Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2012
03/21/2012CN102386111A Method for manufacturing electronic parts device and resin composition for electronic parts encapsulation
03/21/2012CN102386110A Manufacture method for resin seal molding product and manufacture apparatus for resin seal molding product
03/21/2012CN102386109A Assembly process for IGBT (insulated gate bipolar transistor)
03/21/2012CN102386108A Semiconductor device and method of forming adhesive material over semiconductor die and carrier
03/21/2012CN102386107A Packaging method with four flat sides and without pin and structure manufactured by packaging method
03/21/2012CN102386106A Partially patterned lead frames and methods of making and using the same in semiconductor packaging
03/21/2012CN102386105A Packaging method with four flat sides and without pin and structure manufactured by packaging method
03/21/2012CN102386104A Quadrilateral flat pin-free encapsulation method
03/21/2012CN102386103A Method for manufacturing package substrate, and package substrate structure
03/21/2012CN102386102A Method for improving breakdown voltage of MOS (metal-oxide semiconductor) transistor and manufacturing method of MOS transistor
03/21/2012CN102386101A Semiconductor device and method of forming low voltage MOSFET for portable electronic devices and data processing centers
03/21/2012CN102386100A Method of manufacturing silicon carbide semiconductor device
03/21/2012CN102386099A Method for forming a semiconductor device, and a semiconductor with an integrated poly-diode
03/21/2012CN102386098A Metal oxide semiconductor (MOS) transistor and forming method thereof
03/21/2012CN102386097A Metal oxide semiconductor (MOS) transistor and manufacturing method thereof
03/21/2012CN102386096A Method of improving consistence and stability of LDMOS (Laterally Diffused Metal Oxide Semiconductor) performance
03/21/2012CN102386095A Manufacturing method of semiconductor structure
03/21/2012CN102386094A Method for forming bottle-type groove and method for forming bottle-type groove capacitor
03/21/2012CN102386093A Spacer structure for transistor device and method of manufacturing same
03/21/2012CN102386092A Manufacturing method of low-leakage diode chip
03/21/2012CN102386091A Manufacturing method of diode and automatic output device of diode
03/21/2012CN102386090A Method of forming polycrystalline silicon layer and thin film transistor and organic light emitting device
03/21/2012CN102386089A Method for preparing semiconductor device structure
03/21/2012CN102386088A Method for removing photoinduced resist layer on semiconductor device structure
03/21/2012CN102386087A Improved construction method of metal front dielectric layer
03/21/2012CN102386086A Roller and etching cleaning machine
03/21/2012CN102386085A Planarization method for back gate process and device structure thereof
03/21/2012CN102386084A Method for planarizing surface of wafer
03/21/2012CN102386083A MOS (metal oxide semiconductor) transistor and manufacturing method of MOS transistor gate dielectric layer
03/21/2012CN102386082A Method for forming semiconductor device
03/21/2012CN102386081A Method for forming metal gate
03/21/2012CN102386080A Method for forming metal gate
03/21/2012CN102386079A Manufacturing method of high K grid dielectric layer and method for forming MOS (Metal Oxide Semiconductor) transistor
03/21/2012CN102386078A Method for manufacturing polycrystalline gate structure
03/21/2012CN102386077A Method for manufacturing semiconductor device
03/21/2012CN102386076A Corrosion method of laminated structures of metal gate layer/high K gate dielectric layer
03/21/2012CN102386075A Lightly-doped groove injection method
03/21/2012CN102386074A Method for blocking piece treatment in polycrystalline silicon doping process
03/21/2012CN102386073A Method for preparing InAsSb quantum dots
03/21/2012CN102386072A Method for forming microcrystalline semiconductor film and method for manufacturing semiconductor device
03/21/2012CN102386071A Electronic device, manufacturing method of electronic device, and sputtering target
03/21/2012CN102386070A Method of forming polycrystalline silicon layer, method of manufacturing thin film transistor and organic light-emitting display device
03/21/2012CN102386069A Method of forming polycrystalline silicon layer, thin film transistor, and organic light emitting device
03/21/2012CN102386068A Growing method of silicon germanium substrate and silicon germanium substrate
03/21/2012CN102386067A Epitaxial growth method for effectively restraining self-doping effect
03/21/2012CN102386066A Liquid processing apparatus, liquid processing method and storage medium
03/21/2012CN102386065A Method of improving photoetching critical dimension uniformity
