Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2012
02/22/2012EP2419921A1 Scrubber clean before oxide chemical mechanical polish (cmp) for reduced microscratches and improved yields
02/22/2012EP2419920A1 Devices and methods for interfacing microfluidic devices with macrofluidic devices
02/22/2012EP2053462B1 Method for fabricating an electronic circuit device
02/22/2012EP2050124B1 Method of fabricating semiconductor devices on a group iv substrate with controlled interface properties and diffusion tails
02/22/2012EP1927138B1 Semiconductor device
02/22/2012EP1872392B1 Substrate processing apparatus
02/22/2012EP1800360B1 Electrical circuit with a nanostructure and method for contacting a nanostructure
02/22/2012EP1711966B1 Vertical fin-fet mos devices
02/22/2012EP1547975B1 Method for modifying porous film, modified porous film and use of same
02/22/2012EP1451858B1 Interconnects with improved barrier layer adhesion
02/22/2012EP1406300B1 Method of manufacturing a lead frame
02/22/2012EP1134804B1 Thermally enhanced semiconductor carrier
02/22/2012CN202150480U 太阳能硅片装载框 Solar wafer loading boxes
02/22/2012CN202150475U 基板表面处理装置 The surface treatment apparatus of the substrate
02/22/2012CN202150448U 晶圆测试机承片台 Wafer tester bearing piece sets
02/22/2012CN202150447U 晶片翻转装置 Flip chip devices
02/22/2012CN202150446U 太阳能硅片装载架 Solar wafer loading rack
02/22/2012CN202150445U 硅片出片辅助型背带 A piece of silicon strap assisted
02/22/2012CN202146851U 光伏组件用胶枪的节省装置 PV modules with a glue gun saving devices
02/22/2012CN1943050B 化合物半导体发光器件、其晶片以及该晶片的制造方法 The method of manufacturing a compound semiconductor light-emitting device wafer and wafer
02/22/2012CN1791965B 用于半导体布置的结构和制造半导体布置的方法 The structure and manufacturing method of a semiconductor arrangement for a semiconductor arrangement
02/22/2012CN1669720B 用于激光束加工机中的卡盘工作台 For a laser beam processing machine chuck table
02/22/2012CN102362557A Microwave plasma processing apparatus
02/22/2012CN102362357A Method of producing solar cell module
02/22/2012CN102362354A 半导体装置 Semiconductor device
02/22/2012CN102362350A Methods, devices, and systems relating to memory cell having floating body
02/22/2012CN102362346A Via structure and method thereof
02/22/2012CN102362344A A transistor with an embedded strain inducing material having a gradually shaped configuration
02/22/2012CN102362343A Metallization system of semiconductor device comprising extra-tapered transition vias
02/22/2012CN102362342A Method and apparatus for reduction of voltage potential spike during dechucking
02/22/2012CN102362341A Holding device, transfer device, and device for transmitting torque
02/22/2012CN102362340A Semiconductor wafer housing container
02/22/2012CN102362339A Method for producing compound semiconductor, method for manufacturing photoelectric conversion device, and solution for forming semiconductor
02/22/2012CN102362338A Process for forming an electroactive layer
02/22/2012CN102362337A Plasma processing apparatus and method of producing amorphous silicon thin film using same
02/22/2012CN102362336A Semiconductor substrate, semiconductor device, and method of producing semiconductor substrate
02/22/2012CN102362335A Low temperature continuous circulation reactor for the aqueous synthesis of ZnO films, nanostructures, and bulk single crystals
02/22/2012CN102362334A Methods of forming patterns on substrates
02/22/2012CN102362333A Curable composition for nanoimprinting and cured object
02/22/2012CN102362332A Mounting table structure and treatment device
02/22/2012CN102362225A Method for forming resist pattern, and device
02/22/2012CN102362224A Method for forming resist pattern, and device
02/22/2012CN102362188A Test device, test method, and production method
02/22/2012CN102362187A Manufacturing apparatus, manufacturing method and package device
02/22/2012CN102362146A Reflectance distribution curve modeling method, thickness measurement scheme and thickness measurement reflectometer using same
02/22/2012CN102362018A Method for manufacturing sapphire substrate, and semiconductor device
02/22/2012CN102362017A Silicon wafer and method of manufacturing same
02/22/2012CN102362014A Device and method to conduct an electrochemical reaction on a surface of a semiconductor substrate
02/22/2012CN102362013A Electrodeposition of copper in microelectronics with dipyridyl-based levelers
02/22/2012CN102362005A Sputter deposition device
02/22/2012CN102362004A In-ga-zn-o type sputtering target
