Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2012
02/22/2012CN101859695B 由半导体晶片制造集成电路的装置和方法 By the apparatus and method of manufacturing a semiconductor integrated circuit wafer
02/22/2012CN101855711B 切割/芯片接合薄膜 Cutting / die-bonding film
02/22/2012CN101853799B 基板升降移送装置及基板处理移送系统 Substrate elevating transfer transfer device and substrate processing system
02/22/2012CN101840904B 用于芯片封装的柔性基板及其制作方法 A method for making a flexible substrate and chip package
02/22/2012CN101840120B 薄膜晶体管阵列基板及其制作方法和液晶显示装置 The thin film transistor array substrate and production methods and LCD devices
02/22/2012CN101826449B 液体处理装置及液体处理方法 A liquid processing apparatus and liquid processing method
02/22/2012CN101802979B 化合物半导体衬底、化合物半导体衬底的制造方法以及半导体器件 A compound semiconductor substrate, a method of manufacturing a compound semiconductor substrate and a semiconductor device
02/22/2012CN101796624B 用于电压/电流探针测试装置的方法和设备 A method and apparatus for the voltage / current probe test device
02/22/2012CN101783290B 在功率半导体晶片上形成带有图案的厚金属的方法 The method of forming a thick metal having a pattern on a semiconductor wafer, the power
02/22/2012CN101783285B 使用薄的、高速液体层处理晶片表面的方法 The use of a thin, high speed method for processing the liquid layer surface of the wafer
02/22/2012CN101777575B 有机发光二极管显示器及其制造方法 The organic light emitting diode display and method of manufacturing
02/22/2012CN101743616B 半导体装置的制造方法 The method of manufacturing a semiconductor device
02/22/2012CN101740381B 肖特基二极管的制备方法 Schottky diode Preparation
02/22/2012CN101719474B 光电鼠标芯片的封装方法 Optical mouse chip packaging method
02/22/2012CN101710565B 实现拾取和翻转芯片的装置 Achieve pickup and flip chip devices
02/22/2012CN101689523B 电子器件的制作方法、外延衬底的制作方法、Ⅲ族氮化物半导体元件及氮化镓外延衬底 Method of manufacturing an electronic device, method of manufacturing an epitaxial substrate, Ⅲ nitride semiconductor element and a gallium nitride epitaxial substrate,
02/22/2012CN101684557B 液晶显示器系统中的铜、铜/钼或铜/钼合金电极蚀刻液体 Liquid crystal display system of copper, copper / molybdenum or copper / molybdenum alloy electrode etching liquid
02/22/2012CN101667574B 具有抗esd电容器的集成电路布置和相应的制造方法 Arrangement of the integrated circuit and a corresponding method for manufacturing a capacitor having anti esd
02/22/2012CN101630623B 基于带电粒子束的检查装置及采用了该检查装置的器件制造方法 Based on the charged particle beam inspection apparatus and a device manufacturing method using the inspection apparatus
02/22/2012CN101625986B 芯片封装结构制程 Chip package process
02/22/2012CN101581885B 涂敷装置和方法 Coating apparatus and method
02/22/2012CN101578933B 电子零件的安装装置及安装方法 Mounting apparatus and electronic parts mounting method
02/22/2012CN101552235B 半导体装置及其制造方法 Semiconductor device and manufacturing method
02/22/2012CN101551871B 一种手机卡及其实现方法 One kind of phone card and its implementation
02/22/2012CN101512735B 干蚀刻装置及方法 Dry etching apparatus and method
02/22/2012CN101506958B 场效应晶体管 FET
02/22/2012CN101504915B 等离子体蚀刻方法和等离子体蚀刻装置 The plasma etching method and a plasma etching apparatus
02/22/2012CN101467232B 用于使污染及表面退化最小化的中间介电层的表面改变 Used to minimize pollution and degradation of the surface of the intermediate dielectric layer surface change
02/22/2012CN101457046B 导体图案形成用墨水、导体图案以及配线基板 A conductor pattern is formed with ink, the conductor pattern, and the wiring substrate
02/22/2012CN101457043B 导体图案形成用墨水、导体图案以及配线基板 A conductor pattern is formed with ink, the conductor pattern, and the wiring substrate
02/22/2012CN101454840B 半导体器件 Semiconductor devices
02/22/2012CN101438217B 用于评估与处理过程关联的状态的方法与系统 The method used to assess the status of the process associated with the system
02/22/2012CN101399225B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/22/2012CN101320726B 混入磁性体粉末的半导体装置及其制造方法 Semiconductor device and manufacturing method of the magnetic powder is mixed
02/22/2012CN101318359B 切削装置 Cutting device
02/22/2012CN101266945B 显示面板的制造方法 The method of manufacturing the display panel
02/22/2012CN101244613B 保护晶片正面结构及进行晶片切割的方法 The wafer front side protection structure and method of cutting the wafer
02/22/2012CN101174107B 用于光掩模等离子体蚀刻的方法和装置 A method and apparatus for plasma etching photomasks
02/22/2012CN101171671B 集成电路及其制造方法 And a method of manufacturing an integrated circuit
02/22/2012CN101158992B 半导体集成电路的布局设计方法 Layout design method of the semiconductor integrated circuit
02/22/2012CN101150046B 粘贴带切断方法及采用该方法的粘贴带粘贴装置 Paste adhesive tape cutting method and the use of the method with paste apparatus
02/22/2012CN101142529B 感光性树脂组合物 The photosensitive resin composition
02/22/2012CN101103451B 一种用于集成电路的bga型测试座和老化座 Bga type test and burn-seat seat for integrated circuits
02/22/2012CN101001829B 富含同位素的氢化硼化合物的合成方法以及富含同位素的硼烷的合成方法 Synthesis of isotopically enriched boron hydride compounds and the synthesis of isotopically enriched borane
