| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/31/2012 | US8105850 Process for selectively patterning a magnetic film structure |
| 01/31/2012 | US8105765 Method of manufacturing a semiconductor device |
| 01/31/2012 | US8105757 Method of making a semiconductor device |
| 01/31/2012 | US8105524 Compression molding method for electronic component and compression molding apparatus employed therefor |
| 01/31/2012 | US8105445 Method and apparatus for fast and local anneal of anti-ferromagnetic (AF) exchange-biased magnetic stacks |
| 01/31/2012 | US8105440 Method of cleaning a CVD device |
| 01/31/2012 | US8105437 Method and system for large scale manufacture of thin film photovoltaic devices using multi-chamber configuration |
| 01/31/2012 | US8105435 Beam homogenizer and laser irradiation apparatus and method of manufacturing semiconductor device |
| 01/31/2012 | US8105063 Three piece mold cavity design for packaging integrated circuits |
| 01/31/2012 | US8104951 Temperature uniformity measurements during rapid thermal processing |
| 01/31/2012 | US8104863 Method for the printing of homogeneous electronic material with a multi-ejector print head |
| 01/31/2012 | US8104428 Plasma processing apparatus |
| 01/31/2012 | US8104354 Capacitive sensor and manufacturing method thereof |
| 01/31/2012 | CA2543909C High temperature electronic devices |
| 01/26/2012 | WO2012012795A1 In-line metrology system and method |
| 01/26/2012 | WO2012012745A2 Hermetically sealed electronic device using solder bonding |
| 01/26/2012 | WO2012012699A1 Platen cleaning |
| 01/26/2012 | WO2012012691A2 Nonvolatile flash memory structures including fullerene molecules and methods for manufacturing the same |
| 01/26/2012 | WO2012012457A2 Polycrystalline silicon production |
| 01/26/2012 | WO2012012384A1 Polycrystalline aluminum nitride material and method of production thereof |
| 01/26/2012 | WO2012012381A1 Treating surface of substrate using inert gas plasma in atomic layer deposition |
| 01/26/2012 | WO2012012335A2 Ultrasonic bonding systems including workholder and ribbon feeding system |
| 01/26/2012 | WO2012012323A2 Stackable molded microelectronic packages |
| 01/26/2012 | WO2012012321A2 Stackable molded microelectronic packages with area array unit connectors |
| 01/26/2012 | WO2012012220A2 Metal-contamination -free through-substrate via structure |
| 01/26/2012 | WO2012012167A1 Methods of forming a floating junction on a solar cell with a particle masking layer |
| 01/26/2012 | WO2012012166A1 Methods of forming a metal contact on a silicon substrate |
| 01/26/2012 | WO2012012154A2 Method of fabricating isolated capacitors and structure thereof |
| 01/26/2012 | WO2012012138A2 Method for finishing silicon on insulator substrates |
| 01/26/2012 | WO2012012132A1 Lead foil loop formation |
| 01/26/2012 | WO2012012056A2 Substrate holder to reduce substrate edge stress during chemical mechanical polishing |
| 01/26/2012 | WO2012012052A2 Endpoint control during chemical mechanical polishing by detecting interface between different layers through selectivity change |
| 01/26/2012 | WO2012012031A1 Electronic device structure including a buffer layer on a base layer |
| 01/26/2012 | WO2012012026A2 Metal film deposition |
| 01/26/2012 | WO2012011931A1 Microelectronic elements having metallic pads overlying vias |
| 01/26/2012 | WO2012011930A1 Non-lithographic formation of three-dimensional conductive elements |
| 01/26/2012 | WO2012011929A1 Active chip on carrier or laminated chip having microelectronic element embedded therein |
| 01/26/2012 | WO2012011928A1 Microelectronic elements with rear contacts connected with via first or via middle structures |
| 01/26/2012 | WO2012011629A1 Multi-cantilever beam structure of probe card and manufacturing method therefor |
| 01/26/2012 | WO2012011628A1 Probe card and manufacturing method therefor |
| 01/26/2012 | WO2012011627A1 Probe card and manufacturing method therefor |
| 01/26/2012 | WO2012011539A1 Cu alloy film for display device, and display device |
| 01/26/2012 | WO2012011536A1 Semiconductor device |
| 01/26/2012 | WO2012011535A1 Substrate processing device |
| 01/26/2012 | WO2012011512A1 Exposure method, exposure apparatus and cleaning method |
| 01/26/2012 | WO2012011497A1 Light irradiation device for exposure apparatus, method for controlling light irradiation device, exposure apparatus, and exposure method |
| 01/26/2012 | WO2012011488A1 Placing table structure and processing apparatus |
| 01/26/2012 | WO2012011480A1 Interlayer insulating layer formation method and semiconductor device |
| 01/26/2012 | WO2012011457A1 Anisotropic conductive film, connection structure body, and processes for production of these materials |
| 01/26/2012 | WO2012011446A1 Laser processing method |
| 01/26/2012 | WO2012011423A1 Device for treating substrate and method for producing semiconductor device |
