Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2012
02/09/2012US20120032293 Edge devices layout for improved performance
02/09/2012US20120032290 Solid-state imaging device and method for manufacturing the same
02/09/2012US20120032289 Magnetic memory device and method of manufacturing the same
02/09/2012US20120032288 Magnetoresistive element and method of manufacturing the same
02/09/2012US20120032287 MRAM Device and Integration Techniques Compatible with Logic Integration
02/09/2012US20120032286 Three dimensional folded mems technology for multi-axis sensor systems
02/09/2012US20120032284 Film for resin spacer, light-receiving device and method for manufacturing same, and mems device and method for manufacturing same
02/09/2012US20120032283 Sensor module
02/09/2012US20120032282 Microelectromechanical system (mems) carrier and method of fabricating the same
02/09/2012US20120032281 Semiconductor device production method and semiconductor device
02/09/2012US20120032280 MOS TRANSISTORS INCLUDING SiON GATE DIELECTRIC WITH ENHANCED NITROGEN CONCENTRATION AT ITS SIDEWALLS
02/09/2012US20120032278 Shallow pn junction formed by in situ doping during selective growth of an embedded semiconductor alloy by a cyclic growth/etch deposition process
02/09/2012US20120032275 Metal semiconductor alloy structure for low contact resistance
02/09/2012US20120032274 Vertically Stacked FETs With Series Bipolar Junction Transistor
02/09/2012US20120032273 Semiconductor device
02/09/2012US20120032271 High density semiconductor inverter
02/09/2012US20120032267 Device and method for uniform sti recess
02/09/2012US20120032266 Semiconductor device and method of manufacturing the same
02/09/2012US20120032264 High density semiconductor latch
02/09/2012US20120032263 Semiconductor device and method of producing same
02/09/2012US20120032262 Enhanced hvpmos
02/09/2012US20120032259 Bottom source power mosfet with substrateless and manufacturing method thereof
02/09/2012US20120032254 Esd protection device and method for fabricating the same
02/09/2012US20120032249 Nonvolatile semiconductor memory device and method for manufacturing nonvolatile semiconductor memory device
02/09/2012US20120032247 Nonvolatile semiconductor memory device and method of manufacturing the same
02/09/2012US20120032246 Nonvolatile semiconductor memory device and method of manufacturing the same
02/09/2012US20120032242 Semiconductor device and manufacturing method thereof
02/09/2012US20120032240 Semiconductor device and manufacturing method thereof
02/09/2012US20120032239 Method for introducing channel stress and field effect transistor fabricated by the same
02/09/2012US20120032238 Contact etch stop layers of a field effect transistor
02/09/2012US20120032234 Antiphase Domain Boundary-Free III-V Compound Semiconductor Material on Semiconductor Substrate and Method for Manufacturing Thereof
02/09/2012US20120032233 Silicon-germanium heterojunction bipolar transistor and manufacturing method of the same
02/09/2012US20120032231 Mos transistor structure with in-situ doped source and drain and method for forming the same
02/09/2012US20120032230 Method of forming strained semiconductor channel and semiconductor device
02/09/2012US20120032227 Low voltage tunnel field-effect transistor (tfet) and method of making same
02/09/2012US20120032225 Semiconductor light emitting device and method for producing the same
02/09/2012US20120032212 Method of light emitting diode sidewall passivation
02/09/2012US20120032206 Variable height light emitting diode and method of manufacture
02/09/2012US20120032205 Microdisplay packaging system
02/09/2012US20120032199 Element Substrate and Light-Emitting Device
02/09/2012US20120032191 Method for manufacturing silicon carbide substrate and silicon carbide substrate
02/09/2012US20120032190 Package and fabrication method of the same
02/09/2012US20120032188 Compound semiconductor device and method of manufacturing the same
02/09/2012US20120032185 LEAKAGE BARRIER FOR GaN BASED HEMT ACTIVE DEVICE
02/09/2012US20120032182 Solid state lights with thermal control elements
02/09/2012US20120032181 Semiconductor device and display device
02/09/2012US20120032180 Thin-film transistor device and method of manufacturing the same
02/09/2012US20120032179 Thin-film transistor array device, organic el display device, and method of manufacturing thin-film transistor array device
02/09/2012US20120032167 Semiconductor package and method of testing same
02/09/2012US20120032166 HETERO pn JUNCTION SEMICONDUCTOR AND PROCESS FOR PRODUCING THE SAME
02/09/2012US20120032165 Aqueous solution composition for fluorine doped metal oxide semiconductor and thin film transistor including the same
02/09/2012US20120032163 Semiconductor device and method for manufacturing the same
02/09/2012US20120032159 Display device and manufacturing method of display device
02/09/2012US20120032150 Semiconductor component, method of producing a semiconductor component, semiconductor device
02/09/2012US20120032149 Vertical Stacking of Carbon Nanotube Arrays for Current Enhancement and Control
02/09/2012US20120032146 Apparatus and methods for improving parallel conduction in a quantum well device
02/09/2012US20120032136 Forming Resistive Random Access Memories Together With Fuse Arrays
02/09/2012US20120032134 Memristive Junction with Intrinsic Rectifier
02/09/2012US20120031650 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
02/09/2012US20120031560 Plasma processing apparatus
02/09/2012US20120031559 Dual Plasma Volume Processing Apparatus for Neutral/Ion Flux Control
