Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2012
02/08/2012CN102347214A Preparation method for graphical template used for growing thick-film GaN material
02/08/2012CN102347213A Wafer thinning method
02/08/2012CN102347212A Method of forming a layer on a semiconductor substrate having a plurality of trenches
02/08/2012CN102347211A Method and apparatus for supporting planar substrates for conducting thermal treatment process
02/08/2012CN102347210A Controlled ambient system for interface engineering
02/08/2012CN102347209A Substrate bonding system and method of modifying the same
02/08/2012CN102347208A Method for reducing loading effect of thin film growth in furnace tube
02/08/2012CN102347207A System for plasma process
02/08/2012CN102347206A Method for manufacturing semiconductor device
02/08/2012CN102347197A Method for dynamically detecting etched end point
02/08/2012CN102346375A Coating treatment method, program, non-transitory computer storage medium and coating treatment apparatus
02/08/2012CN102346371A Photoresist compositions and methods of forming photolithographic patterns
02/08/2012CN102346341A Array base plate, manufacturing method for array base plate, liquid crystal panel, liquid crystal display and driving method
02/08/2012CN102346125A Laboratory table for real-timely observing nanoparticle movement
02/08/2012CN102345115A Method for forming microcrystalline semiconductor film and method for manufacturing semiconductor device
02/08/2012CN102345111A Film forming method and apparatus
02/08/2012CN102344646A Film for flip chip type semiconductor back surface, and its use
02/08/2012CN102344115A Micronscale/nanoscale connection method based on dip-pen principle
02/08/2012CN102343631A Brittle material chamfering method and device thereof
02/08/2012CN102061437B 用加热甲烷处理金属表面的方法 Heating the metal surface treatment method of methane
02/08/2012CN102034710B 半导体器件的栅极预掺杂方法 The gate of the pre-doping method of a semiconductor device
02/08/2012CN102024701B P沟道金属氧化物半导体晶体管源漏注入方法 P-channel metal-oxide-semiconductor transistor source and drain implantation method
02/08/2012CN102005436B 度量衡校准晶圆 Wafer Metrology Calibration
02/08/2012CN102005388B N型金属氧化物半导体源漏注入方法 N-type metal oxide semiconductor source and drain implantation method
02/08/2012CN101958242B 制作栅氧化层和栅极多晶硅层的方法 A gate oxide layer and a gate polysilicon layer method
02/08/2012CN101950112B 液晶显示面板及其制造方法 The method of manufacturing a liquid crystal display panel and
02/08/2012CN101939820B 外延生长用基板、GaN类半导体膜的制造方法、GaN类半导体膜、GaN类半导体发光元件的制造方法以及GaN类半导体发光元件 The method of manufacturing an epitaxial growth substrate, a method of manufacturing GaN-based semiconductor film, GaN-based semiconductor film, GaN-based semiconductor light-emitting element and the GaN-based semiconductor light-emitting element
02/08/2012CN101930931B 封装电路基板结构及其制造方法 Package structure and method of manufacturing the circuit substrate,
02/08/2012CN101901809B 用于fn隧穿编程及擦除的三维存储器阵列 Fn tunneling for programming and erasing a three-dimensional memory array
02/08/2012CN101901760B 基于c面SiC衬底上极性c面GaN的MOCVD生长方法 MOCVD growth method on polar c-plane SiC substrate c-plane GaN-based
02/08/2012CN101901757B 基于a面6H-SiC衬底上非极性a面GaN的MOCVD生长方法 Based on a surface of the 6H-SiC substrate MOCVD growth method nonpolar a-plane GaN on
02/08/2012CN101884089B 芯片安装系统 Chip mounting system
02/08/2012CN101877355B Memory devices and methods for manufacturing and methods for operating the device