| 01/26/2012 | WO2012011411A1 Fluid processing device and fluid processing method |
| 01/26/2012 | WO2012011397A1 Substrate heating furnace |
| 01/26/2012 | WO2012011372A1 Fluorite |
| 01/26/2012 | WO2012011258A1 Substrate and process for production thereof, and display device |
| 01/26/2012 | WO2012011230A1 Method for filling through hole of substrate with metal and substrate |
| 01/26/2012 | WO2012011225A1 Semiconductor device and method for manufacturing same |
| 01/26/2012 | WO2012011207A1 Semiconductor device manufacturing method comprising step of removing pad electrode for inspection |
| 01/26/2012 | WO2012011203A1 Apparatus for heat-treating semiconductor substrate |
| 01/26/2012 | WO2012011202A1 Laser lift-off method and laser lift-off apparatus |
| 01/26/2012 | WO2012011171A1 Etching device |
| 01/26/2012 | WO2012011161A1 Semiconductor storage device |
| 01/26/2012 | WO2012011149A1 Power input device and vacuum processing apparatus using power input device |
| 01/26/2012 | WO2012011005A2 Device for holding wafer shaped articles |
| 01/26/2012 | WO2012010934A1 Method for optimising cell variant selection within a design process for an integrated circuit device |
| 01/26/2012 | WO2012010816A1 Method of fabrication of semiconductor device |
| 01/26/2012 | WO2012010812A1 Process for producing an integrated circuit |
| 01/26/2012 | WO2012010662A2 Process for direct bonding two elements comprising copper portions and dielectric materials |
| 01/26/2012 | WO2012010517A1 A method and apparatus for bonding together two wafers by molecular adhesion |
| 01/26/2012 | WO2012010479A1 Method and structure to improve the conductivity of narrow copper filled vias |
| 01/26/2012 | WO2012010473A1 Device and process for forming, on a nanowire made of a semiconductor, an alloy of this semiconductor with a metal or metalloid |
| 01/26/2012 | WO2012010186A1 Handling device for handling a wafer |
| 01/26/2012 | WO2012010139A2 Precision machine tool |
| 01/26/2012 | WO2012009968A1 Photoresist cleaning solution |
| 01/26/2012 | WO2012009941A1 Cleaning method of multi-layered copper wiring of super-large-scale integrated circuit after chemical-mechanical-polishing |
| 01/26/2012 | WO2012009940A1 Surface cleaning method after chemical mechanical polishing(cmp) of super large scale integration plugged by tungsten |
| 01/26/2012 | WO2012009939A1 Processing method for cleaning wafer surface after polishing aluminum wiring of vlsi |
| 01/26/2012 | WO2012009938A1 Anti-oxidation method for multilayer wiring of ultra large scale integrated circuit after alkaline polishing |
| 01/26/2012 | WO2012009937A1 Low-pressure chemical-mechanical polishing method for surface of copper wiring in ultra-large scale integrated circuit |
| 01/26/2012 | WO2012009927A1 Process for producing soi super junction ldmos structure completely eliminating effect of substrate assisted depletion |
| 01/26/2012 | WO2012009864A1 Mounting method for integrated circuit chip |
| 01/26/2012 | WO2012009831A1 Wiring board and manufacturing method thereof |
| 01/26/2012 | WO2011149790A3 Component temperature control by coolant flow control and heater duty cycle control |
| 01/26/2012 | WO2011142850A3 Etchant-free methods of producing a gap between two layers, and devices produced thereby |
| 01/26/2012 | WO2011141516A3 Method and apparatus to control surface texture modification of silicon wafers for photovoltaic cell devices |
| 01/26/2012 | WO2011139435A3 High-temperature selective dry etch having reduced post-etch solid residue |
| 01/26/2012 | WO2011139039A3 Gas discharge unit, manufacturing method for the same, and substrate processing apparatus having the same |
| 01/26/2012 | WO2011132903A3 Plasma processing apparatus |
| 01/26/2012 | WO2011132885A3 Substrate processing apparatus |
| 01/26/2012 | WO2011132867A3 Sputter target having stepped structure and sputtering device using same |
| 01/26/2012 | WO2011130252A3 Ball-grid array device having chip assembled on half-etched metal leadframe |
| 01/26/2012 | WO2011126770A3 Ldmos with no reverse recovery |
| 01/26/2012 | WO2011126680A3 Methods of forming a plurality of spaced features |
| 01/26/2012 | WO2011122882A3 Semiconductor template substrate, light-emitting element using a semiconductor template substrate, and a production method therefor |
| 01/26/2012 | WO2011119952A3 Integrated system for vapor generation and thin film deposition |
| 01/26/2012 | WO2011118911A3 Pad for touch panel and touch panel using same |
| 01/26/2012 | WO2011109078A3 Cleaning solution for sidewall polymer of damascene processes |
| 01/26/2012 | WO2011087485A3 Microelectronic assembly with joined bond elements having lowered inductance |
| 01/26/2012 | WO2011084531A9 Mobile vacuum carriers for thin wafer processing |
| 01/26/2012 | WO2010149294A3 Method for producing a ewt solar cell |