Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2012
03/29/2012US20120073755 Electrode and plasma processing apparatus
03/29/2012US20120073754 Plasma confinement ring assembly for plasma processing chambers
03/29/2012US20120073751 Manufacturing method of semiconductor device, and semiconductor device
03/29/2012US20120073672 System for and method of fast pulse gas delivery
03/29/2012US20120073500 Semiconductor device manufacturing method and substrate processing apparatus
03/29/2012US20120073128 Apparatus for assembling chip devices on wires
03/29/2012DE10228290B4 Halbleitervorrichtungssockel Semiconductor device socket
03/29/2012DE10218155B4 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
03/29/2012DE102011115152A1 Polierkissen zum chemisch-mechanischen Polieren mit Licht-stabilem, polymeren Endpunkt-Nachweis-Fenster und Verfahren zum Polieren damit. A polishing pad for chemical mechanical polishing with light-stable polymeric endpoint detection window and method of polishing it.
03/29/2012DE102011082875A1 Dielektrischer Stapel Dielectric stack
03/29/2012DE102011082851A1 EEPROM-Zelle EEPROM cell
03/29/2012DE102011082803A1 EEPROM-Zelle EEPROM cell
03/29/2012DE102011081460A1 Verfahren zum bilden einer durchkontaktierung in einem halbleiterelement und halbleiterelement, das dieselbe aufweist A method of forming a via in a semiconductor element and semiconductor element, the same has
03/29/2012DE102011053955A1 Verfahren und System zum Verbessern der Zuverlässigkeit einer Halbleitervorrichtung A method and system for improving the reliability of a semiconductor device
03/29/2012DE102011053259A1 Halbleiterstruktur und verfahren zu deren herstellung Semiconductor structure and process for their preparation
03/29/2012DE102011053161A1 Verfahren und system zum führen von elektrischen verbindungen von halbleiterchips Method and system to perform electrical connections of semiconductor chips
03/29/2012DE102011053110A1 Verfahren zum Herstellen eines Halbleiterbauelements A method of manufacturing a semiconductor device
03/29/2012DE102011053107A1 Halbleiterstruktur und Verfahren zu deren Herstellung Semiconductor structure and process for their preparation
03/29/2012DE102011004863A1 Semiconductor device e.g. insulated gate bipolar transistor (IGBT), has p-type insulating layer having cleavage which has border between bottom and side wall of concave portion
03/29/2012DE102010047841A1 Manufacture of semiconductor layer e.g. passivation film for solar cell, involves separating silicon layer, silicon oxide layer, silicon carbide layer or silicon germanium layer from substrate, and performing microwave treatment
03/29/2012DE102010047051A1 Verfahren zur Bestimmung der Position einer Struktur innerhalb eines Bildes und Positionsmessvorrichtung zur Durchführung des Verfahrens Method for determining the position of a structure within an image and the position measuring device for carrying out the method
03/29/2012DE102010046966A1 Baustein, Verfahren zur Herstellung eines Bausteins und Vorrichtung zur Laser-Ablation Module, process for manufacturing a device and apparatus for laser ablating
03/29/2012DE102010042567B3 Verfahren zum Herstellen eines Chip-Package und Chip-Package A method of manufacturing a chip package and chip package
03/29/2012DE102010041576A1 Verfahren zum Verbinden von Körpern und Verbundkörper A method of joining bodies and composite
03/29/2012DE102010028464B4 Reduzierter STI-Verlust für bessere Oberflächenebenheit eingebetteter Verspannungsmaterialien in dicht gepackten Halbleiterbauelementen Reduced STI loss for better surface flatness embedded bracing materials in densely packed semiconductor devices
03/29/2012DE102009055368A1 Siliziumbasiertes Halbleiterbauelement mit E-Sicherungen, die durch eine eingebettete Halbleiterlegierung hergestellt sind Silicon-based semiconductor device with E-fuses that are made by an embedded semiconductor alloy
