Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2012
02/23/2012WO2011152935A3 Control of overpolishing of multiple substrates on the same platen in chemical mechanical polishing
02/23/2012WO2011146213A3 Endpoint control of multiple substrates with multiple zones on the same platen in chemical mechanical polishing
02/23/2012WO2011142957A3 Inductive plasma source with metallic shower head using b-field concentrator
02/23/2012WO2011139575A3 Endpoint method using peak location of modified spectra
02/23/2012WO2011139501A3 Pad conditioning sweep torque modeling to achieve constant removal rate
02/23/2012WO2011137070A3 Methods and apparatus for reducing flow splitting errors using orifice ratio conductance control
02/23/2012WO2011133782A3 Purge ring with split baffles for photonic thermal processing systems
02/23/2012WO2011133481A3 Power mosfet with embedded recessed field plate and methods of fabrication
02/23/2012WO2011133207A3 A coating method for gas delivery system
02/23/2012WO2011128811A3 Grounded chuck
02/23/2012WO2011126926A3 System and method for alternating fluid flow
02/23/2012WO2011125704A9 Plasma processing device and plasma processing method
02/23/2012WO2011124205A3 Package for metal-ceramic substrate, and method for packaging such substrates
02/23/2012WO2011118983A3 Lithography apparatus and lithography method
02/23/2012WO2011109148A3 Conformal layers by radical-component cvd
02/23/2012WO2011053470A3 Selective silicon etch process
02/23/2012WO2011048069A3 Method and installation for producing an anti-reflection and/or passivation coating for semiconductor devices
02/23/2012US20120047475 Semiconductor device
02/23/2012US20120045959 Display device and manufacturing method thereof
02/23/2012US20120045905 Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus
02/23/2012US20120045904 Methods for forming a hydrogen free silicon containing dielectric film
02/23/2012US20120045903 Method of manufacturing semiconductor device, method of processing substrate, and substrate processing apparatus
02/23/2012US20120045902 Showerhead electrodes and showerhead electrode assemblies having low-particle performance for semiconductor material processing apparatuses
02/23/2012US20120045901 Method of forming a pattern structure for a semiconductor device
02/23/2012US20120045900 Composition for resist underlayer film, process for forming resist underlayer film, patterning process, and fullerene derivative
02/23/2012US20120045899 Pattern reversal film forming composition and method of forming reversed pattern
02/23/2012US20120045898 Ru CAP METAL POST CLEANING METHOD AND CLEANING CHEMICAL
02/23/2012US20120045897 Wafer Electroless Plating System and Associated Methods
02/23/2012US20120045896 Methods Of Forming Openings And Methods Of Patterning A Material
02/23/2012US20120045895 Semiconductor package having through electrodes that reduce leakage current and method for manufacturing the same
02/23/2012US20120045894 Method for Manufacturing Display Device
02/23/2012US20120045893 Method of making interconnect structure
02/23/2012US20120045892 Method for fabricating semiconductor device
02/23/2012US20120045891 Methods Of Forming Patterns, And Methods Of Forming Integrated Circuits
02/23/2012US20120045890 Methods Of Forming Non-Volatile Memory Devices Including Dummy Word Lines
02/23/2012US20120045889 Integrating a first contact structure in a gate last process
02/23/2012US20120045888 Multilayer low reflectivity hard mask and process therefor
02/23/2012US20120045887 Compositions of doped, co-doped and tri-doped semiconductor materials
02/23/2012US20120045886 Methods for Infusing One or More Materials into Nano-Voids of Nanoporous or Nanostructured Materials
02/23/2012US20120045885 Method for making nanowire element
02/23/2012US20120045884 Protective thin films for use during fabrication of semiconductors, mems, and microstructures
02/23/2012US20120045883 Method for manufacturing soi substrate
02/23/2012US20120045882 Semiconductor device manufacturing method
02/23/2012US20120045881 Method for fabricating an integrated-passives device with a mim capacitor and a high-accuracy resistor on top
02/23/2012US20120045880 Metal gate transistor and method for fabricating the same
02/23/2012US20120045879 Tunnel effect transistors based on elongate monocrystalline nanostructures having a heterostructure
02/23/2012US20120045878 Manufacture of semiconductor device with stress structure
02/23/2012US20120045877 Fabrication method of power semiconductor structure with reduced gate impedance
