Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2012
02/15/2012CN102356186A Germanium ingots/wafers having low micro-pit density (mpd) as well as systems and methods for manufacturing same
02/15/2012CN102356179A Tantalum sputtering target
02/15/2012CN102356137A Pressure-sensitive adhesive and pressure-sensitive adhesive sheet
02/15/2012CN102355982A Method for chamfering wafer
02/15/2012CN102355960A Apparatus and method for cleaning thin film solar cell panel by jetting high-pressure liquid
02/15/2012CN102355796A Manufacturing method of novel aluminum substrate
02/15/2012CN102355793A Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
02/15/2012CN102354708A Tunneling field effect transistor structure with suspended source and drain regions and forming method thereof
02/15/2012CN102354704A Schottky diode with high reverse-blocking performance and manufacturing method thereof
02/15/2012CN102354695A 显示器及其制作方法 Display and production methods
02/15/2012CN102354692A Wafer and a method of dicing a wafer
02/15/2012CN102354691A Quad flat non-lead (QFN) package with high density and manufacturing method
02/15/2012CN102354689A Quad flat non-lead (QFN) package with leads arranged in plane array and manufacturing method
02/15/2012CN102354687A Barrier medium material used for thick film circuit and preparation method thereof
02/15/2012CN102354686A 60V high-side LDNMOS (Lateral Dispersion N-channel Metal Oxide Semiconductor) structure and manufacturing method thereof
02/15/2012CN102354685A Integrated circuit including power diode
02/15/2012CN102354684A Wiring structure forming method
02/15/2012CN102354683A Method for manufacturing semiconductor device
02/15/2012CN102354682A Method for manufacturing semiconductor device
02/15/2012CN102354681A Method for manufacturing semiconductor device
02/15/2012CN102354680A Field oxide wet etching method and semiconductor device
02/15/2012CN102354679A Production method of shallow trench isolation
02/15/2012CN102354678A Silicon-on-insulator (SOI) structures with step-type buried oxide layers
02/15/2012CN102354677A Solar module decomposing equipment and rotary clamp thereof
02/15/2012CN102354676A Graphite boat
02/15/2012CN102354675A Vertical processing device and method of wafer
02/15/2012CN102354674A Process control method of multi-process machine table
02/15/2012CN102354673A Substrate temperature control method
02/15/2012CN102354672A Gas conveying device
02/15/2012CN102354671A Methods for selecting test path and testing wafer
02/15/2012CN102354670A Comprehensive surface processing method for improving capsulation reliability of semiconductor
02/15/2012CN102354669A Production method of silicon nano-wire device
02/15/2012CN102354668A Preparation method of carbon-based nanometer material transistor
02/15/2012CN102354667A Power metal-oxide semiconductor device forming method
02/15/2012CN102354666A HEMT (high electron mobility transistor) device of T-shaped gate and manufacturing method thereof
02/15/2012CN102354665A Annealing device with built-in photoresist detection unit and photoresist detection method
02/15/2012CN102354664A Intermetallic dielectric layer forming method and semiconductor device
02/15/2012CN102354663A Method for etching silicon chip
02/15/2012CN102354662A Method for cleaning positive (P) surface of chip of semiconductor laser and polishing negative (N) surface
02/15/2012CN102354661A Silicon slice thinning method based on metal nano particle catalysis
02/15/2012CN102354660A Trench metal oxide semiconductor (TMOS) grid electrode structure and forming method thereof
02/15/2012CN102354659A Method for eliminating nucleation on mask and selective epitaxial growth method
02/15/2012CN102354658A Method of manufacturing thin film transistor
02/15/2012CN102354657A Method for repairing defect of oxide semiconductor layer
02/15/2012CN102354531A Methods for identifying non-volatile memory elements with poor subthreshold slope or weak transconductance
02/15/2012CN102354067A Liquid crystal display device and manufacturing method of liquid crystal display device
02/15/2012CN102352492A Gas injection device with cooling system
02/15/2012CN102352187A Polishing slurry for metal films and polishing method
02/15/2012CN102352090A Flame retarded epoxy resin composite material
02/15/2012CN102351169A Systems and methods for nanowire growth and harvesting
02/15/2012CN102350712A Hand mold for removing defective product
02/15/2012CN102157395B 电子标签卷收卷工艺及其装置 Electronic label roll rewinding process and apparatus
02/15/2012CN102064120B Soldering flux-free reflow technological method based on indium bumps
02/15/2012CN102049730B Wafer replacing device used in chemical mechanical polishing equipment
