Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2012
02/02/2012US20120028446 Method for fabricating group iii-nitride semiconductor
02/02/2012US20120028445 Susceptor treatment method and a method for treating a semiconductor manufacturing apparatus
02/02/2012US20120028444 Defect-free hetero-epitaxy of lattice mismatched semiconductors
02/02/2012US20120028443 Methods and apparatus for producing semiconductor on insulator structures using directed exfoliation
02/02/2012US20120028442 Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device
02/02/2012US20120028441 Method and System for Bonding 3D Semiconductor Device
02/02/2012US20120028440 method of fabricating a multilayer structure with circuit layer transfer
02/02/2012US20120028439 Semiconductor And Solar Wafers And Method For Processing Same
02/02/2012US20120028438 Method for separating a layer system comprising a wafer
02/02/2012US20120028437 Trench-filling method and film-forming system
02/02/2012US20120028436 Method for fabrication of a semiconductor device and structure
02/02/2012US20120028435 Semiconductor device including dummy gate part and method of fabricating the same
02/02/2012US20120028434 Method of manufacturing semiconductor device using acid diffusion
02/02/2012US20120028433 Method for manufacturing solid electrolytic capacitor
02/02/2012US20120028432 Methods of forming a bipolar transistor
02/02/2012US20120028431 Method for manufacturing a semiconductor device using a nitrogen containing oxide layer
02/02/2012US20120028430 Method and structure to improve formation of silicide
02/02/2012US20120028429 Method of forming a non-volatile electron storage memory and the resulting device
02/02/2012US20120028428 Vertical type semiconductor device and method of manufacturing a vertical type semiconductor device
02/02/2012US20120028427 Split gate with different gate materials and work functions to reduce gate resistance of ultra high density MOSFET
02/02/2012US20120028426 Inverted-trench grounded-source FET structure using conductive substrates, with highly doped substrates
02/02/2012US20120028425 Methods for fabricating trench metal oxide semiconductor field effect transistors
02/02/2012US20120028424 Manufacture method of a split gate nonvolatile memory cell
02/02/2012US20120028423 Method for fabricating semiconductor device
02/02/2012US20120028422 Thin film transistor formed on flexible substrate and method of manufacturing the same
02/02/2012US20120028421 Method for manufacturing thin film transistor array panel
02/02/2012US20120028420 Method for reuse of wafers for growth of vertically-aligned wire arrays
02/02/2012US20120028419 Semiconductor device and manufacturing method thereof
02/02/2012US20120028418 Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
02/02/2012US20120028417 Semiconductor component with cell structure and method for producing the same
02/02/2012US20120028416 Film for flip chip type semiconductor back surface and its use
02/02/2012US20120028415 Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
02/02/2012US20120028414 Method of manufacturing semiconductor chip
02/02/2012US20120028413 Method for manufacturing ball grid array package stacking system
02/02/2012US20120028412 Semiconductor apparatus, method of manufacturing the same, and method of manufacturing semiconductor package
02/02/2012US20120028411 Embedded Wafer-Level Bonding Approaches
02/02/2012US20120028410 Methods of forming germanium-antimony-tellurium materials and a method of forming a semiconductor device structure including the same
02/02/2012US20120028409 Methods of forming an anisotropic conductive layer as a back contact in thin film photovoltaic devices
02/02/2012US20120028397 Ultra-thin quad flat no-lead (qfn) package
02/02/2012US20120028391 Method of fabricating display device
02/02/2012US20120028384 Method for manufacturing a liquid-ejection head
02/02/2012US20120028383 Processing method of silicon substrate and liquid ejection head manufacturing method
02/02/2012US20120028382 Semiconductor device having a semiconductor chip, and method for the production thereof
02/02/2012US20120028381 Solar battery panel inspection apparatus, method of inspecting solar battery panel, and method of manufacturing solar battery panel
02/02/2012US20120028380 Dicing tape-integrated film for semiconductor back surface and method for producing the film, and method for producing semiconductor device
02/02/2012US20120028379 Methods and apparatuses for controlling gas flow conductance in a capacitively-coupled plasma processing chamber
02/02/2012US20120028378 Method for forming pattern and a semiconductor device
02/02/2012US20120028377 Using optical metrology for within wafer feed forward process control
02/02/2012US20120028376 Method of Controlling Critical Dimensions of Trenches in a Metallization System of a Semiconductor Device During Etch of an Etch Stop Layer
