Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2012
02/08/2012CN102347356A Semiconductor device having switching element and free wheel diode and method for controlling the same
02/08/2012CN102347355A Method of minimizing field stop insulated gate bipolar transistor (igbt) buffer and emitter charge variation
02/08/2012CN102347354A Germanium-silicon heterojunction bipolar transistor and manufacturing method thereof
02/08/2012CN102347352A Semiconductor device and method of manufacturing semiconductor device
02/08/2012CN102347351A High surface dopant concentration semiconductor device and method of fabricating
02/08/2012CN102347350A Semiconductor structure and manufacturing method thereof
02/08/2012CN102347349A Semiconductor structure and manufacturing method thereof
02/08/2012CN102347335A Display substrate and method of manufacturing same
02/08/2012CN102347334A Semiconductor memory device and manufacturing method thereof
02/08/2012CN102347333A One time programmable read only memory (OTPROM), manufacturing method and operation method thereof
02/08/2012CN102347332A Three-dimensional multivalue nonvolatile memory structure
02/08/2012CN102347331A Semiconductor device and method for manufacturing same
02/08/2012CN102347330A Semiconductor device and manufacture method thereof
02/08/2012CN102347329A Semiconductor device and manufacturing method thereof
02/08/2012CN102347327A Array substrate and manufacturing method thereof, and liquid crystal display (LCD) panel
02/08/2012CN102347320A 装置及其制造方法 Apparatus and manufacturing method thereof
02/08/2012CN102347315A Ceramic electronic component and wiring board
02/08/2012CN102347312A Semiconductor device cover mark
02/08/2012CN102347311A Semiconductor device and a manufacturing method therefor
02/08/2012CN102347310A Semiconductor device and method of driving the same
02/08/2012CN102347309A Electric fuse structure and formation method thereof
02/08/2012CN102347307A Circuit board and manufacturing method thereof, circuit device and manufacturing method thereof, and conductive foil provided with insulating layer
02/08/2012CN102347304A Leadless chip carrier with improved installability
02/08/2012CN102347303A Packaging body formed by piling multiple chips and manufacturing method thereof
02/08/2012CN102347302A Semiconductor device and method of designing a wiring of a semiconductor device
02/08/2012CN102347300A Chip package and fabricating method thereof
02/08/2012CN102347299A Wafer level chip scale package
02/08/2012CN102347298A Bump structure on substrate and forming method of bump structure
02/08/2012CN102347295A Power semiconductor module and method for producing same
02/08/2012CN102347291A Semiconductor device and method of manufacturing same
02/08/2012CN102347284A Semiconductor element and forming method
02/08/2012CN102347283A Microelectronic elements having metallic pads overlying vias
02/08/2012CN102347282A Semiconductor device comprising a passive component of capacitors and process for fabrication
02/08/2012CN102347281A Split-gate flash memory unit and forming method thereof
02/08/2012CN102347280A Method for forming semiconductor device structure
02/08/2012CN102347279A Silicon groove lithography process and mask suitable for same
02/08/2012CN102347278A Method for fabricating trench metal oxide semiconductor field effect transistor
02/08/2012CN102347277A Semiconductor device structure and manufacturing method thereof
02/08/2012CN102347276A Cutting method
02/08/2012CN102347275A Method for sharpening blade of scribing machine
02/08/2012CN102347274A Method for manufacturing thin film transistor array panel and method for reducing impurity effect
02/08/2012CN102347273A Semiconductor device producing method
02/08/2012CN102347272A Method of forming rdl and semiconductor device
02/08/2012CN102347271A Methods of forming semiconductor elements using micro-abrasive particle stream
02/08/2012CN102347270A Method for manufacturing contact plug
02/08/2012CN102347269A Fuse structure and method for forming the same
02/08/2012CN102347268A Method for producing semiconductor device
02/08/2012CN102347267A High-quality SGOI (SiGe-on insulator) produced by utilizing material with superlattice structure and production method of high-quality SGOI