02/15/2012CN101969038B 支承一组集成电路单元的支承装置 Supporting means for supporting a set of integrated circuit units
02/15/2012CN101946332B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/15/2012CN101934496B 化学机械抛光机及具有它的化学机械抛光设备 Chemical mechanical polishing machine and it has a chemical mechanical polishing apparatus
02/15/2012CN101924019B 半导体器件中金属电容的制备方法 The semiconductor device production method of the metal capacitor
02/15/2012CN101913553B 一种体硅刻蚀和金硅键合复合工艺方法 As a bulk silicon etching and gold process for silicon-bonded complexes
02/15/2012CN101913552B 一种基于铝牺牲层工艺的悬浮微敏感结构制备方法 Micro-sensitive structure suspension preparation method based on aluminum sacrificial layer technology
02/15/2012CN101897004B 半导体基板以及半导体基板的制造方法 The method of manufacturing a semiconductor substrate, a semiconductor substrate, and
02/15/2012CN101894835B 像素结构及其制作方法 Pixel structure and manufacturing method thereof
02/15/2012CN101894774B 电子部件安装方法和电子部件安装装置 Electronic component mounting method and an electronic component mounting apparatus
02/15/2012CN101863015B 多关节机器人 Multi-joint robot
02/15/2012CN101853819B 芯片制作工艺 Chip production process
02/15/2012CN101853811B 半导体装置的制造方法 The method of manufacturing a semiconductor device
02/15/2012CN101840876B 产品验证系统 Product Verification system
02/15/2012CN101840865B 一种薄膜晶体管的制造方法及用该方法制造的晶体管 A method of manufacturing a thin film transistor and a transistor manufactured by the method
02/15/2012CN101840857B 形成沟槽及双镶嵌结构的方法 Method and dual damascene trench structure is formed
02/15/2012CN101834154B 校正系统、校正方法与晶片盒 Correction system, the correction method of the wafer cassette
02/15/2012CN101789380B 内埋芯片封装的结构及工艺 Structure and Process buried chip package
02/15/2012CN101770989B 半导体结构的形成方法 The method for forming a semiconductor structure
02/15/2012CN101770943B 感应等离子体掺杂 Induction plasma doping
02/15/2012CN101752335B 半导体装置以及半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device
02/15/2012CN101743632B 薄板输送装置、薄板处理输送系统及薄板输送方法 Sheet conveying means for conveying the sheet handling system and a sheet conveying method
02/15/2012CN101740616B 一种ggnmos器件及其制造方法 One kind ggnmos device and manufacturing method
02/15/2012CN101740409B 一种二极管引线烧焊方法及二极管 Welding method leads to a diode and diode
02/15/2012CN101728397B 主动元件阵列基板及其检测方法 Active device array substrate and detection methods
02/15/2012CN101728362B 三维集成电路的堆叠接合界面结构 Stacking bonding interface structure of three-dimensional integrated circuits
02/15/2012CN101689484B 失配衬底上的单晶生长 Mismatched on the bottom of the single crystal growth
02/15/2012CN101670546B 抛光半导体晶圆的方法 The method of polishing a semiconductor wafer
02/15/2012CN101669193B Soi衬底及其制造方法和半导体器件 Soi substrate and the semiconductor device and manufacturing method thereof
02/15/2012CN101656236B 副安装座及其制造方法 Submount and its manufacturing method
02/15/2012CN101628398B 多层化学机械抛光垫的制造方法 The method of manufacturing a multilayer chemical mechanical polishing pad
02/15/2012CN101626034B 薄膜晶体管及其制造方法 A thin film transistor and its manufacturing method
02/15/2012CN101615582B 一种合金氧化物透明薄膜晶体管的制备方法 Preparation of an alloy of the oxide transparent thin film transistor
02/15/2012CN101604702B 有机电子器件的垂直互连 Vertical interconnects organic electronic devices
02/15/2012CN101577237B 包括第一和第二支座的半导体装置和方法 Includes a semiconductor device and a method of the first and second bearing
02/15/2012CN101510556B 一种双层高介电常数栅介质薄膜及其制备方法 A two-layer high-k gate dielectric film and preparation method
02/15/2012CN101501151B 粘接剂组合物和电路部件的连接结构 Connection structure adhesive composition and the circuit member
02/15/2012CN101457045B 导体图案形成用墨水、导体图案以及配线基板 A conductor pattern is formed with ink, the conductor pattern, and the wiring substrate
02/15/2012CN101452871B Sti隔离结构的制备方法 Preparation Sti isolation structure
02/15/2012CN101419928B 工件收纳搬送装置和具有该工件收纳搬送装置的切削装置 A workpiece conveying means and the container having a container of the workpiece conveying means in the cutting means
02/15/2012CN101399243B 半导体封装及半导体封装的制造方法 The method of manufacturing a semiconductor package and a semiconductor package
02/15/2012CN101378061B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/15/2012CN101353810B 用于对半导体晶片执行清洗的方法及装置 The method of implementation of the semiconductor wafer cleaning and apparatus for
02/15/2012CN101326632B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/15/2012CN101326257B 用于控制抛光选择性的辅助剂以及包含该辅助剂的化学机械抛光浆料 The chemical mechanical polishing slurry for controlling the polishing selectivity of the adjuvant and adjuvant containing
02/15/2012CN101303984B 半导体装置的制造方法 The method of manufacturing a semiconductor device
02/15/2012CN101296787B 脆性材料基板的划线形成方法及划线形成装置 Means forming a brittle material substrate scribing method for forming a scribe line, and
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