Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2012
02/01/2012CN102341902A Placing table structure, film forming apparatus, and raw material recovery method
02/01/2012CN102341901A Systems, apparatus and methods for moving substrates
02/01/2012CN102341900A Method of producing a heterostructure with local adaptation of the thermal expansion coefficient
02/01/2012CN102341899A Leadless array plastic package with various ic packaging configurations
02/01/2012CN102341898A Nitride semiconductor device and method of manufacturing the same
02/01/2012CN102341897A Quantum well mosfet channels having uni-axial strain caused by metal source/drains, and conformal regrowth source/drains
02/01/2012CN102341896A Cmp方法 Cmp method
02/01/2012CN102341895A Semiconductor chip and semiconductor device
02/01/2012CN102341894A Dual metal and dual dielectric integration for metal high-k FETs
02/01/2012CN102341893A Method for manufacturing silicon carbide semiconductor device
02/01/2012CN102341892A Non destructive selective deposition removal of non-metallic deposits from aluminum containing substrates
02/01/2012CN102341891A Film forming method and film forming apparatus
02/01/2012CN102341890A Semiconductor material manufacture
02/01/2012CN102341889A Semiconductor substrate, method for manufacturing semiconductor substrate, electronic device and method for manufacturing electronic device
02/01/2012CN102341888A Methods of forming patterns
02/01/2012CN102341887A III-nitride light emitting device incorporating boron
02/01/2012CN102341866A Electrically conductive paste composition and electrically conductive film formed by using same
02/01/2012CN102341865A Programming method for nand flash memory device
02/01/2012CN102341760A Fluid control apparatus fluid control apparatus
02/01/2012CN102341754A Illumination system, lithographic apparatus and method of forming an illumination mode
02/01/2012CN102341525A Method for forming cu film and storage medium
02/01/2012CN102341324A Transfer system
02/01/2012CN102341243A Method for transferring functional regions, led array, led printer head, and led printer
02/01/2012CN102341236A Film with attached metal layer for electronic components, production method thereof, and applications thereof
02/01/2012CN102341215A Abrasive tool for use as a chemical mechanical planarization pad conditioner
02/01/2012CN102341211A Method of working thin layer on work and thin layor working apparatus
02/01/2012CN102341209A Method of forming a pattern on a work piece, method of shaping a beam of electromagnetic radiation for use in said method, and aperture for shaping a beam of electromagnetic radiation
02/01/2012CN102340981A Mounting apparatus
02/01/2012CN102340980A Mounting apparatus
02/01/2012CN102339898A Process for manufacturing p-n junction of large-area silicon-based solar cell by ion implantation method
02/01/2012CN102339869A Semiconductor device with MIM capacitor and method for manufacturing the same
02/01/2012CN102339868A Metal semiconductor field effect transistor with inverse isolating layer structure and manufacturing method thereof
02/01/2012CN102339867A VDMOS (vertical-diffused metal oxide semiconductor) device and formation method thereof
02/01/2012CN102339865A Semiconductor strain metal oxide semiconductor (MOS) device provided with strain enhancement structure and preparation process for semiconductor strain metal oxide semiconductor (MOS) device
02/01/2012CN102339864A LDMOS (laterally diffused metal oxide semiconductor) transistor structure and forming method thereof
02/01/2012CN102339862A Semiconductor device including a channel stop zone
02/01/2012CN102339861A Semiconductor device
02/01/2012CN102339860A Semiconductor device and manufacturing method thereof
02/01/2012CN102339859A Metal-oxide-semiconductor (MOS) transistor and formation method thereof
02/01/2012CN102339858A p-type semiconductor device and production method thereof
02/01/2012CN102339857A DMOS device and manufacturing methods thereof
02/01/2012CN102339856A Recessed channel negative differential resistance-based memory cell
02/01/2012CN102339855A Interconnection structure and manufacturing method thereof
02/01/2012CN102339854A Vertical transistor component
02/01/2012CN102339852A Semiconductor device and method for manufacturing same
02/01/2012CN102339851A Power semiconductor with polysilicon structure at bottom of trench and method for manufacturing same
02/01/2012CN102339844A Implementation method for silicon-free through hole low-cost image sensor packaging structure
02/01/2012CN102339835A Semiconductor assembly and electroluminescent assembly and manufacture method thereof
02/01/2012CN102339834A Flash memory unit and forming method thereof