02/08/2012CN101874298B 静电型加固装置 Electrostatic reinforcement device
02/08/2012CN101872788B 集成电路3d存储器阵列及其制造方法 An integrated circuit memory array and method of manufacturing 3d
02/08/2012CN101872715B 晶片缺陷标示系统 Wafer defect marking system
02/08/2012CN101866114B 光刻装置和器件制造方法 Lithographic apparatus and device manufacturing method
02/08/2012CN101859752B 具有内嵌式芯片及硅导通孔晶粒之堆栈封装结构及其制造方法 The embedded chip package structure having a silicon vias and the stack and the manufacturing method of the grain
02/08/2012CN101842889B 用于支撑工件的装置 Means for supporting the workpiece
02/08/2012CN101834137B 源漏极离子注入的方法 Source and drain ion implantation method
02/08/2012CN101819980B 固态图像传感器及其制造方法和图像拾取装置 Solid-state image sensor and its manufacturing method and an image pickup apparatus
02/08/2012CN101819921B 基板处理装置 The substrate processing apparatus
02/08/2012CN101814435B 一种制备悬浮ZnO纳米线场效应晶体管的方法 A method of suspending ZnO nanowire field effect transistor prepared
02/08/2012CN101807580B 带厚栅极氧化层的多次可编程非易失性存储器件 Multiple programmable non-volatile memory device with a thick gate oxide layer,
02/08/2012CN101802994B 半导体装置用接合线 The semiconductor device bonding wire
02/08/2012CN101802978B 基板处理方法和基板处理系统 The substrate processing method and substrate processing system
02/08/2012CN101783314B 形成隔离结构的方法和相应的器件 The method of forming an isolation structure and the corresponding device
02/08/2012CN101783288B 外延涂覆的硅晶片以及制造外延涂覆的硅晶片的方法 Epitaxially coated silicon epitaxial wafer, and manufacturing method of a silicon wafer coated
02/08/2012CN101770944B 半导体器件栅极的制作方法 The method of manufacturing a semiconductor device gate
02/08/2012CN101752264B 散热型半导体封装结构及其制法 Cooling type semiconductor package structure Jiqizhifa
02/08/2012CN101752244B 等离子体处理方法 The plasma processing method
02/08/2012CN101752222B 异物除去装置和异物除去方法 Dust removing apparatus and method for removing foreign matter
02/08/2012CN101740522B 适用于闪存器件的高密度钴纳米点的制备方法 Methods suitable for the preparation of high-density flash memory devices cobalt nanodots
02/08/2012CN101728286B 一种抑制焊料互连凸点电迁移失效的方法 A solder bump interconnection electromigration failure in a method for inhibiting
02/08/2012CN101714563B 固体摄像器件及其制造方法以及电子装置 The solid-state imaging device and its manufacturing method, and electronic device
02/08/2012CN101714514B 向表面上分配易熔材料的装置和方法 The apparatus and method of allocating the fusible material on the surface of
02/08/2012CN101711428B 通过增进的蚀刻控制策略来图案化形成的晶体管上方的受不同应力层的技术 Through enhanced etch control strategy patterned transistor formed by the upper layers of different stress technology
02/08/2012CN101673749B 固态成像器件和制造固态成像器件的方法 The method of manufacturing the solid-state imaging device and the solid-state imaging device
02/08/2012CN101667625B 有机发光显示器及其制造方法 The organic light emitting display and a method of manufacturing
02/08/2012CN101656218B 用于生产照相机模块的方法以及相应的基底 Method for producing a camera module and the corresponding base
02/08/2012CN101645404B 有机el显示装置的制造方法 The organic el display device manufacturing method
02/08/2012CN101641779B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/08/2012CN101636834B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/08/2012CN101627464B 层叠结构体及其制造方法 The laminated structure and a manufacturing method
02/08/2012CN101626010B 覆晶薄膜封装结构以及覆晶薄膜封装方法 COF COF packaging structure and method of packaging
02/08/2012CN101620375B 修正凸块光掩膜图案的方法 Projection light correction method for a mask pattern
