Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2012
03/01/2012US20120052619 Method for forming semiconductor film and method for manufacturing photoelectric conversion device
03/01/2012US20120052618 Diffusion Sources From Silicon Based Liquid Precursors
03/01/2012US20120052606 Manufacturing methods of semiconductor device and light-emitting display device
03/01/2012US20120052605 Apparatus and method for laser scribing
03/01/2012US20120052604 Chemical mechanical polishing method and system
03/01/2012US20120052603 Method for detecting the under-fill void in flip chip BGA
03/01/2012US20120052602 Method for designing semiconductor device
03/01/2012US20120052601 Method and System for Extracting Samples After Patterning of Microstructure Devices
03/01/2012US20120052600 Manufacturing method and apparatus for semiconductor device
03/01/2012US20120052599 Wafer Chucking System for Advanced Plasma Ion Energy Processing Systems
03/01/2012US20120052598 Method for the realization of a crossbar array of crossed conductive or semi-conductive access lines
03/01/2012US20120051873 Substrate processing apparatus and method of manufacturing a semiconductor device
03/01/2012US20120051872 Integrated apparatus to assure wafer quality and manufacturability
03/01/2012US20120051871 Load port apparatus
03/01/2012US20120051383 Compact, all solid-state, avalanche photodiode emitter-detector pixel with electronically selectable, passive or active detection mode, for large-scale, high resolution, imaging focal plane arrays
03/01/2012US20120051378 Photodetection
03/01/2012US20120051164 Memory cell, methods of manufacturing memory cell, and memory device having the same
03/01/2012US20120051154 Fuse circuit, fuse array, semiconductor memory device and method of manufacturing semiconductor device
03/01/2012US20120051129 Memory device having three-dimensional gate structure
03/01/2012US20120051124 Phase change memory structures and methods
03/01/2012US20120051123 Phase change memory structures and methods
03/01/2012US20120051113 Semiconductor integrated circuit
03/01/2012US20120051019 Interposer chip, multi-chip package including the interposer chip, and method of manufacturing the same
03/01/2012US20120050996 Semiconductor package with thermal heat spreader
03/01/2012US20120050751 Micromechanical tunable fabry-perot interferometer, an intermediate product, and a method for producing the same
03/01/2012US20120049955 Compound semiconductor device, method of manufacturing the same, power supply device and high-frequency amplifier
03/01/2012US20120049940 Vertical-conduction integrated electronic device and method for manufacturing thereof
03/01/2012US20120049902 Integrated electronic device and method for manufacturing thereof
03/01/2012US20120049884 Crack Sensors for Semiconductor Devices
03/01/2012US20120049555 Robot hand for substrate transfer
03/01/2012US20120049390 Electrical component and method of manufacturing the same
03/01/2012US20120049388 Semiconductor Device and Method of Forming Adhesive Material Over Semiconductor Die and Carrier to Reduce Die Shifting During Encapsulation
03/01/2012US20120049385 Wafer level chip scale package having an enhanced heat exchange efficiency with an emf shield and a method for fabricating the same
03/01/2012US20120049384 Buffer Layer to Enhance Photo and/or Laser Sintering
03/01/2012US20120049383 Re-Establishing Surface Characteristics of Sensitive Low-K Dielectrics in Microstructure Devices by Using an In Situ Surface Modification
03/01/2012US20120049381 Semiconductor device and method for manufacturing the same
03/01/2012US20120049379 Substrate Dicing Technique for Separating Semiconductor Dies with Reduced Area Consumption
03/01/2012US20120049378 Semiconductor storage device and a method of manufacturing the semiconductor storage device
03/01/2012US20120049377 Semiconductor device and method of double photolithography process for forming patterns of the semiconductor device
03/01/2012US20120049376 Manufacturing fixture for a ramp-stack chip package
03/01/2012US20120049375 Method and system for routing electrical connections of semiconductor chips
03/01/2012US20120049374 Method and apparatus for memory cell layout
03/01/2012US20120049370 Carbon nanotube interconnection and manufacturing method thereof
03/01/2012US20120049369 Semiconductor device and method of manufacturing the same
03/01/2012US20120049367 Semiconductor device and manufacturing method of semiconductor device
03/01/2012US20120049366 Package structure having through-silicon-via (tsv) chip embedded therein and fabrication method thereof
03/01/2012US20120049364 Emebedded structures and methods of manufacture thereof
03/01/2012US20120049361 Semiconductor integrated circuit
03/01/2012US20120049360 Semiconductor Package And Method For Making The Same
