Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2012
02/29/2012EP2422363A1 Method and device for introducing and removing substrates
02/29/2012EP2422362A1 Transport device having a deflectable sealing frame
02/29/2012EP2422360A2 Method to thin a silicon-on-insulator substrate
02/29/2012EP2422359A2 Enhanced scavenging of residual fluorine radicals using silicon coating on process chamber walls
02/29/2012EP2422358A1 Method for fabricating an integrated-passives device with a mim capacitor and a high-accuracy resistor on top
02/29/2012EP2422357A1 Device and method for separating a substrate from a carrier substrate
02/29/2012EP2421677A1 Receiving device for receiving semiconductor substrates
02/29/2012EP2109884B1 Method for preparing a germanium layer from an silicon-germanium on-insulator substrate
02/29/2012EP2092034B1 Chemical mechanical polishing slurry compositions, methods of preparing the same and methods of using the same
02/29/2012EP1724028B1 Method for preparing thin film of condensed polycyclc aromatic compound
02/29/2012EP1668692B1 Adjustable self-aligned air gap dielectric for low capacitance wiring
02/29/2012EP1664928B1 Positive photoresist composition and resist pattern formation
02/29/2012EP1555694B1 Spin transistor using spin filter effect and nonvolatile memory using spin transistor
02/29/2012EP1509379B1 Methods and apparatus of field-induced pressure imprint lithography
02/29/2012EP1432773B1 Rare earth salt oxidizer based cmp method
02/29/2012EP1429378B1 Method of thermally releasing a chip from a thermal release type pressure sensitive adhesive sheet
02/29/2012EP1386348B1 Method of forming a lattice-mismatched semiconductor layer
02/29/2012EP1256977B1 Method and apparatus for producing a polycrystalline silicon film
02/29/2012EP1129481B1 Method and device for compensating wafer bias in a plasma processing chamber
02/29/2012CN202153534U 匀气板 Uniform gas board
02/29/2012CN202153509U Microenvironment vertical laminar flow system
02/29/2012CN202152917U 药液供给系统 Liquid supply system
02/29/2012CN202151886U 半导体切割设备的排水装置 Drain semiconductor cutting equipment
02/29/2012CN202151885U 单晶/多晶硅片多线切割自动脱胶装置 Mono / polycrystalline silicon sheet multi-wire cutting device automatically unglued
02/29/2012CN1971866B Smart card body, manufacturing method thereof, smart card, installation method thereof and belt carrier
02/29/2012CN1952786B Gas shower, lithographic apparatus and use of a gas shower
02/29/2012CN1930263B Resin composition and semiconductor devices made by using the same
02/29/2012CN1824592B Wafer transfer device
02/29/2012CN1749861B Method for optimizing mask pattern formed on the substrate
02/29/2012CN1607685B Composition for preparing organic insulator
02/29/2012CN102365906A Rf bus and rf return bus for plasma chamber electrode
02/29/2012CN102365828A Signal transmission communication unit and coupler
02/29/2012CN102365750A Switchable junction with intrinsic diode
02/29/2012CN102365746A Heterojunction oxide non-volatile memory device
02/29/2012CN102365740A Boosting transistor performance with non-rectangular channels
02/29/2012CN102365735A Interconnect structure for a semiconductor device with a resilient stress absorber and related method of manufacture
02/29/2012CN102365732A Structure and fabrication of field-effect transistor having source/drain extension defined by multiple local concentration maxima
02/29/2012CN102365731A Structure and fabrication of asymmetric field-effect transistor having asymmetric channel zone and differently configured source/drain extensions
02/29/2012CN102365730A Structure and fabrication of like-polarity field-effect transistors having different configurations of source/drain extensions, halo pockets, and gate dielectric thicknesses
02/29/2012CN102365729A Structure and fabrication of field-effect transistor using empty well in combination with source/drain extensions or/and halo pocket
02/29/2012CN102365728A Configuration and fabrication of semiconductor structure in which source and drain extensions of field-effect transistor are defined with different dopants
02/29/2012CN102365727A Structure and fabrication of field-effect transistor having nitrided gate dielectric layer with tailored vertical nitrogen concentration profile
02/29/2012CN102365726A Holding apparatus, transfer apparatus, and rotation transmitting apparatus
02/29/2012CN102365725A Bonding device, bonding sealer amplitude measurement method, and bonding sealer amplitude calibration method
02/29/2012CN102365724A Method for disposing a component
02/29/2012CN102365723A Method for disposing a component
02/29/2012CN102365722A Method for mounting member
02/29/2012CN102365721A Method for forming a high-k gate stack with reduced effective oxide thickness
