Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2012
02/28/2012US8124473 Strain enhanced semiconductor devices and methods for their fabrication
02/28/2012US8124471 Method of post-mold grinding a semiconductor package
02/28/2012US8124470 Strained thin body semiconductor-on-insulator substrate and device
02/28/2012US8124469 High-efficiency filler cell with switchable, integrated buffer capacitance for high frequency applications
02/28/2012US8124468 Process of forming an electronic device including a well region
02/28/2012US8124467 Reducing silicide resistance in silicon/germanium-containing drain/source regions of transistors
02/28/2012US8124466 Process for manufacturing voltage-controlled transistor
02/28/2012US8124465 Method for manufacturing a semiconductor device having a source extension region and a drain extension region
02/28/2012US8124464 Semiconductor device and method for manufacturing the same
02/28/2012US8124463 Local bottom gates for graphene and carbon nanotube devices
02/28/2012US8124461 Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product
02/28/2012US8124459 Bump chip carrier semiconductor package system
02/28/2012US8124458 Method for packaging semiconductor dies having through-silicon vias
02/28/2012US8124457 Manufacturing method of transferring a wiring circuit layer on a metal support substrate to a semiconductor element
02/28/2012US8124456 Methods for securing semiconductor devices using elongated fasteners
02/28/2012US8124455 Wafer strength reinforcement system for ultra thin wafer thinning
02/28/2012US8124454 Die separation
02/28/2012US8124452 Processes and structures for IC fabrication
02/28/2012US8124451 Integrated circuit packaging system with interposer
02/28/2012US8124450 Stacking multiple devices using single-piece interconnecting element
02/28/2012US8124449 Device including a semiconductor chip and metal foils
02/28/2012US8124448 Semiconductor chip with crack deflection structure
02/28/2012US8124447 Manufacturing method of advanced quad flat non-leaded package
02/28/2012US8124446 Structure of high performance combo chip and processing method
02/28/2012US8124445 Confined resistance variable memory cell structures and methods
02/28/2012US8124444 Method of doping organic semiconductors
02/28/2012US8124441 Programmable resistive memory cell with filament placement structure
02/28/2012US8124439 Method for making an optical device with integrated optoelectronic components
02/28/2012US8124438 Method of fabricating CMOS image sensor
02/28/2012US8124437 Forming protrusions in solar cells
02/28/2012US8124436 MEMS switch capping and passivation method
02/28/2012US8124435 Method for manufacturing a microelectromechanical component, and a microelectromechanical component
02/28/2012US8124434 Method and system for packaging a display
02/28/2012US8124433 Low optical loss electrode structures for LEDs
02/28/2012US8124432 Nitride semiconductor optical element and manufacturing method thereof
02/28/2012US8124431 Nitride semiconductor laser device and method of producing the same
02/28/2012US8124429 Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
02/28/2012US8124428 Structure and method for testing MEMS devices
02/28/2012US8124427 Method of creating an extremely thin semiconductor-on-insulator (ETSOI) layer having a uniform thickness
02/28/2012US8124426 Tunnel junction via
02/28/2012US8124425 Method for manufacturing magnetic memory chip device
02/28/2012US8124325 Methods and apparatus for the manufacture of microstructures
02/28/2012US8124318 Over-coating agent for forming fine patterns and a method of forming fine patterns using such agent
02/28/2012US8124239 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same
02/28/2012US8124173 Process for packaging electronic devices
02/28/2012US8123997 Low temperature melt-processing of organic-inorganic hybrid
02/28/2012US8123976 Alkaline aqueous solution composition used for washing or etching substrates
02/28/2012US8123969 Process for removing high stressed film using LF or HF bias power and capacitively coupled VHF source power with enhanced residue capture
02/28/2012US8123963 Method for producing a semiconductor component and a semiconductor component produced according to the method
02/28/2012US8123903 Plasma reactor having multiple antenna structure
02/28/2012US8123902 Gas flow diffuser
02/28/2012US8123901 Etching apparatus
02/28/2012US8123900 Substrate supporting unit and apparatus for treating substrate using the substrate supporting unit
02/28/2012US8123896 Laminating system
02/28/2012US8123861 Apparatus for making interconnect seed layers and products
02/28/2012US8123860 Apparatus for cyclical depositing of thin films
02/28/2012US8122850 Method and apparatus for processing polysilazane film
02/28/2012US8122848 Film forming apparatus, manufacturing management system and method of manufacturing semiconductor devices
02/28/2012CA2505631C Epitaxial growth method and substrate for epitaxial growth
02/27/2012DE202011104644U1 Verarbeiteter Silizium-Wafer oder Siliziumchip oder fotovoltaische Zelle und eine Vorrichtung, eine Abtragungsvorrichtung, eine Steuervorrichtung und ein Computerprogrammprodukt zur Herstellung derselben. Processed silicon wafer or silicon chip or photovoltaic cell and an apparatus, an ablation device, a control device and a computer program product for producing the same.