03/29/2012DE102009039419B4 Verfahren zum Bearbeiten eines Gateelektrodenmaterialsystems unter Bewahrung der Integrität eines Gatestapels mit großem ε durch Passivierung mittels eines Sauerstoffplasmas und Transistorbauelement A method for processing a gate electrode material system while preserving the integrity of a gate stack with large ε by passivation by means of an oxygen plasma and transistor device
03/29/2012DE102009023298B4 Verformungserhöhung in Transistoren mit einer eingebetteten verformungsinduzierenden Halbleiterlegierung durch Erzeugen von Strukturierungsungleichmäßigkeiten an der Unterseite der Gateelektrode Deformation increase in transistors using an embedded strain-inducing semiconductor alloy by generating Strukturierungsungleichmäßigkeiten at the bottom of the gate electrode
03/29/2012DE102009015718B4 Testsystem und Verfahren zum Verringern der Schäden in Saatschichten in Metallisierungssystemen von Halbleiterbauelementen Test system and method for reducing the damage to seed layers in metallization of semiconductor components
03/29/2012DE102007041926B4 Verfahren zur elektrischen Isolierung beziehungsweise elektrischen Kontaktierung von ungehäusten elektronischen Bauelementen bei strukturierter Verkapselung Method for electrical insulation or electrical contact of bare electronic components in a structured encapsulation
03/29/2012DE102007035832B4 Verfahren zur Herstellung eines SOI-Halbleiterbauelements und Halbleiterbauelement mit Grabenkondensator A process for producing an SOI semiconductor device and semiconductor device having capacitor grave
03/29/2012DE102007024844B4 Speicherzellenarray und elektronisches Gerät, welches das Speicherzellenarray umfasst Memory cell array and electronic device comprising the memory cell array
03/29/2012DE102006056624B4 Verfahren zur Herstellung einer selbstjustierten CuSiN-Deckschicht in einem Mikrostrukturbauelement A process for producing a self-aligned capping layer CuSiN in a microstructure device
03/29/2012DE102005045767B4 Verfahren zur Herstellung eines Halbleiterbauteils mit Kunststoffgehäusemasse A method for manufacturing a semiconductor device with plastic housing composition
03/29/2012DE102005020133B4 Verfahren zur Herstellung eines Transistorelements mit Technik zur Herstellung einer Kontaktisolationsschicht mit verbesserter Spannungsübertragungseffizienz A process for producing a transistor element with technology for the production of a contact insulation layer having improved stress transfer efficiency
03/29/2012DE102005019358B4 Laserstrahl-Bearbeitungsmaschine Laser beam processing machine
03/29/2012DE10196379B3 Mehrstrahl-Mustergenerator Multi-beam pattern generator
03/28/2012EP2434557A2 Photoelectric conversion element, solid-state imaging element, imaging apparatus, and method for manufacturing photoelectric conversion element
03/28/2012EP2434556A1 Ferromagnetic tunnel junction structure and magnetoresistive element using same
03/28/2012EP2434547A2 Gallium nitride based semiconductor devices and methods of manufacturing the same
03/28/2012EP2434540A1 Magnetic memory element and storage device using same
03/28/2012EP2434539A2 System and method of chip package build-up
03/28/2012EP2434538A1 Semiconductor switch device and method for manufacturing semiconductor switch device
03/28/2012EP2434537A2 Electrode pad on conductive semiconductor substrate
03/28/2012EP2434536A1 Fine-processing agent and fine-processing method
03/28/2012EP2434535A2 Non-volatile memory transistor with a self-aligned nitride storage layer
03/28/2012EP2434534A1 Semiconductor device and method of producing same
03/28/2012EP2434533A1 Bonding process by molecular bonding with reduced overlay type misalignment
03/28/2012EP2434532A1 Semiconductor devices and methods of manufacturing the same
03/28/2012EP2434531A2 Metal-insulator-metal capacitor and method for manufacturing thereof
03/28/2012EP2434530A2 Integrated resistor with titanium nitride and tantalum nitride resistance elements
