Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2012
02/15/2012CN101266968B 发光装置和制造该种发光装置的方法 A light emitting device and a method for manufacturing the luminescent device
02/15/2012CN101258442B 图案复制掩模、焦距变动测定方法及装置、半导体器件的制造方法 Replication method for producing a mask pattern, a method and apparatus for measuring the focal length changes, the semiconductor device
02/15/2012CN101233619B 微电子部件的封装及其制造方法 Package and method for manufacturing microelectronic components
02/15/2012CN101136366B 一种金氧半导体晶体管的制造方法及一种电子装置 A method of manufacturing a metal oxide semiconductor transistor, and an electronic device
02/15/2012CN101093362B 角分辨分光光刻术的特性测定方法与设备 Angle-resolved spectroscopic characteristics measuring method and apparatus lithography
02/15/2012CN101083284B 具有槽电荷补偿区的半导体器件及方法 Having semiconductor devices and methods groove charge compensation zones
02/15/2012CN101023529B 形成溶液处理器件的方法 The method of forming a solution of the processor member
02/14/2012US8117570 Integrated circuit design phase technique with virtual power switch
02/14/2012US8116894 Chemical mechanical polishing method and chemical mechanical polishing device
02/14/2012US8116893 Dicing method
02/14/2012US8116556 Method and apparatus for analyzing defect data and a review system
02/14/2012US8116121 Semiconductor device and manufacturing methods with using non-planar type of transistors
02/14/2012US8116091 Printed circuit board
02/14/2012US8115932 Methods and apparatus for measuring ion implant dose
02/14/2012US8115927 Production method of compound semiconductor member
02/14/2012US8115902 Exposure apparatus, device manufacturing method, maintenance method, and exposure method
02/14/2012US8115901 Exposure apparatus
02/14/2012US8115882 Liquid crystal display device and manufacturing method thereof
02/14/2012US8115851 Solid-state image capturing apparatus, method for manufacturing same, and electronic information device
02/14/2012US8115325 Semiconductor integrated circuit including plurality of bonding pads
02/14/2012US8115322 Adhesive, method of connecting wiring terminals and wiring structure
02/14/2012US8115321 Separate probe and bond regions of an integrated circuit
02/14/2012US8115318 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
02/14/2012US8115306 Apparatus and method for packaging circuits
02/14/2012US8115305 Integrated circuit package system with thin profile
02/14/2012US8115301 Methods for manufacturing thermally enhanced flip-chip ball grid arrays
02/14/2012US8115298 Semiconductor device
02/14/2012US8115296 Electronic device package
02/14/2012US8115293 Integrated circuit packaging system with interconnect and method of manufacture thereof
02/14/2012US8115288 Lead frame for semiconductor device
02/14/2012US8115285 Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof
02/14/2012US8115284 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument
02/14/2012US8115276 Integrated circuit system employing back end of line via techniques
02/14/2012US8115275 Electrical antifuse
02/14/2012US8115272 Silicon dioxide cantilever support and method for silicon etched structures
02/14/2012US8115271 Reducing device performance drift caused by large spacings between active regions
02/14/2012US8115263 Laminated silicon gate electrode
02/14/2012US8115262 Dielectric multilayer structures of microelectronic devices and methods for fabricating the same
02/14/2012US8115259 Three-dimensional memory device
02/14/2012US8115257 Semiconductor apparatus
02/14/2012US8115256 Semiconductor device
02/14/2012US8115248 Semiconductor device and method for manufacturing the same
02/14/2012US8115244 Transistor of volatile memory device with gate dielectric structure capable of trapping charges
02/14/2012US8115241 Solid state imaging apparatus and method for fabricating the same
02/14/2012US8115240 CMOS integrated process for fabricating monocrystalline silicon micromechanical elements by porous silicon micromachining
02/14/2012US8115229 Arrangement for dissipating thermal energy generated by a light emitting diode
02/14/2012US8115226 Low optical loss electrode structures for LEDs
02/14/2012US8115223 Radiation emitting device
02/14/2012US8115217 Systems and methods for packaging light-emitting diode devices
02/14/2012US8115210 Semiconductor display device
