces in a metallization layer of a semiconductor device
02/07/2012US8110497 Method for manufacturing semiconductor device
02/07/2012US8110496 Method for performing chemical shrink process over BARC (bottom anti-reflective coating)
02/07/2012US8110495 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation
02/07/2012US8110494 Systems and methods for maximizing breakdown voltage in semiconductor devices
02/07/2012US8110493 Pulsed PECVD method for modulating hydrogen content in hard mask
02/07/2012US8110492 Method for connecting a die attach pad to a lead frame and product thereof
02/07/2012US8110491 Method of manufacturing semiconductor device and substrate processing apparatus
02/07/2012US8110490 Gate oxide leakage reduction
02/07/2012US8110489 Process for forming cobalt-containing materials
02/07/2012US8110488 Method for increasing etch rate during deep silicon dry etch
02/07/2012US8110487 Method of creating a strained channel region in a transistor by deep implantation of strain-inducing species below the channel region
02/07/2012US8110486 Method of manufacturing semiconductor wafer by forming a strain relaxation SiGe layer on an insulating layer of SOI wafer
02/07/2012US8110485 Nanocrystal silicon layer structures formed using plasma deposition technique, methods of forming the same, nonvolatile memory devices having the nanocrystal silicon layer structures, and methods of fabricating the nonvolatile memory devices
02/07/2012US8110484 Conductive nitride semiconductor substrate and method for producing the same
02/07/2012US8110483 Forming an extremely thin semiconductor-on-insulator (ETSOI) layer
02/07/2012US8110482 Miscut semipolar optoelectronic device
02/07/2012US8110481 Method of segmenting semiconductor wafer
02/07/2012US8110480 Method and structure for fabricating solar cells using a thick layer transfer process
02/07/2012US8110479 Manufacturing method of SOI substrate provided with barrier layer
02/07/2012US8110478 Method for manufacturing semiconductor substrate, display panel, and display device
02/07/2012US8110477 Semiconductor device and method of forming high-frequency circuit structure and method thereof
02/07/2012US8110476 Memory cell that includes a carbon-based memory element and methods of forming the same
02/07/2012US8110475 Method for forming a memory device with C-shaped deep trench capacitors
02/07/2012US8110474 Method of making micromodules including integrated thin film inductors
02/07/2012US8110473 Semiconductor device comprising multilayer dielectric film and related method
02/07/2012US8110472 High power and high temperature semiconductor power devices protected by non-uniform ballasted sources
02/07/2012US8110471 Semiconductor device having a round-shaped nano-wire transistor channel and method of manufacturing same
02/07/2012US8110470 Asymmetrical transistor device and method of fabrication
02/07/2012US8110469 Graded dielectric layers
02/07/2012US8110468 DMOS-transistor having improved dielectric strength of drain and source voltages
02/07/2012US8110467 Multiple Vt field-effect transistor devices
02/07/2012US8110466 Cross OD FinFET patterning
02/07/2012US8110465 Field effect transistor having an asymmetric gate electrode
02/07/2012US8110464 SOI protection for buried plate implant and DT bottle ETCH
02/07/2012US8110463 Method of fabricating semiconductor device
02/07/2012US8110462 Reduced finger end MOSFET breakdown voltage (BV) for electrostatic discharge (ESD) protection
02/07/2012US8110461 Flash memory device and manufacturing method of the same
02/07/2012US8110460 Method for producing stacked and self-aligned components on a substrate
02/07/2012US8110459 MOSFET having a channel region with enhanced stress and method of forming same
02/07/2012US8110458 Fabrication of germanium nanowire transistors
02/07/2012US8110457 Method of manufacturing semiconductor device