Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2012
02/01/2012CN102339760A Method for manufacturing packaged structures
02/01/2012CN102339759A Ball-mounting method of flip substrate
02/01/2012CN102339758A Method for manufacturing copper-ceramic substrate by adopting low-temperature bonding
02/01/2012CN102339757A Method for manufacturing semiconductor devices having a glass substrate
02/01/2012CN102339756A Methods for modification and preparation of ZnO thin film transistor
02/01/2012CN102339755A High-voltage N-type junction field effect transistor and manufacturing method thereof
02/01/2012CN102339754A Preparation method of metal-oxide-semiconductor field-effect transistor with silicon-on-nothing (SON) structure
02/01/2012CN102339753A Tunneling transistor structure and manufacturing method thereof
02/01/2012CN102339752A Method for manufacturing semiconductor device based on gate replacement technique
02/01/2012CN102339751A Method for improving later process of gallium nitride field-effect transistor
02/01/2012CN102339750A Method of manufacturing semiconductor device and method of forming semiconductor device
02/01/2012CN102339749A Metal aluminum bonding pad etching method
02/01/2012CN102339748A Method for reducing etching damages of grid groove of HEMT (high electron mobility transistor) device
02/01/2012CN102339747A Zero scale forming method
02/01/2012CN102339746A Method for forming flat dielectric layer
02/01/2012CN102339745A Gas supply device, processing apparatus and processing method
02/01/2012CN102339744A Polishing method of ultra-high-frequency wafer
02/01/2012CN102339743A Planarization method for polysilicon
02/01/2012CN102339742A Method for pre-polishing polishing pad by adopting polysilicon CMP (Chemical Mechanical Polishing) process
02/01/2012CN102339741A Groove structure filled with metal and forming method thereof, and chemical mechanical polishing method
02/01/2012CN102339740A Gate structure of semiconductor device, semiconductor device and manufacturing method thereof
02/01/2012CN102339739A Laser irradiation apparatus
02/01/2012CN102339738A Laser irradiation apparatus
02/01/2012CN102339737A Plasma doping apparatus and plasma doping method
02/01/2012CN102339736A Interface-optimized germanium-based semiconductor device and method for manufacturing same
02/01/2012CN102339735A Preparation method for graphene transistor
02/01/2012CN102339734A Production method of cylindrical semiconductor device with cross section being circular ring
02/01/2012CN102339733A Method for controlling critical size of graph on uneven silicon slice surface
02/01/2012CN102339732A Method for quickly unsealing small component
02/01/2012CN102339731A Method of cleaning a thin film forming apparatus, thin film forming method, and thin film forming apparatus
02/01/2012CN102339730A Water-storage flushing rack
02/01/2012CN102339729A Wafer cleaning and drying machine
02/01/2012CN102339728A Manufacture process system and cleaning method
02/01/2012CN102339714A Methods for determining the endpoint of a cleaning or conditioning process in a plasma processing system
02/01/2012CN102339655A Temperature-controlled inflatable vacuum radiation equipment
02/01/2012CN102338992A Assembly of a reticle holder and a reticle
02/01/2012CN102338990A Substrate processing apparatus, substrate processing method and non-transitory computer storage medium
02/01/2012CN102338988A Method for improving overlay test accuracy
02/01/2012CN102338984A Coating and developing apparatus, coating and developing method, and storage medium
02/01/2012CN102338963A Electrophoretic display device and method of fabricating the same
02/01/2012CN102338950A Substrate assembling apparatus and substrate processing method using the same
02/01/2012CN102338943A Array substrate, liquid crystal display panel, liquid crystal display and manufacturing and detecting method
02/01/2012CN102338849A Insert for test handler
02/01/2012CN102338758A PN junction dying method of bipolar transistor device doping structure
02/01/2012CN102337594A Continuously diffusion processing device
02/01/2012CN102337541A Etching method used in process of manufacturing conical through silicon via (TSV)
02/01/2012CN102337522A Method for judging etching ending point through pressure variation
02/01/2012CN102337521A Rotating substrate support and methods of use
02/01/2012CN102337089A Wafer processing adhesive tape and method for processing semiconductor therewith
02/01/2012CN102337081A Chemical mechanical planarization composition and method with low corrosiveness
02/01/2012CN102337080A Cmp composition comprising surfactant
02/01/2012CN102335869A Chemical mechanical polishing device and method
02/01/2012CN102064182B 降低传感器暗电流的ccd制作方法 Reduce dark current ccd sensor fabrication method
02/01/2012CN102022300B 高精持续供胶泵装置 Plastic pump device for high-precision continuous