02/01/2012CN102339832A Pillar type capacitor of semiconductor device and method for forming the same
02/01/2012CN102339831A Vertical channel transistor array and manufacturing method thereof
02/01/2012CN102339830A Semiconductor device and method for fabricating the same
02/01/2012CN102339829A Semiconductor device and method for forming the same
02/01/2012CN102339828A Low-power-consumption semiconductor memory, and manufacturing method and driving method thereof
02/01/2012CN102339827A Integration of metal-oxide-semiconductor field-effect transistor (MOSFET) and Schottky diode and method for manufacturing same
02/01/2012CN102339819A Light-emitting diode package structure and method for forming same
02/01/2012CN102339818A 功率模块 Power Modules
02/01/2012CN102339813A Semiconductor structure and manufacturing method thereof
02/01/2012CN102339810A Silicon based substrate and fabrication method thereof
02/01/2012CN102339809A QFN (quad flat non-lead) package with multiple circles of pins and manufacturing method thereof
02/01/2012CN102339803A Die package structure and related die package structure manufacturing method
02/01/2012CN102339800A Stacked interconnect heat sink
02/01/2012CN102339798A Composite substrate, gallium nitride-based element and method for manufacturing same
02/01/2012CN102339797A Method for fabricating bottom electrode of capacitors of dynamic random access memory
02/01/2012CN102339796A Production method for and structure of accumulation-mode complementary metal oxide semiconductor (CMOS) device
02/01/2012CN102339795A Method for manufacturing semiconductor devices having a metallisation layer
02/01/2012CN102339794A Pixel structure of reflection type electrophoretic display device and manufacturing method for pixel structure
02/01/2012CN102339793A Manufacture method of semiconductor device
02/01/2012CN102339792A Manufacture method of semiconductor device
02/01/2012CN102339791A Manufacture method of semiconductor device
02/01/2012CN102339790A Manufacture method of semiconductor device
02/01/2012CN102339789A Method for forming metal interconnection structure
02/01/2012CN102339788A Method for manufacturing leads of semiconductor device and intraconnection structure
02/01/2012CN102339787A Semiconductor component production method capable of reducing resistance of contact hole
02/01/2012CN102339786A Method for processing copper-plated layers in trenches
02/01/2012CN102339785A Method for manufacturing metal damascene structure
02/01/2012CN102339784A Manufacturing method for silicon-on-insulator (SOI) structure provided with stepped oxidization buried layer
02/01/2012CN102339783A Element isolation structure of semiconductor and method for forming the same
02/01/2012CN102339782A Production method of shallow channel isolation region
02/01/2012CN102339781A Wafer fixing device and using method thereof
02/01/2012CN102339780A Adsorbing and supporting device of wafer and substrate and semiconductor processing equipment of wafer
02/01/2012CN102339779A Conveying system and method of wafer box
02/01/2012CN102339778A Glass substrate carrying vehicle
02/01/2012CN102339777A Wafer limiting piece of wafer box
02/01/2012CN102339776A Axial soldering and pickling dual-purpose tool for diode
02/01/2012CN102339775A Method for washing and purifying autologous oxide on surface of GaAs (gallium arsenide) and depositing Al2O3 medium
02/01/2012CN102339774A Substrate cleaning apparatus, coating and developing apparatus having the same and substrate cleaning method
02/01/2012CN102339773A Method for judging etching ending point through valve opening
02/01/2012CN102339772A Method for detecting defects of through holes
02/01/2012CN102339771A Dual-bonding wire head lead bonding device
02/01/2012CN102339770A Process for improving shear strength between lead-tin bump and aluminum pad on wafer
02/01/2012CN102339769A Temporary semiconductor structure bonding methods and related bonded semiconductor structures
02/01/2012CN102339768A Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methods
02/01/2012CN102339767A Semiconductor element and manufacturing method thereof
02/01/2012CN102339766A Long distance connection method during line repair
02/01/2012CN102339765A Methods and apparatus for multi-stage molding of integrated circuit package
02/01/2012CN102339764A Thick-film hybrid integrated circuit surface enveloping process
02/01/2012CN102339763A Method for assembling integrated circuit device
02/01/2012CN102339762A Non-carrier semiconductor packaging part and manufacturing method thereof
02/01/2012CN102339761A Method for manufacturing packaged structures
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