02/08/2012CN102347266A Trench-filling method and film-forming system
02/08/2012CN102347265A Method for preventing punch through voltage reduction of memory and memory thereof
02/08/2012CN102347264A Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production
02/08/2012CN102347263A Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
02/08/2012CN102347262A Electronic component conveying device and mounting machine
02/08/2012CN102347261A Silicon chip transmission system layout structure
02/08/2012CN102347260A Method and device for controlling interlocking linkage in wafer transfer system
02/08/2012CN102347259A Super clean microenvironment device
02/08/2012CN102347258A Base used for semiconductor epitaxial system
02/08/2012CN102347257A Ion supply device and workpiece processing system provided with the same
02/08/2012CN102347256A Vacuum processor
02/08/2012CN102347255A Alignment detection method for thin film transistor
02/08/2012CN102347254A Thermal compress bonding
02/08/2012CN102347253A Semiconductor device and method of forming rdl over contact pad
02/08/2012CN102347252A Bonding structure and method
02/08/2012CN102347251A Embedded wafer-level bonding approaches
02/08/2012CN102347250A Forming method and device of bump structure
02/08/2012CN102347249A Head exchange mechanism for bonding slice bonding head
02/08/2012CN102347248A IC (integrated circuit) plastic package process with low-speed stamping die and high packaging pressure
02/08/2012CN102347247A Adjustable chip package mold
02/08/2012CN102347246A Method for encapsulating chip with excellent radiating performance
02/08/2012CN102347245A Method of manufacturing circuit device
02/08/2012CN102347244A Resin sealing device and manufacturing method for resin sealing electronic component
02/08/2012CN102347243A Semiconductor device and method for manufacturing the same
02/08/2012CN102347242A Method for encapsulating multiple chips with small sizes
02/08/2012CN102347241A Heat sink device and method of repairing semiconductor device
02/08/2012CN102347240A Manufacture technology for multiple types of diodes used for automobiles
02/08/2012CN102347239A Light-emitting diode assembly and packaging method thereof
02/08/2012CN102347238A Method for manufacturing semiconductor device structure with P-type polysilicon gate
02/08/2012CN102347237A Method for manufacturing semiconductor device structure comprising stress layer
02/08/2012CN102347236A Methods for manufacturing doped well and transistor comprising doped well
02/08/2012CN102347235A Strain semiconductor channel formation method and semiconductor device
02/08/2012CN102347234A Structure of semiconductor device and manufacturing method thereof
02/08/2012CN102347233A Method and tray for improving thickness evenness of silicon wafer in process of backlining the silicon wafer
02/08/2012CN102347232A Dry etching method of silicon
02/08/2012CN102347231A Plasma processing method and plasma processing apparatus
02/08/2012CN102347230A Plasma processing method and plasma processing apparatus
02/08/2012CN102347229A Semiconductor devices and method of forming the same
02/08/2012CN102347228A Method of forming gate trench and method of manufacturing trench mosfet structure
02/08/2012CN102347227A Metal gate formation method
02/08/2012CN102347226A Semiconductor device and manufacture method thereof
02/08/2012CN102347225A Laser process for side plating of terminals
02/08/2012CN102347224A Wafer gap positioning device used in implanter
02/08/2012CN102347223A Method for doping silicon wafer with colloidal silicon nano particles
02/08/2012CN102347222A Phosphorous diffusion technology for polysilicon sheet
02/08/2012CN102347221A Rheotaxial preparation method of gallium antimonide quantum dot
02/08/2012CN102347220A Trench superjunction mosfet with thin epi process
02/08/2012CN102347219A Method for forming composite functional material structure
02/08/2012CN102347218A Method of pitch dimension shrinkage
02/08/2012CN102347217A Method for making fine pattern on semiconductor device
02/08/2012CN102347216A Method of manufacturing semiconductor device using acid diffusion
02/08/2012CN102347215A Method for protecting a semiconductor device against degradation, a semiconductor device and a manufacturing method therefor
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