02/01/2012CN102005384B 铜金属化自形成阻挡层低温退火方法 Low-temperature annealing method barrier since the formation of copper metallization
02/01/2012CN101996861B 电感器的形成方法 The method of forming an inductor
02/01/2012CN101978093B 沉积设备和电子装置制造方法 Deposition apparatus and a method of manufacturing an electronic device
02/01/2012CN101967680B 一种在氧化镁衬底上制备单斜晶型氧化镓单晶薄膜的方法 A magnesium substrate prepared monoclinic gallium oxide single crystal thin film method
02/01/2012CN101964314B 自校准发光二极管框架灌胶胶接方法 Self-calibration emitting diodes framework Glue bonding method
02/01/2012CN101916736B 修补线路的方法 Repair line method
02/01/2012CN101908474B 在晶圆上制造栅极的方法 The method of producing the gate on the wafer
02/01/2012CN101903979B 组合喷淋头电极总成、连接其各部件的方法及衬底处理方法 The method of the showerhead electrode assembly of the combination, the various components connected thereto, and a substrate processing method
02/01/2012CN101866830B 半导体器件的制造方法 The method of manufacturing a semiconductor device
02/01/2012CN101836293B 安装结构体 Mounting structure
02/01/2012CN101834158B 绝缘体上硅深硅槽隔离结构的制备工艺 Preparation of silicon-on-insulator deep silicon trench isolation structure
02/01/2012CN101819976B 半导体元件及其制法 Semiconductor element Jiqizhifa
02/01/2012CN101814429B 包含超晶格隔离层的大晶格失配外延材料缓冲层结构及其制备 Spacer layer superlattice comprising a large lattice mismatch of epitaxial material of the buffer layer structure and preparation
02/01/2012CN101796626B 静电吸盘装置中的气体供给结构的制造方法及静电吸盘装置气体供给结构以及静电吸盘装置 The method of manufacturing an electrostatic chuck apparatus and a gas supply structure of gas supply structure and the electrostatic chuck apparatus and an electrostatic chuck apparatus
02/01/2012CN101789450B 薄膜晶体管及制造富硅沟道层的方法 The method of manufacturing a thin film transistor and a channel layer of silicon-rich
02/01/2012CN101789368B 半导体元件及其制造方法 Semiconductor device and manufacturing method
02/01/2012CN101763446B 一种cmos器件辐照位移损伤的估算方法 A method of estimating radiation displacement damage cmos devices
02/01/2012CN101752279B 接合第一和第二基板的方法、印刷模板和堆叠基板的系统 Engagement of the first system and the second substrate method, a printing substrate, and stacking the template
02/01/2012CN101728337B 无芯基板、其制造方法以及包含其的微电子器件封装件 Coreless substrate, its manufacturing method, and contains its microelectronic device package
02/01/2012CN101715604B 深硅刻蚀上掩膜底切的最小化 On deep silicon etch mask undercut minimized
02/01/2012CN101714500B Cog芯片倒装键合装置 Cog flip-chip bonding device
02/01/2012CN101711423B 通过向清洁溶液施加周期性的切变应力清洁半导体晶片表面的方法 By cutting periodically applying a cleaning solution to clean the surface of semiconductor wafers Stress Method
02/01/2012CN101711422B 用于保持可控弯液面中的液体隔离的系统、方法和装置 For maintaining the controllable fluid meniscus in the isolation system, method and apparatus
02/01/2012CN101707187B 一种带有绝缘埋层的晶圆的表面处理方法 A surface treatment method for a wafer with a buried insulating layer,
02/01/2012CN101706553B 一种片上通路时延测量电路及方法 One kind of chip path delay measurement circuit and method
02/01/2012CN101690432B 连接材料的强制导引 Connecting material forced guide
02/01/2012CN101685800B 半导体装置的制造方法 The method of manufacturing a semiconductor device
02/01/2012CN101685799B 半导体装置及其制造方法 Semiconductor device and manufacturing method
02/01/2012CN101677087B 半导体元件的制法 Method semiconductor element
02/01/2012CN101677086B 半导体装置及其制造方法 Semiconductor device and manufacturing method
02/01/2012CN101667541B 半导体装置的金属栅极堆叠的形成方法 Forming a metal gate stack of a semiconductor device
02/01/2012CN101657887B 蚀刻液 Etchant
02/01/2012CN101656229B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/01/2012CN101652845B 电子元器件安装装置及电子元器件安装方法 Devices and electronic components mounting method of electronic components installed
02/01/2012CN101647093B 制造半导体装置的方法和半导体装置 The method of manufacturing a semiconductor device and a semiconductor device
02/01/2012CN101635296B 有机电致发光显示器件及其制造方法 Organic electroluminescent display device and manufacturing method thereof
02/01/2012CN101626005B 键合银丝及其制备方法 Bonded silver and preparation method
02/01/2012CN101612518B 电热氧化装置 Electric oxidation unit
02/01/2012CN101587901B 绝缘体上硅材料的平板显示器驱动芯片及制备方法 Silicon on insulator material, flat panel display driver chips and preparation methods
02/01/2012CN101562186B 像素结构及其修补方法 Pixel structure and repair methods
02/01/2012CN101562141B 电子器件的制造方法及制造装置 Manufacturing method and apparatus for electronic devices
02/01/2012CN101556905B 热处理装置和热处理方法 Heat treatment apparatus and heat treatment method
02/01/2012CN101552242B 薄膜晶体管阵列面板及其制造方法 The thin film transistor array panel and a manufacturing method
02/01/2012CN101547741B 添加了螯合剂的药液的精制方法 The method for purifying a chelating agent added to the liquid
02/01/2012CN101501879B 用于制造多层物体的方法 The method for manufacturing a multilayer objects
02/01/2012CN101501824B 用于形成高纵横比特征和相关联结构的选择性蚀刻化学 Selective chemical etching of high aspect ratio features and an associated structure for forming