02/29/2012CN102365720A Structure and method for forming a salicide on the gate electrode of a trench-gate fet
02/29/2012CN102365719A Rapid cooling of a substrate by motion
02/29/2012CN102365718A Method for low-k dielectric etch with reduced damage
02/29/2012CN102365717A Multifrequency capacitively coupled plasma etch chamber
02/29/2012CN102365716A Point of use recycling system for cmp slurry
02/29/2012CN102365715A Method for formation of metal silicide film
02/29/2012CN102365714A Graded well implantation for asymmetric transistors having reduced gate electrode pitches
02/29/2012CN102365713A Buffer layer to enhance photo and/or laser sintering
02/29/2012CN102365712A Web substrate deposition system
02/29/2012CN102365711A Source supplying unit, method for supplying source, and thin film depositing apparatus
02/29/2012CN102365710A Production method for a polysilicon mask using a metal catalyst, and a production method for semiconductor elements using the same
02/29/2012CN102365709A Patterning method
02/29/2012CN102365708A Selective Etching of Reactor Surfaces
02/29/2012CN102365707A Photovoltaic device with improved crystal orientation
02/29/2012CN102365590A Shared compliance in a rapid exchange device for reticles, and reticle stage
02/29/2012CN102365589A Exposure method and exposure apparatus
02/29/2012CN102365484A Regulating valve device
02/29/2012CN102365396A Composition for metal plating comprising suppressing agent for void free submicron feature filling
02/29/2012CN102365395A Composition for metal plating comprising suppressing agent for void free submicron feature filling
02/29/2012CN102365392A Plasma etching method
02/29/2012CN102365388A Liquid raw material vaporizer
02/29/2012CN102365386A Method for forming metal nitride film, and storage medium
02/29/2012CN102365313A Cation-polymerizable resin composition and cured product thereof
02/29/2012CN102365303A Polymer, hydrogen additive, resin composition, resin film, and electronic component
02/29/2012CN102365004A Manufacture method for high-precision bonding integrated circuit (IC) board
02/29/2012CN102364699A Marking method for ingot casting polycrystalline silicon slice head and tail sequencing
02/29/2012CN102364690A Tunneling field effect transistor (TFET) and manufacturing method thereof
02/29/2012CN102364689A Floating gate structure of flash memory device and manufacturing method for floating gate structure
02/29/2012CN102364683A Packaging structure and method thereof, and electronic equipment
02/29/2012CN102364675A Method for forming flash memory
02/29/2012CN102364674A Contact hole etching method, integrate circuit (IC) manufacturing method and IC
02/29/2012CN102364673A Method for forming copper interconnection structure
02/29/2012CN102364672A Method for improving bonding performance of copper barrier layer and copper metal layer
02/29/2012CN102364671A Method for manufacturing silicon through hole
02/29/2012CN102364670A Manufacturing method of metal copper Damascus interconnection structure
02/29/2012CN102364669A Method for manufacturing copper interconnection layer of ultralow dielectric constant film
02/29/2012CN102364668A Silicon wafer box and silicon wafer feeding device
02/29/2012CN102364667A Packaging device for power electronic device
02/29/2012CN102364666A Anti-electromagnetic interference chip encapsulating method
02/29/2012CN102364665A Synthetic method of integrated circuit packaging material
02/29/2012CN102364664A Method for improving metal-oxide-semiconductor field-effect transistor (MOSFET/ MOS device) carrier mobility and MOS device manufacturing method
02/29/2012CN102364663A Grid side wall etching method, metal-oxide-semiconductor (MOS) device manufacturing method and MOS device
02/29/2012CN102364662A Texturing equipment capable of improving solar cell RIE uniformity and method thereof
02/29/2012CN102364661A Grid side wall forming method, metal-oxide-semiconductor (MOS) device manufacturing method and MOS device
02/29/2012CN102364660A Method for manufacturing ultrathin line based on common photoetching and oxidation technology
02/29/2012CN102364390A Liquid crystal display (LCD) panel and method for forming same
02/29/2012CN102364389A Manufacturing method based on control over angle of contact hole wall of liquid crystal display device
02/29/2012CN102363713A Stabilized chemical mechanical polishing composition and method of polishing substrate
02/29/2012CN102117756B Linear reciprocating transmission device
02/29/2012CN102034686B Capacitor and forming method thereof
02/29/2012CN102023438B Liquid crystal display device, manufacturing method and defect repair method
02/29/2012CN102023433B TFT-LCD array substrate and method for manufacturing the same
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