02/14/2012US8115208 Image display system and manufacturing method thereof
02/14/2012US8115206 Semiconductor device
02/14/2012US8115201 Semiconductor device with oxide semiconductor formed within
02/14/2012US8115199 Electroluminescent devices
02/14/2012US8115195 Semiconductor wafer with a heteroepitaxial layer and a method for producing the wafer
02/14/2012US8115191 Self-constrained anisotropic germanium nanostructure from electroplating
02/14/2012US8115189 Silica nanowire comprising silicon nanodots and method of preparing the same
02/14/2012US8115154 Solid-state imaging device, method of producing the same, and imaging device
02/14/2012US8115142 Plate, apparatus for adjusting temperature of substrate having the plate and apparatus for processing substrate having the plate
02/14/2012US8115137 Laser annealing method and laser annealing apparatus
02/14/2012US8115036 Fluorine-containing cyclic compound, fluorine-containing polymer compound, resist material using same and method for forming pattern
02/14/2012US8114948 Photosensitive compositions based on polycyclic polymers
02/14/2012US8114790 Plasma CVD method, silicon nitride film formation method, semiconductor device manufacturing method, and plasma CVD apparatus
02/14/2012US8114789 Formation of a tantalum-nitride layer
02/14/2012US8114788 Method for manufacturing semiconductor device
02/14/2012US8114787 Integrated circuit nanowires
02/14/2012US8114786 Heat treatment method, heat treatment apparatus and substrate processing apparatus
02/14/2012US8114785 Electrical passivation of silicon-containing surfaces using organic layers
02/14/2012US8114784 Laminated stress overlayer using In-situ multiple plasma treatments for transistor improvement
02/14/2012US8114782 Method for etching organic hardmasks
02/14/2012US8114781 Substrate processing method and substrate processing apparatus
02/14/2012US8114780 Method for dielectric material removal between conductive lines
02/14/2012US8114779 Silicon dioxide cantilever support and method for silicon etched structures
02/14/2012US8114778 Method of forming minute patterns in semiconductor device using double patterning
02/14/2012US8114777 Horizontal nanotube/nanofiber growth method
02/14/2012US8114776 Method of manufacturing semiconductor device
02/14/2012US8114775 Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers
02/14/2012US8114774 Semiconductor device, and semiconductor device obtained by such a method
02/14/2012US8114773 Cleaning solution, cleaning method and damascene process using the same
02/14/2012US8114772 Method of manufacturing the semiconductor device
02/14/2012US8114771 Semiconductor wafer scale package system
02/14/2012US8114770 Pre-treatment method to increase copper island density of CU on barrier layers
02/14/2012US8114769 Methods and structures to enable self-aligned via etch for Cu damascene structure using trench first metal hard mask (TFMHM) scheme
02/14/2012US8114768 Electromigration resistant via-to-line interconnect
02/14/2012US8114767 Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof
02/14/2012US8114766 Method for manufacturing semiconductor device
02/14/2012US8114765 Methods for increased array feature density
02/14/2012US8114764 Semiconductor device and fabrication method thereof
02/14/2012US8114763 Tantalum aluminum oxynitride high-K dielectric
02/14/2012US8114762 Method for manufacturing trench MOSFET device with low gate charge
02/14/2012US8114761 Method for doping non-planar transistors
02/14/2012US8114760 Method for manufacturing microcrystalline semiconductor and thin film transistor
02/14/2012US8114759 Dicing method using a die attach film on an adhesive sheet
02/14/2012US8114758 Method for avoiding die cracking
02/14/2012US8114757 Semiconductor device and structure
02/14/2012US8114756 Method and manufacture for high voltage gate oxide formation after shallow trench isolation formation
02/14/2012US8114755 Method of manufacturing semiconductor device
02/14/2012US8114754 Methods of fabricating semiconductor structures and devices using glass bonding layers, and semiconductor structures and devices formed by such methods
02/14/2012US8114753 Buried decoupling capacitors, devices and systems including same, and methods of fabrication
02/14/2012US8114752 Structure of capacitor set