03/28/2012EP2434529A1 Metal-insulator-metal capacitor for use in semiconductor devices and manufacuring method therfor
03/28/2012EP2434528A1 An active carrier for carrying a wafer and method for release
03/28/2012EP2434297A1 Structure having chip mounted thereon and module provided with the structure
03/28/2012EP2434034A1 Method for removing metallic catalysor remains from the surface of nanowires
03/28/2012EP2434004A1 Cleaning liquid and cleaning method
03/28/2012EP2433972A1 Polymer compound, photoresist composition containing such polymer compound, and method for forming resist pattern
03/28/2012EP2433312A2 Solar cell transport
03/28/2012EP2433301A2 Method and apparatus for providing through silicon via (tsv) redundancy
03/28/2012EP2433300A2 Integrated systems for interfacing with substrate container storage systems
03/28/2012EP2433299A2 Substrate container storage system
03/28/2012EP2433298A1 Methods and apparatus for aligning a set of patterns on a silicon substrate
03/28/2012EP2433297A1 Method for etching a material in the presence of solid particles
03/28/2012EP2433296A1 Semiconductor device contacts
03/28/2012EP2433178A1 Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the composition
03/28/2012EP2432620A1 Carrier for a silicon block and method for producing such a carrier and arrangement
03/28/2012EP2063434B1 X-ray condensing method and its device using phase restoration method
03/28/2012EP1941541B1 Redistribution layer for wafer-level chip scale package and method therefor
03/28/2012EP1825504B1 Vertical bipolar transistor
03/28/2012EP1739729B1 Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer
03/28/2012EP1721997B1 Method of manufacturing a Ni-Pt ALLOY.
03/28/2012EP1719012B1 Mems scanning system with improved performance
03/28/2012EP1624484B1 Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine
03/28/2012EP1588403B1 Low-gidl mosfet structure and method for fabrication
03/28/2012EP1579511B1 Method for roughening a surface of an opto-electronic semiconductor body.
03/28/2012EP1573824B1 Vertical insulated gate transistor and manufacturing method
03/28/2012EP1496368B1 Conductive contact
03/28/2012EP1482561B1 A process for producing an organic semiconductor structure
03/28/2012EP1297575B1 Power semiconductor component and method for producing the same
03/28/2012CN202178290U Led灯条全自动加工设备的传送料盘 Transfer trays Led light bar automatic processing equipment
03/28/2012CN202178286U 一种太阳能电池片观察架 A solar cell sheet observation aircraft
03/28/2012CN202178244U 晶体硅太阳电池制备用真空吸笔 Crystalline silicon solar cells prepared by vacuum suction pen
03/28/2012CN202178243U 用于晶圆交换装置的晶圆托架和晶圆交换装置 The wafer carrier and the wafer exchange means for the wafer exchange means
03/28/2012CN202178242U Substrate carrying device
03/28/2012CN202178241U 一种半导体封装切筋成型用切筋凹模 A semiconductor package cut tendons molding die cut tendons
03/28/2012CN202178240U 一种半导体组件压装装置 A semiconductor device assembly press fit
03/28/2012CN202178239U 蓄水冲洗架 Water wash rack
03/28/2012CN202178238U 硒蒸气快速结晶退火炉结构 Selenium vapor rapid crystallization annealing furnace structure
03/28/2012CN202174490U 研磨装置 Grinding device
03/28/2012CN1978167B System and method for scribing sapphire substrates with a solid state uv laser
03/28/2012CN1970673B Material for connecting circuit
03/28/2012CN1956171B Methods of forming non-volatile memory devices and devices formed thereby
03/28/2012CN1949082B Method and apparatus for immersion lithography
03/28/2012CN1847982B Coating compositions for use with an overcoated photoresist
03/28/2012CN1826691B Multi-power source voltage semiconductor device
03/28/2012CN1758986B Laser beam machining method
03/28/2012CN1744296B Method for forming isolation layer in semiconductor memory device
03/28/2012CN1736831B Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility
03/28/2012CN1717437B Sacrificial compositions, methods of use thereof, and methods of decomposition thereof
03/28/2012CN1609156B Composition for polishing semiconductor layers
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