03/21/2012CN102386064A Manufacturing method of metal-oxide-metal capacitor
03/21/2012CN102386063A Substrate cooling apparatus
03/21/2012CN102386062A Wafer-cleaning control device and wafer-cleaning control method
03/21/2012CN102386061A Method for forming semiconductor device
03/21/2012CN102386060A Method for cleaning multilayer metal interconnection structure
03/21/2012CN102386059A Method for forming small-spacing pattern
03/21/2012CN102386058A Method for forming monocrystalline silicon layer
03/21/2012CN102386057A Method for lowering phosphorus concentration on semiconductor substrate surface
03/21/2012CN102386056A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
03/21/2012CN102386055A Chemical de-packaging method of plastic-packaged electronic component by using copper wire as connecting wire and preparation method of corrosive liquid used in chemical de-packaging method
03/21/2012CN102386054A Film for semiconductor device, and semiconductor device
03/21/2012CN102386053A Substrate processing apparatus and method of manufacturing semiconductor device
03/21/2012CN102386052A Supercritical drying method and supercritical drying system
03/21/2012CN102386051A Slice absorbing platform device
03/21/2012CN102385646A Correction method for device mismatch of MOS (Metal Oxide Semiconductor) transistors
03/21/2012CN102385262A Development method of photoetching process
03/21/2012CN102385249A Photoresist composition, and preparation method and application thereof
03/21/2012CN102385241A Photomask blank and photomask making method
03/21/2012CN102385207A Thin film transistor array substrate and making method thereof
03/21/2012CN102385200A Array substrate, fabrication method thereof and liquid crystal display panel
03/21/2012CN102385199A Liquid crystal display panel and production method thereof
03/21/2012CN102384865A Method for producing semiconductor samples
03/21/2012CN102383193A Free-standing (Al, Ga, In)N and parting method for forming same
03/21/2012CN102383112A Thermal processing apparatus
03/21/2012CN102383098A Method for forming metal compound film
03/21/2012CN102382613A Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
03/21/2012CN102382591A Temporary fixing sheet for manufacturing process of electronic parts
03/21/2012CN102382586A Film for flip chip type semiconductor back surface
03/21/2012CN102382584A Slice for forming semiconductor chip protective film
03/21/2012CN102382583A Adhesive sheet for protecting semiconductor wafer
03/21/2012CN102382582A Adhesive sheet for protecting semiconductor wafer
03/21/2012CN102381718A Passivant and method adopting passivant to realize surface pretreatment for germanium-base devices
03/21/2012CN102381681A Micromechanical structure and integrated circuit monolithic integrated processing method
03/21/2012CN102380937A Method and system for cooling resin seal substrate, system for conveying substrate and resin seal system
03/21/2012CN102380818A Chemical mechanical grinding method and chemical mechanical grinding equipment
03/21/2012CN102380817A Method for preventing low yield of wafer edge device
03/21/2012CN102380816A Chemically mechanical polishing method and system
03/21/2012CN102380815A Chemical mechanical grinding method and chemical mechanical grinding system
03/21/2012CN102380814A Chemical mechanical grinding method and chemical mechanical grinding device
03/21/2012CN102157361B Method for preparing semiconductor T-shaped gate electrode by utilizing photon beam super-diffraction technology
03/21/2012CN102157353B Method for preparing diamond substrate for high-heat-conductivity integrated circuit
03/21/2012CN102034706B Method for controlling growth effect of facet of silicon-germanium (Si-Ge) alloy
03/21/2012CN101989586B Metal terminal and construction method thereof
03/21/2012CN101963731B Reflection type drawing prime group substrate and manufacture method thereof
03/21/2012CN101958232B FTIR spectrum monitoring based internal state maintenance method of plasma etcher
03/21/2012CN101930963B Segment difference type ceramic copper-clad plate unit and manufacturing method thereof
03/21/2012CN101924018B Method for improving corner at top of groove into rounded corner
03/21/2012CN101908521B Semiconductor device and method of manufacturing the same
03/21/2012CN101901771B Technology for combining external lead wire with ceramic base of ceramic small outline shell
03/21/2012CN101894923B Packaging method of organic luminous semiconductor device
03/21/2012CN101877311B Method for effectively adjusting work function of TiN metal gate
03/21/2012CN101866900B Copper bonding wire, bonding wire joint structure and bonding wire processing and jointing method
03/21/2012CN101866895B 芯片结构及其形成方法 Chip structure and method of forming
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