Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2012
02/21/2012US8119538 Oxide formation in a plasma process
02/21/2012US8119537 Selective etching of oxides to metal nitrides and metal oxides
02/21/2012US8119536 Semiconductor device and method of forming the same
02/21/2012US8119535 Pitch reduced patterns relative to photolithography features
02/21/2012US8119534 Semiconductor light emitting device with protrusions to improve external efficiency and crystal growth
02/21/2012US8119533 Pattern formation in semiconductor fabrication
02/21/2012US8119532 Inductively coupled dual zone processing chamber with single planar antenna
02/21/2012US8119531 Mask and etch process for pattern assembly
02/21/2012US8119530 Pattern forming method and semiconductor device manufacturing method
02/21/2012US8119529 Method for chemical mechanical polishing a substrate
02/21/2012US8119528 Nanoscale electrodes for phase change memory devices
02/21/2012US8119527 Depositing tungsten into high aspect ratio features
02/21/2012US8119526 Method of forming a metal layer and a method of fabricating a semiconductor device
02/21/2012US8119525 Process for selective growth of films during ECP plating
02/21/2012US8119524 Method of manufacturing semiconductor device
02/21/2012US8119523 Method for fabricating semiconductor device using dual damascene process
02/21/2012US8119522 Method of fabricating damascene structures
02/21/2012US8119520 Semiconductor device and method for manufacturing the same
02/21/2012US8119519 Semiconductor device manufacturing method
02/21/2012US8119518 Noble metal barrier for fluorine-doped carbon films
02/21/2012US8119517 Chemical mechanical polishing method and method of manufacturing semiconductor device
02/21/2012US8119516 Bump structure formed from using removable mandrel
02/21/2012US8119515 Bonding pad for anti-peeling property and method for fabricating the same
02/21/2012US8119514 Cobalt-doped indium-tin oxide films and methods
02/21/2012US8119513 Method for making cadmium sulfide layer
02/21/2012US8119512 Method for fabricating semiconductor device with damascene bit line
02/21/2012US8119511 Non-volatile memory device with improved immunity to erase saturation and method for manufacturing same
02/21/2012US8119510 Manufacturing method of semiconductor device
02/21/2012US8119508 Forming integrated circuits with replacement metal gate electrodes
02/21/2012US8119507 Lateral double-diffused metal oxide semiconductor (LDMOS) transistors
02/21/2012US8119506 Group 6a/group 3a ink and methods of making and using same
02/21/2012US8119505 Method of making group III nitride-based compound semiconductor
02/21/2012US8119504 Method for transferring a nano material from a substrate to another substrate
02/21/2012US8119503 Methods of forming integrated circuit devices having vertical semiconductor interconnects and diodes therein and devices formed thereby
02/21/2012US8119502 Method for packaging components
02/21/2012US8119501 Method for separating a semiconductor wafer into individual semiconductor dies using an implanted impurity
02/21/2012US8119500 Wafer bonding
02/21/2012US8119499 Semiconductor substrate fabrication by etching of a peeling layer
02/21/2012US8119498 Wafer bonding method and wafer stack formed thereby
02/21/2012US8119497 Thin embedded active IC circuit integration techniques for flexible and rigid circuits
02/21/2012US8119496 Semiconductor device and manufacturing method thereof
02/21/2012US8119495 Method of manufacturing a semiconductor device having an active region and dummy patterns
02/21/2012US8119494 Defect-free hetero-epitaxy of lattice mismatched semiconductors
02/21/2012US8119493 Method of forming a semiconductor device an alignment mark formed in a groove
02/21/2012US8119492 Dissolving precipates in alloy material in capacitor structure
02/21/2012US8119491 Methods of fabricating passive element without planarizing and related semiconductor device
02/21/2012US8119490 Method for manufacturing SOI substrate
02/21/2012US8119489 Method of forming a shallow trench isolation structure having a polysilicon capping layer
02/21/2012US8119487 Semiconductor device and method for fabricating the same
02/21/2012US8119486 Methods of manufacturing semiconductor devices having a recessed-channel
02/21/2012US8119485 Semiconductor device and fabrication method thereof
02/21/2012US8119484 DRAM with nanofin transistors
02/21/2012US8119483 Methods of forming memory cells