02/02/2012US20120028375 Inspection method of light-emitting device and processing method after inspection of light-emitting device
02/02/2012US20120028374 Semiconductor device and method for manufacturing same
02/02/2012US20120028194 Pattern formation method using levenson-type mask and method of manufacturing levenson-type mask
02/02/2012US20120028192 Control method and control system for exposure apparatus
02/02/2012US20120028191 Azide Functionalized Poly(3-Hexylthiophene) and Method of Forming Same
02/02/2012US20120028052 Graphene growth on a non-hexagonal lattice
02/02/2012US20120027557 Method and electrostatic transfer stamp for transferring semiconductor dice using electrostatic transfer printing techniques
02/02/2012US20120027547 Apparatus for storage of objects from the field of manufacture of electronic components
02/02/2012US20120027544 System and method of monitoring an environmental parameter along a predetermined route
02/02/2012US20120027543 Method and device for introducing and removing substrates
02/02/2012US20120027542 Vacuum processor
02/02/2012US20120027041 Wavelength variable laser and a manufacturing method thereof
02/02/2012US20120026270 Organic el device, method of manufacturing the same and printer
02/02/2012US20120025927 Rf isolation switch circuit
02/02/2012US20120025905 Multiple circuit blocks with interblock control and power conservation
02/02/2012US20120025892 Semiconductor integrated circuit device
02/02/2012US20120025851 Capacitive sensors
02/02/2012US20120025405 Liquid encapsulating resin composition, semiconductor device using liquid encapsulating resin composition, and method of manufacturing the same
02/02/2012US20120025404 Film for flip chip type semiconductor back surface
02/02/2012US20120025402 Methods of forming semiconductor device structures and semiconductor device structures including a uniform pattern of conductive lines
02/02/2012US20120025401 Integrated circuit package with voltage distributor
02/02/2012US20120025400 Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device
02/02/2012US20120025399 Film for flip chip type semiconductor back surface, and its use
02/02/2012US20120025398 Integrated circuit packaging system with package-on-package and method of manufacture thereof
02/02/2012US20120025395 Semiconductor device and method of manufacturing semiconductor device
02/02/2012US20120025393 Power Semiconductor Module, Method for Producing a Power Semiconductor Module and a Housing Element for a Power Semiconductor Module
02/02/2012US20120025392 Increased Stability of a Complex Material Stack in a Semiconductor Device by Providing Fluorine Enriched Interfaces
02/02/2012US20120025390 Semiconductor device and method for fabricating the same
02/02/2012US20120025389 Hermetic Wafer Level Packaging
02/02/2012US20120025387 Chip package and fabricating method thereof
02/02/2012US20120025386 Semiconductor memory device and method of manufacturing the same
02/02/2012US20120025385 Low Resistance Peripheral Local Interconnect Contacts with Selective Wet Strip of Titanium
02/02/2012US20120025384 Electronic device and method for production
02/02/2012US20120025383 Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structure
02/02/2012US20120025381 Semiconductor device and method for fabricating the same
02/02/2012US20120025380 Manganese oxide film forming method, semiconductor device manufacturing method and semiconductor device
02/02/2012US20120025379 Front-end processing of nickel plated bond pads
02/02/2012US20120025375 Routable array metal integrated circuit package fabricated using partial etching process
02/02/2012US20120025373 Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnects on Different Height Traces
02/02/2012US20120025368 Semiconductor Device Cover Mark
02/02/2012US20120025366 Semiconductor device and method for manufacturing the same
02/02/2012US20120025365 Microelectronic packages with nanoparticle joining
02/02/2012US20120025363 Package structure and manufacturing method thereof
02/02/2012US20120025362 Reinforced Wafer-Level Molding to Reduce Warpage
02/02/2012US20120025361 Semiconductor device, lead frame assembly, and method for fabricating the same
02/02/2012US20120025360 Semiconductor encapsulation and method thereof
02/02/2012US20120025359 Semiconductor device and method of manufacturing the same
02/02/2012US20120025358 Semiconductor element with semiconductor die and lead frames
02/02/2012US20120025357 Leadframe for ic package and method of manufacture
02/02/2012US20120025356 Semiconductor device packages having electromagnetic interference shielding and related methods
02/02/2012US20120025355 Laminated semiconductor substrate, laminated chip package and method of manufacturing the same
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