02/23/2012US20120045876 Method for manufacturing a semiconductor device
02/23/2012US20120045875 Method of manufacturing semiconductor device
02/23/2012US20120045874 Cmos integration method for optimal io transistor vt
02/23/2012US20120045873 Methods of Forming CMOS Transistors Using Tensile Stress Layers and Hydrogen Plasma Treatment
02/23/2012US20120045872 Semiconductor Memory Device
02/23/2012US20120045871 Method of manufacturing semiconductor package
02/23/2012US20120045870 Method of Manufacturing Leadless Integrated Circuit Packages Having Electrically Routed Contacts
02/23/2012US20120045869 Flip chip bonder head for forming a uniform fillet
02/23/2012US20120045868 Semiconductor device contacts
02/23/2012US20120045867 Anti-reflective photovoltaic module
02/23/2012US20120045866 Method of forming an electronic device using a separation technique
02/23/2012US20120045864 Multilayer film formation method and film deposition apparatus used with the method
02/23/2012US20120045861 Method for manufacturing semiconductor device
02/23/2012US20120045855 Position-sensitive metrology system
02/23/2012US20120045854 Inspecting method, template manufacturing method, semiconductor integrated circuit manufacturing method, and inspecting system
02/23/2012US20120045853 SER Testing for an IC Chip Using Hot Underfill
02/23/2012US20120045852 Autotuned screen printing process
02/23/2012US20120045714 Pellicle for lithography and manufacturing method thereof
02/23/2012US20120045611 Composite Carrier Structure
02/23/2012US20120045593 Plasma cvd apparatus
02/23/2012US20120045368 Chemical Coating of Microwell for Electrochemical Detection Device
02/23/2012US20120045308 Dual Arm Robot
02/23/2012US20120045300 High speed substrate aligner apparatus
02/23/2012US20120044961 Method of and photonic device for eliminating or substantially reducing sensitivity to polarization of an injected optical signal and method of manufacturing such photonic device
02/23/2012US20120044763 Non-Volatile Memory and Semiconductor Device
02/23/2012US20120044752 High density integrated circuitry for semiconductor memory
02/23/2012US20120044749 Variable resistance nonvolatile storage device and method of forming memory cell
02/23/2012US20120044741 Semiconductor device having memory unit, method of writing to or reading from memory unit, and semiconductor device manufacturing method
02/23/2012US20120044733 Single Device Driver Circuit to Control Three-Dimensional Memory Element Array
02/23/2012US20120044732 Isolated epitaxial modulation device
02/23/2012US20120044720 Semiconductor device and method of forming low voltage mosfet for portable electronic devices and data processing centers
02/23/2012US20120044468 Lithographic apparatus and device manufacturing method
02/23/2012US20120044433 Electro-optical device
02/23/2012US20120043712 Mechanism and method for aligning a workpiece to a shadow mask
02/23/2012US20120043672 Semiconductor Device and Method of Forming Vertically Offset Conductive Pillars Over First Substrate Aligned to Vertically Offset BOT Interconnect Sites Formed Over Second Substrate
02/23/2012US20120043670 Semiconductor Module System Having Stacked Components With Encapsulated Through Wire Interconnects (TWI)
02/23/2012US20120043669 Stacked semiconductor chip device with thermal management circuit board
02/23/2012US20120043668 Stacked semiconductor chips with thermal management
02/23/2012US20120043667 Compliant printed circuit semiconductor package
02/23/2012US20120043664 Implementing multiple different types of dies for memory stacking
02/23/2012US20120043662 Semiconductor device production method and semiconductor device
02/23/2012US20120043661 Integrated circuits and methods of forming conductive lines and conductive pads therefor
02/23/2012US20120043660 Thin foil semiconductor package
02/23/2012US20120043659 Interconnects with improved tddb
02/23/2012US20120043657 Method for fabricating conductive lines
02/23/2012US20120043655 Wafer-level package using stud bump coated with solder
02/23/2012US20120043654 Mechanisms for forming copper pillar bumps using patterned anodes
02/23/2012US20120043653 Lead pin for package substrate, and method for manufacturing package substrate with the same
02/23/2012US20120043650 Packaging Integrated Circuits
02/23/2012US20120043649 Method for making microchannels on a substrate, and substrate including such microchannels
02/23/2012US20120043648 Electronic component and method of manufacturing electronic component
02/23/2012US20120043647 Low-temperature bonding process
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