02/22/2012CN102361940A Compositions comprising silane modified metal oxides
02/22/2012CN102361049A Blanking device for solar cell production line
02/22/2012CN102361036A Semiconductor structure with metal source and metal drain and forming method for structure
02/22/2012CN102361033A Pixel structure for display panel and manufacturing method thereof
02/22/2012CN102361030A One-time programmable memory cell array and manufacturing method thereof
02/22/2012CN102361025A High-density integrated circuit packaging structure, packaging method for packaging structure, and integrated circuit
02/22/2012CN102361024A Semiconductor package with single sided substrate design and manufacturing methods thereof
02/22/2012CN102361023A Ceramic shell capable of enhancing radiation shielding and preparation method thereof
02/22/2012CN102361022A Method for manufacturing embedded flash memory
02/22/2012CN102361021A Method for manufacturing embedded flash memory
02/22/2012CN102361020A Control method for forming majority of semiconductors
02/22/2012CN102361019A Method for manufacturing semiconductor device
02/22/2012CN102361018A Method for improving small-spherical defect in manufacture process of shallow trench isolation substrate
02/22/2012CN102361017A Ultrasonic air suction component
02/22/2012CN102361016A Adhesive film for semiconductor, semiconductor chip, and method for processing semiconductor device
02/22/2012CN102361015A Deep hole morphology monitoring method applied in dual damascene process
02/22/2012CN102361014A State monitoring and fault diagnosis method for large-scale semiconductor manufacture process
02/22/2012CN102361013A Method for manufacturing gold salient points on wafer-level flip chip
02/22/2012CN102361012A Method for reducing on-resistance of power-type vertical double-diffused metal-oxide-semiconductor field-effect transistor (VDMOSFED)
02/22/2012CN102361011A Method for forming gate of semiconductor device
02/22/2012CN102361010A T type gate high electron mobility transistor (HEMT) device and manufacturing method thereof
02/22/2012CN102361009A Production method of rectifier diode
02/22/2012CN102361008A Method for controlling defects of wafer edge
02/22/2012CN102361007A Method for etching groove and semiconductor device
02/22/2012CN102361006A Preparation method of low-stress tantalum-nitrogen thin film
02/22/2012CN102361005A Capping shutter control method in scanning laser processing of film board
02/22/2012CN102361004A Integration of barrier layer and seed layer
02/22/2012CN102361003A Work dispatch control method and work dispatch control equipment
02/22/2012CN102360146A TFT-LCD (thin film transistor-liquid crystal display) array base plate and manufacturing method thereof
02/22/2012CN102360145A LCD (liquid crystal display) panel and manufacturing method thereof
02/22/2012CN102358516A Stage apparatus and application processing apparatus
02/22/2012CN102357997A Runner for forming high-frequency preheating-free resin
02/22/2012CN102357739A Laser processing method
02/22/2012CN102357738A Laser processing method
02/22/2012CN102357477A Pollution prevention device
02/22/2012CN102087986B 晶片传送装置 Wafer transfer device
02/22/2012CN102054703B 一种无cmp的适用于后栅工艺的平坦化制备工艺 A non-cmp planarization process is suitable for the preparation of post-gate process
02/22/2012CN102054691B 纳流体晶体管的制备方法 Preparation nanofluidic transistor
02/22/2012CN102054668B 电子束正性光刻胶Zep 520掩蔽介质刻蚀的方法 Positive electron beam resist Zep 520 etching method masked media
02/22/2012CN102017075B 具有高电阻率性质的低成本基材及其制造方法 And low-cost method of producing a substrate having a high resistivity properties
02/22/2012CN101970712B 溅射设备 Sputtering Equipment
02/22/2012CN101908522B Semiconductor wafer and method for manufacturing semiconductor device
02/22/2012CN101897012B 焊接装置及焊接方法 Welding equipment and welding method
02/22/2012CN101894843B 基于锆钛酸铅存储介质的铁电动态随机存储器及制备方法 Ferroelectric lead zirconate titanate-based storage media and the preparation method of dynamic random access memory
02/22/2012CN101894836B 像素结构及其制作方法 Pixel structure and manufacturing method thereof
02/22/2012CN101894771B 多层堆叠电阻转换存储器的制造方法 Resistance conversion method for manufacturing multilayer stack memory
02/22/2012CN101884091B 用于沉积导电黏附材料的设备和方法 Apparatus and method for depositing a conductive material adhesion
02/22/2012CN101882562B 半导体封装用导线接合装置及其方法 Device and a wire bonding method for semiconductor encapsulation
02/22/2012CN101866119B 零标的形成方法 The method for forming the subject of zero
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