02/23/2012WO2012024696A2 Laser treatment of a medium for microfluidics and various other applications
02/23/2012WO2012024556A1 Tape applicator
02/23/2012WO2012024544A2 Variable resistance memory element and fabrication methods
02/23/2012WO2012024391A2 Cmos transistor fabrication with different threshold voltages
02/23/2012WO2012024374A2 Cmp slurry recycling system and methods
02/23/2012WO2012024278A1 Measurement system and method
02/23/2012WO2012024114A2 Methods for forming a hydrogen free silicon containing dielectric film
02/23/2012WO2012024061A2 Extended life deposition ring
02/23/2012WO2012024056A2 Semiconductor constructions; and methods for providing electrically conductive material within openings
02/23/2012WO2012024037A2 PROGRAMMABLE FETs USING Vt-SHIFT EFFECT AND METHODS OF MANUFACTURE
02/23/2012WO2012024033A2 Showerhead assembly with gas injection distribution devices
02/23/2012WO2012023973A2 Liquid precursor for deposition of indium selenide and method of preparing the same
02/23/2012WO2012023899A1 Hermetic seal and method of manufacture thereof
02/23/2012WO2012023764A2 Method of manufacturing an led module
02/23/2012WO2012023613A1 Texture-forming composition, method for producing silicon substrate, and kit for preparing texture-forming composition
02/23/2012WO2012023557A1 Apparatus for manufacturing compound semiconductor, method for manufacturing compound semiconductor, and compound semiconductor
02/23/2012WO2012023537A1 Dry etching method and method of manufacturing semiconductor device
02/23/2012WO2012023519A1 Ink for production of compound semiconductor thin film, compound semiconductor thin film produced using the ink, solar cell equipped with the compound semiconductor thin film, and process for production of the solar cell
02/23/2012WO2012023476A1 Method of manufacturing organic semiconductor thin film and monocrystalline organic semiconductor thin film
02/23/2012WO2012023440A1 Solder ball for semiconductor mounting and electronic member
02/23/2012WO2012023402A1 Microlens array manufacturing method and microlens array
02/23/2012WO2012023394A1 Esd protection device
02/23/2012WO2012023387A1 Method for producing transistor
02/23/2012WO2012023252A1 Magnetic tunnel junction element
02/23/2012WO2012023247A1 Semiconductor device
02/23/2012WO2012023233A1 Heat treatment method for wafer, method for producing silicon wafer, silicon wafer, and heat treatment apparatus
02/23/2012WO2012023228A1 Semiconductor device and method for manufacturing same
02/23/2012WO2012023180A1 Connecting apparatus, semiconductor wafer testing apparatus provided with same, and connecting method
02/23/2012WO2012023157A1 Magnetoresistance element and semiconductor storage device
02/23/2012WO2012023156A1 Substrate transfer apparatus, system for manufacturing electronic device, and method for manufacturing electronic device
02/23/2012WO2012022695A1 Method for producing at least one optoelectronic semiconductor component
02/23/2012WO2012022442A1 Pseudo-substrate for use in the production of semiconductor components and method for producing a pseudo-substrate
02/23/2012WO2012022144A1 Semiconductor device and manufacturing method of its local interconnect structure
02/23/2012WO2012022135A1 Ultra-thin body transistor and manufacturing method thereof
02/23/2012WO2012022109A1 Semiconductor device structure and manufacturing method thereof
02/23/2012WO2012022108A1 Semiconductor device and method for forming the same
02/23/2012WO2012021932A1 A method of forming a structure in a material
02/23/2012WO2011163599A3 Metal coating for indium bump bonding
02/23/2012WO2011163429A3 Ferro-electric capacitor modules, methods of manufacture and design structures
02/23/2012WO2011159021A3 Horizontal adjusting part and substrate joining apparatus including same
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