02/09/2012US20120031434 Substrate cleaning method
02/09/2012US20120031333 Vertical inline cvd system
02/09/2012US20120031332 Water cooled gas injector
02/09/2012US20120031331 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
02/09/2012US20120031192 Semiconductor strain gauge array
02/09/2012US20120031186 Inertial sensor and method for manufacturing an inertial sensor
02/09/2012DE112010001315T5 LDMOS mit selbstausgerichteter vertikaler LDD und rückseitiger Drain LDMOS with self-aligned vertical LDD and rear-side drain
02/09/2012DE102011109295A1 Providing semiconductor chip package with solder wettable plating, comprises separating chip package, immersing in bath, contacting connecting contact pad with conductive contact material connected to cathode electrical, and plating
02/09/2012DE102011080360A1 Halbleitervorrichtung, Halbleiterschaltungssubstrat und Verfahren zur Herstellung eines Halbleiterschaltungssubstrats A semiconductor device, semiconductor circuit substrate and method for fabricating a semiconductor circuit substrate
02/09/2012DE102011052530A1 Strukturmessgerät und Strukturmessverfahren Structure gauge and structure measurement method
02/09/2012DE102011002534A1 Chippaket umfassend eine Vielzahl von Chips und Leiterausrichtung Chip package comprising a plurality of chips and circuit alignment
02/09/2012DE102010046213B3 Verfahren zur Herstellung eines Strukturelements und Halbleiterbauelement mit einem Strukturelement A process for producing a structural element and semiconductor device having a structural element
02/09/2012DE102010039063A1 Sensormodul mit einem elektromagnetisch abgeschirmten elektrischen Bauteil Sensor module with an electromagnetically shielded electrical component
02/09/2012DE102010036893A1 Herstellungsverfahren einer Halbleitervorrichtung und Halbleitervorrichtung Manufacturing method of a semiconductor device and semiconductor device
02/09/2012DE102010033705A1 Test system for testing magnetic characterization of semiconductor component e.g. Hall sensor, has an arrangement for creating magnetic field, comprising a coil with iron core and calibrated magnetic field sensor attached to iron core
02/09/2012DE102010033303A1 Vorrichtung zum Schließen und Öffnen einer Be-/Entladeöffnung einer Prozesskammer A device for closing and opening a loading / unloading a process chamber
02/09/2012DE102010033284A1 Method for producing arrangement of electronic component e.g. microelectro mechanical system (MEMS) chip, involves partially removing support elements, such that supporting elements are in non-contact state with respect to component
02/09/2012DE102010029533B3 Selektive Größenreduzierung von Kontaktelementen in einem Halbleiterbauelement Selective size reduction of contact elements in a semiconductor device
02/09/2012DE102010028466B4 Verfahren zum Bewahren der Integrität eines Gatestapels mit großem ε nach Einbettung in ein Verspannungsmaterial unter Anwendung einer Beschichtung Method for preserving the integrity of a gate stack with large ε after embedding in a bracing material using a coating
02/09/2012DE102009055433B4 Kontaktelemente von Halbleiterbauelementen, die auf der Grundlage einer teilweise aufgebrachten Aktivierungsschicht hergestellt sind, und entsprechende Herstellungsverfahren Contact elements of semiconductor devices that are formed on the basis of a partially applied activation layer, and corresponding production method
02/09/2012DE102007013737B4 Verfahren zur Herstellung eines Substrats mit Substratkern für eine elektronische Baugruppe A method for producing a substrate with substrate core for an electronic assembly
02/09/2012DE102006057352B4 Halbleitervorrichtungen und Verfahren zu ihrer Herstellung Semiconductor devices and processes for their preparation
02/09/2012DE102006045126B4 Verfahren zur Herstellung einer Anschlusselektrode für zwei übereinander angeordnete Halbleiterzonen A process for producing a terminal electrode for two superimposed semiconductor zones
02/09/2012DE102005008750B4 Struktur zum Enthalten von Trocknungsmitteln, Verfahren zum Herstellen und Verwendung der Struktur Structure for containing drying agents, methods of making and using the structure
02/09/2012DE102004044946B4 Verfahren zum Trennen eines Halbleiterwafers A method for separating a semiconductor wafer
02/09/2012DE10164920B4 Vorrichtung zum Polieren eines Halbleiterwafers und Verfahren dafür An apparatus for polishing a semiconductor wafer and method thereof
02/09/2012CA2806689A1 Vertical capacitors formed on semiconducting substrates
02/09/2012CA2790741A1 Method for manufacturing semiconductor device
02/09/2012CA2783310A1 Semiconductor device and method for manufacturing same
02/08/2012EP2416634A1 Method to form solder deposits on substrates
02/08/2012EP2416633A1 Method for fixing and/or embedding an electronic component and adhesive for use in such a method
02/08/2012EP2416629A1 Pulse-modulated high-frequency power control method and pulse-modulated high-frequency power source device
02/08/2012EP2416386A2 Method of making a semiconductor device having a passivation layer and corresponding semiconductor device
02/08/2012EP2416366A1 Semiconductor device and method of producing semiconductor device
02/08/2012EP2416365A1 Field-effect transistor
02/08/2012EP2416353A1 Semiconductor device
02/08/2012EP2416352A2 Methods for fabricating trench metal oxide semiconductor field effect transistors
02/08/2012EP2416351A1 Plasma etching apparatus
02/08/2012EP2416350A1 A method for selective deposition of a semiconductor material