02/21/2012US8122394 Performance-aware logic operations for generating masks
02/21/2012US8122390 Charged particle beam writing apparatus, and apparatus and method for correcting dimension error of pattern
02/21/2012US8122386 Dummy pattern placement apparatus, method and program and semiconductor device
02/21/2012US8122385 Mask pattern correcting method
02/21/2012US8122262 Semiconductor device including encryption section, semiconductor device including external interface, and content reproduction method
02/21/2012US8121732 Target position detection apparatus for robot
02/21/2012US8121398 Method and apparatus for inspecting defects
02/21/2012US8121162 Nanocrystal structures
02/21/2012US8120748 Lithographic processing optimization based on hypersampled correlations
02/21/2012US8120745 Substrate for liquid crystal display device and method of fabricating the same
02/21/2012US8120289 Optical electrical system in package for LED based lighting system
02/21/2012US8120189 Wiring terminal-connecting adhesive
02/21/2012US8120187 Integrated circuit package system employing device stacking and method of manufacture thereof
02/21/2012US8120180 Semiconductor device including ruthenium electrode and method for fabricating the same
02/21/2012US8120178 Tuning fork vibration device and method for manufacturing the same
02/21/2012US8120170 Integrated package circuit with stiffener
02/21/2012US8120155 Reduced stiction and mechanical memory in MEMS devices
02/21/2012US8120150 Integrated circuit package system with dual connectivity
02/21/2012US8120149 Integrated circuit package system
02/21/2012US8120147 Current-confined heterojunction bipolar transistor
02/21/2012US8120141 Method and structure to prevent circuit network charging during fabrication of integrated circuits
02/21/2012US8120140 Isolation structure and formation method thereof
02/21/2012US8120139 Void isolated III-nitride device
02/21/2012US8120137 Isolation trench structure
02/21/2012US8120124 Ultra thin TCS (SiCl4) cell nitride for DRAM capacitor with DCS (SiH2Cl2) interface seeding layer
02/21/2012US8120121 Semiconductor device
02/21/2012US8120120 Embedded silicon germanium source drain structure with reduced silicide encroachment and contact resistance and enhanced channel mobility
02/21/2012US8120118 Semiconductor device and manufacturing method of the same
02/21/2012US8120116 Semiconductor device and photomask
02/21/2012US8120113 Metal line in semiconductor device
02/21/2012US8120111 Thin film transistor including insulating film and island-shaped semiconductor film
02/21/2012US8120109 Low dose super deep source/drain implant
02/21/2012US8120104 Semiconductor device and method of manufacturing semiconductor device
02/21/2012US8120102 Semiconductor device
02/21/2012US8120096 Power semiconductor device and method of manufacturing the same
02/21/2012US8120083 Polymer-based ferroelectric memory
02/21/2012US8120078 Photodiode structure
02/21/2012US8120075 Semiconductor device with improved trenches
02/21/2012US8120070 Wiring board and method for manufacturing the same
02/21/2012US8120065 Tensile strained NMOS transistor using group III-N source/drain regions
02/21/2012US8120059 Nitride semiconductor substrate and method of fabricating the same
02/21/2012US8120039 Semiconductor device
02/21/2012US8120038 Electronic device and method of manufacturing the same
02/21/2012US8120033 Semiconductor element and display device using the same
02/21/2012US8120027 Backside nanoscale texturing to improve IR response of silicon solar cells and photodetectors
02/21/2012US8120009 Nanowhiskers with PN junctions, doped nanowhiskers, and methods for preparing them
02/21/2012US8119992 System for overlay measurement in semiconductor manufacturing
02/21/2012US8119920 Multilayer printed wiring board
02/21/2012US8119547 Method of manufacturing a semiconductor integrated circuit device including elimination of static charge of a treated wafer
02/21/2012US8119545 Forming a silicon nitride film by plasma CVD
02/21/2012US8119544 Film formation method and apparatus for semiconductor process
02/21/2012US8119543 Methods of reducing defect formation on silicon dioxide formed by atomic layer deposition (ALD) processes
02/21/2012US8119542 Method of preparing an electrically insulating film and application for the metallization of vias
02/21/2012US8119541 Modulation of stress in stress film through ion implantation and its application in stress memorization technique
02/21/2012US8119540 Method of forming a stressed passivation film using a microwave-assisted oxidation process
02/21/2012US8119539 Methods of fabricating oxide layers on silicon carbide layers utilizing atomic oxygen
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