03/01/2012US20120049358 Semiconductor Device and Semiconductor Process for Making the Same
03/01/2012US20120049357 Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package
03/01/2012US20120049356 Semiconductor device and manufacturing method of semiconductor device
03/01/2012US20120049353 Low-cost 3d face-to-face out assembly
03/01/2012US20120049352 Multi-chip package and method of manufacturing the same
03/01/2012US20120049350 Stress Reduction in Chip Packaging by Using a Low-Temperature Chip-Package Connection Regime
03/01/2012US20120049349 Semiconductor chips and methods of forming the same
03/01/2012US20120049347 Semiconductor structure having conductive vias and method for manufacturing the same
03/01/2012US20120049346 Pillar Bumps and Process for Making Same
03/01/2012US20120049344 Semiconductor Device and Method of Forming FO-WLCSP with Discrete Semiconductor Components Mounted Under and Over Semiconductor Die
03/01/2012US20120049343 Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication method
03/01/2012US20120049342 Semiconductor die terminal
03/01/2012US20120049340 Manufacturing Method of Semiconductor Device
03/01/2012US20120049339 Semiconductor package structure and manufacturing process thereof
03/01/2012US20120049337 Semiconductor device
03/01/2012US20120049335 Singulation method for semiconductor package with plating on side of connectors
03/01/2012US20120049334 Semiconductor Device and Method of Forming Leadframe as Vertical Interconnect Structure Between Stacked Semiconductor Die
03/01/2012US20120049333 Hybrid Multilayer Substrate
03/01/2012US20120049332 Semiconductor package and method for manufacturing the same
03/01/2012US20120049331 Semiconductor device, method for manufacturing same, and semiconductor apparatus
03/01/2012US20120049330 Silicon wafer and method for producing the same
03/01/2012US20120049329 Method of analyzing iron concentration of boron-doped p-type silicon wafer and method of manufacturing silicon wafer
03/01/2012US20120049328 Method of manufacturing p-type nitride semiconductor and semiconductor device fabricated by the method
03/01/2012US20120049327 Vertical parasitic pnp device in a bicmos process and manufacturing method of the same
03/01/2012US20120049326 High holding voltage BJT clamp with embedded reverse path protection in BCD process
03/01/2012US20120049325 Integrated circuit having a semiconductor arrangement and method for producing it
03/01/2012US20120049324 Multi-layer via-less thin film resistor
03/01/2012US20120049323 Lateral connection for a via-less thin film resistor
03/01/2012US20120049322 Cylindrical Embedded Capacitors
03/01/2012US20120049321 Programmable electrical fuse
03/01/2012US20120049320 Electronic device including a feature in a trench
03/01/2012US20120049319 Parasitic pin device in a bicmos process and manufacturing method of the same
03/01/2012US20120049318 Semiconductor device and manufacturing method thereof
03/01/2012US20120049312 Manufacturing method of semiconductor device, semiconductor substrate, and camera module
03/01/2012US20120049304 Thin-wafer current sensors
03/01/2012US20120049300 Sensor apparatus and method for mounting semiconductor sensor device
03/01/2012US20120049299 Composite wafer semiconductor
03/01/2012US20120049298 Mems device assembly and method of packaging same
03/01/2012US20120049296 Oxide Deposition by Using a Double Liner Approach for Reducing Pattern Density Dependence in Sophisticated Semiconductor Devices
03/01/2012US20120049295 Method to reduce threshold voltage variability with through gate well implant
03/01/2012US20120049294 Forming Crown Active Regions for FinFETs
03/01/2012US20120049293 Reduced Threshold Voltage-Width Dependency in Transistors Comprising High-K Metal Gate Electrode Structures
03/01/2012US20120049291 Polysilicon Resistors Formed in a Semiconductor Device Comprising High-K Metal Gate Electrode Structures
03/01/2012US20120049288 Semiconductor integrated circuit device and manufacturing method thereof
03/01/2012US20120049287 Trench isolation mos p-n junction diode device and method for manufacturing the same
03/01/2012US20120049286 Gate Electrodes of a Semiconductor Device Formed by a Hard Mask and Double Exposure in Combination with a Shrink Spacer
03/01/2012US20120049285 Semiconductor device and method of fabricating the same
03/01/2012US20120049284 Same-Chip Multicharacteristic Semiconductor Structures
03/01/2012US20120049283 Semiconductor device and manufacturing method thereof
03/01/2012US20120049281 Semiconductor device with effective work function controlled metal gate
03/01/2012US20120049280 Strained Semiconductor Using Elastic Edge Relaxation Of A Stressor Combined With Buried Insulating Layer
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