02/21/2012US8119482 MOSFET using gate work function engineering for switching applications
02/21/2012US8119481 High-κ capped blocking dielectric bandgap engineered SONOS and MONOS
02/21/2012US8119480 Semiconductor memory devices performing erase operation using erase gate and methods of manufacturing the same
02/21/2012US8119479 Scalable flash EEPROM memory cell with floating gate spacer wrapped by control gate and method of manufacture
02/21/2012US8119478 Multi-bit phase-change random access memory (PRAM) with diameter-controlled contacts and methods of fabricating and programming the same
02/21/2012US8119477 Memory system with protection layer to cover the memory gate stack and methods for forming same
02/21/2012US8119476 Methods of forming integrated circuit capacitors having sidewall supports and capacitors formed thereby
02/21/2012US8119475 Method of forming gate of semiconductor device
02/21/2012US8119474 High performance capacitors in planar back gates CMOS
02/21/2012US8119473 High temperature anneal for aluminum surface protection
02/21/2012US8119472 Silicon device on Si:C SOI and SiGe and method of manufacture
02/21/2012US8119471 Semiconductor device and method for manufacturing the same
02/21/2012US8119470 Mitigation of gate to contact capacitance in CMOS flow
02/21/2012US8119469 Method of fabricating polycrystalline silicon thin film for improving crystallization characteristics and method of fabricating liquid crystal display device using the same
02/21/2012US8119468 Thin film transistor and method for manufacturing the same
02/21/2012US8119467 Method of manufacturing thin film transistor substrate and method of manufacturing organic light emitting display apparatus
02/21/2012US8119466 Self-aligned process for nanotube/nanowire FETs
02/21/2012US8119465 Thin film transistor and method for fabricating the same
02/21/2012US8119464 Fabrication of semiconductors with high-K/metal gate electrodes
02/21/2012US8119463 Method of manufacturing thin film transistor and thin film transistor substrate
02/21/2012US8119462 Method for forming conductive film, thin-film transistor, panel with thin-film transistor, and method for manufacturing thin-film transistor
02/21/2012US8119461 Reducing the creation of charge traps at gate dielectrics in MOS transistors by performing a hydrogen treatment
02/21/2012US8119460 Semiconductor device and method of forming the same
02/21/2012US8119459 Recessed channel negative differential resistance-based memory cell
02/21/2012US8119458 Placement method of an electronic module on a substrate
02/21/2012US8119457 Flip chip MLP with folded heat sink
02/21/2012US8119456 Bond pad for wafer and package for CMOS imager
02/21/2012US8119455 Wafer level package fabrication method
02/21/2012US8119454 Manufacturing fan-out wafer level packaging
02/21/2012US8119453 Chip-size-package semiconductor chip and manufacturing method
02/21/2012US8119452 Method of fabricating a semiconductor device
02/21/2012US8119451 Method of manufacturing semiconductor package and method of manufacturing substrate for the semiconductor package
02/21/2012US8119450 Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots
02/21/2012US8119449 Method of manufacturing an electronic part mounting structure
02/21/2012US8119448 Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same
02/21/2012US8119447 Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof
02/21/2012US8119446 Integrated chip package structure using metal substrate and method of manufacturing the same
02/21/2012US8119445 Organic semiconductors and growth approaches therefor
02/21/2012US8119444 Method for manufacturing the image sensor
02/21/2012US8119443 Method of manufacturing image sensor having ions implanted into photodiode layer to control contact hole shape
02/21/2012US8119440 Method and apparatus providing refractive index structure for a device capturing or displaying images
02/21/2012US8119439 Methods of manufacturing an image sensor having an air gap
02/21/2012US8119435 Wafer level processing for backside illuminated image sensors
02/21/2012US8119433 Image sensor and fabricating method thereof
02/21/2012US8119432 Method and apparatus for MEMS oscillator
02/21/2012US8119431 Method of forming a micro-electromechanical system (MEMS) having a gap stop
02/21/2012US8119430 Method of manufacturing semiconductor nanowire sensor device and semiconductor nanowire sensor device manufactured according to the method
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