02/08/2012CN101593761B 具封胶保护层的感测装置及其制造方法 Sensing device and method of manufacturing a sealed plastic protective layer
02/08/2012CN101582408B 半导体器件和制造半导体器件的方法 A semiconductor device and manufacturing a semiconductor device
02/08/2012CN101566795B 用于生产芯片的加工设备、加工方法和工艺 Processing equipment for the production of chips, processing methods and processes
02/08/2012CN101556969B 增强型碳化硅金属半导体场效应晶体管及其制造方法 Reinforced silicon carbide metal-semiconductor field-effect transistor and manufacturing method thereof
02/08/2012CN101521201B 具多晶硅层及微晶硅层的双底材主动层结构、方法及装置 Active double-layer structure of the substrate, a method and apparatus for a polycrystalline silicon layer and a microcrystalline silicon layer
02/08/2012CN101516565B 激光加工方法 The laser processing method
02/08/2012CN101488452B 半导体处理用的成膜方法和装置 The semiconductor processing method and apparatus used in the film forming
02/08/2012CN101483181B 发光器件 The light emitting device
02/08/2012CN101472384B 大气压等离子反应器 An atmospheric pressure plasma reactor
02/08/2012CN101471261B 制造凹槽栅晶体管的方法 The method of manufacturing a transistor gate recess
02/08/2012CN101467258B 用于制造功率半导体器件的工艺和相应功率半导体器件 Process for manufacturing a power semiconductor device and the corresponding power semiconductor devices
02/08/2012CN101436534B 制作器件的方法以及采用该方法形成的已加工材料 The method of making the device and the use of this method has been formed in the workpiece
02/08/2012CN101425466B 半导体部件及其制造方法 The method of manufacturing the semiconductor component and
02/08/2012CN101414547B 清洗微电子器件的方法 The method of cleaning microelectronic devices
02/08/2012CN101409309B 快闪存储器件及其制造方法 A flash memory device and manufacturing method thereof
02/08/2012CN101378057B 金属-绝缘体-金属电容器及其制造方法 Metal - insulator - metal capacitor and a manufacturing method
02/08/2012CN101359682B 自对准抬升外基区双极晶体管及其制备方法 External base region self-aligned bipolar transistor uplift and preparation method
02/08/2012CN101350319B 用来制作封装半导体器件的方法和系统 Method and system for making a semiconductor device package
02/08/2012CN101339899B Soi衬底的制造方法及半导体装置的制造方法 Soi substrate manufacturing method of a semiconductor device and
02/08/2012CN101335275B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/08/2012CN101322230B 半导体器件制造方法 The semiconductor device manufacturing method
02/08/2012CN101320716B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/08/2012CN101308799B 布线基板的连接方法及布线基板 Connecting a wiring board and a wiring board
02/08/2012CN101303988B Ic芯片安装方法 Ic chip mounting method
02/08/2012CN101271832B 基座 Base
02/08/2012CN101256994B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/08/2012CN101246899B 碳化硅二次外延结构 SiC epitaxial structure of secondary
02/08/2012CN101237017B Led裸芯测试用的led支架处理方法、led支架单元以及支架 Led die test of led stent approach, led stand unit and bracket
02/08/2012CN101180641B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/08/2012CN101127240B 降低非易失性存储器存储元件间耦合效应的方法 Reduce inter-volatile memory storage element method for coupling effects
02/08/2012CN101070454B 用于加工半导体晶片或半导体基材的压敏粘着片 For processing a semiconductor wafer or the pressure sensitive semiconductor substrate adhesive sheet
02/08/2012CN101047159B 多层互连基板、半导体装置及阻焊剂 Multilayer interconnect substrate, a semiconductor device and a solder resist
02/08/2012CN101044627B 半导体器件 Semiconductor devices
02/08/2012CN101041231B 表面处理方法 The surface treatment method
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