Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2012
03/29/2012US20120075008 Graphene device and method of manufacturing the same
03/29/2012US20120074896 Semiconductor Device Die with Integrated MOSFET and Low Forward Voltage Diode-Connected Enhancement Mode JFET and Method
03/29/2012US20120074599 Method of forming wafer level mold using glass fiber and wafer structure formed by the same
03/29/2012US20120074594 Semiconductor device and manufacturing method thereof
03/29/2012US20120074593 Chip stacked structure and method of fabricating the same
03/29/2012US20120074592 Wafer-level packaging method using composite material as a base
03/29/2012US20120074591 Thin wafer support assembly
03/29/2012US20120074590 Multiple bonding in wafer level packaging
03/29/2012US20120074589 Corner structure for ic die
03/29/2012US20120074588 Integrated circuit packaging system with warpage control and method of manufacture thereof
03/29/2012US20120074587 Semiconductor Device and Method of Bonding Different Size Semiconductor Die at the Wafer Level
03/29/2012US20120074585 Semiconductor Device and Method of Forming TSV Interposer With Semiconductor Die and Build-Up Interconnect Structure on Opposing Surfaces of the Interposer
03/29/2012US20120074584 Multi-layer tsv insulation and methods of fabricating the same
03/29/2012US20120074583 Semiconductor structure having a through substrate via (tsv) and method for forming
03/29/2012US20120074582 Device with through-silicon via (tsv) and method of forming the same
03/29/2012US20120074581 Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same
03/29/2012US20120074580 Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby
03/29/2012US20120074579 Semiconductor chip with reinforcing through-silicon-vias
03/29/2012US20120074578 Semiconductor element, semiconductor element mounted board, and method of manufacturing semiconductor element
03/29/2012US20120074577 Semiconductor device, method for manufacturing of semiconductor device, and switching circuit
03/29/2012US20120074575 Copper line having self-assembled monolayer for ulsi semiconductor devices, and a method of forming same
03/29/2012US20120074574 Semiconductor structure and method for making same
03/29/2012US20120074573 Semiconductor structure and method for making same
03/29/2012US20120074572 Semiconductor structure and method for making same
03/29/2012US20120074571 Methods and architectures for bottomless interconnect vias
03/29/2012US20120074570 Method for Forming a Through Via in a Semiconductor Element and Semiconductor Element Comprising the Same
03/29/2012US20120074568 Method and system for minimizing carrier stress of a semiconductor device
03/29/2012US20120074565 Semiconductor device provided with rear protective film on other side of semiconductor substrate and manufacturing method of the same
03/29/2012US20120074564 Semiconductor device and manufacturing method of the same
03/29/2012US20120074562 Three-Dimensional Integrated Circuit Structure with Low-K Materials
03/29/2012US20120074561 Backmetal replacement for use in the packaging of integrated circuits
03/29/2012US20120074560 Integrated circuit packaging system with warpage control and method of manufacture thereof
03/29/2012US20120074557 Integrated Circuit Package Lid Configured For Package Coplanarity
03/29/2012US20120074556 Semiconductor power module and method of manufacturing the same
03/29/2012US20120074554 Bond ring for a first and second substrate
03/29/2012US20120074553 Method and system for improving reliability of a semiconductor device
03/29/2012US20120074552 Circuit device and method for manufacturing the same
03/29/2012US20120074550 Lead frame, semiconductor device, and method of manufacturing semiconductor device
03/29/2012US20120074548 Integrated circuit packaging system with interlock and method of manufacture thereof
03/29/2012US20120074547 Integrated circuit packaging system with lead encapsulation and method of manufacture thereof
03/29/2012US20120074546 Multi-chip Semiconductor Packages and Assembly Thereof
03/29/2012US20120074537 Dielectric stack
03/29/2012US20120074535 Low dielectric constant material
03/29/2012US20120074534 Semiconductor Device and Method of Forming Protective Structure Around Semiconductor Die for Localized Planarization of Insulating Layer
03/29/2012US20120074529 Semiconductor package with through electrodes and method for manufacturing the same
03/29/2012US20120074528 Technique to modify the microstructure of semiconducting materials
03/29/2012US20120074527 Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile element
03/29/2012US20120074526 Detachable substrate and processes for fabricating and detaching such a substrate
03/29/2012US20120074524 Lateral growth method for defect reduction of semipolar nitride films
03/29/2012US20120074522 Vertical zener diode structure and manufacturing method of the same
03/29/2012US20120074520 Electrical fuse structure and method of fabricating same
03/29/2012US20120074517 Semiconductor structure and method for making same
03/29/2012US20120074514 Etch-resistant coating on sensor wafers for in-situ measurement
03/29/2012US20120074509 Wafer bond cmut array with conductive vias
03/29/2012US20120074507 Integration of an amorphous silicon resistive switching device
03/29/2012US20120074503 Planar Silicide Semiconductor Structure
03/29/2012US20120074502 Use of contacts to create differential stresses on devices
03/29/2012US20120074501 Use of contacts to create differential stresses on devices
03/29/2012US20120074498 Method and apparatus for improving gate contact
03/29/2012US20120074496 Diode Having A Pocket Implant Blocked And Circuits And Methods Employing Same
03/29/2012US20120074493 Field effect transistors having improved breakdown voltages and methods of forming the same
03/29/2012US20120074492 Method of Fabricating A Semicoductor Device Having A Lateral Double Diffused Mosfet Transistor with a Lightly Doped Source and a CMOS Transistor
03/29/2012US20120074490 Semiconductor device and method of manufacturing the semiconductor device
03/29/2012US20120074488 Vertical transistor with hardening implatation
03/29/2012US20120074486 Multi-gate bandgap engineered memory
03/29/2012US20120074485 Nonvolatile Memory Device and Manufacturing Method Thereof
03/29/2012US20120074484 Semiconductor devices and methods of manufacturing semiconductor devices
03/29/2012US20120074483 Eeprom cell
03/29/2012US20120074482 Eeprom cell
03/29/2012US20120074481 Securities, chip mounting product, and manufacturing method thereof
03/29/2012US20120074478 Semiconductor device and manufacturing method thereof
03/29/2012US20120074475 Metal gate structure of a semiconductor device
03/29/2012US20120074471 Transistor Structure for Improved Static Control During Formation of the Transistor
03/29/2012US20120074469 Asymmetric wedge jfet, related method and design structure
03/29/2012US20120074466 3d memory array with vertical transistor
03/29/2012US20120074464 Non-planar device having uniaxially strained semiconductor body and method of making same
03/29/2012US20120074463 Semiconductor wafer, photoelectric conversion device, method of producing semiconductor wafer, and method of producing photoelectric conversion device
03/29/2012US20120074461 Semiconductor device and method for manufacturing same
03/29/2012US20120074460 Semiconductor device and method for manufacturing the same
03/29/2012US20120074438 Method for manufacturing light emitting device, light emitting device, light emitting element substrate, and quality management method
03/29/2012US20120074429 Growth of non-polar m-plane iii-nitride film using metalorganic chemical vapor deposition (mocvd)
03/29/2012US20120074425 Growth of reduced dislocation density non-polar gallium nitride
03/29/2012US20120074423 El display panel, el display apparatus, and method of manufacturing el display panel
03/29/2012US20120074422 Thin-film transistor array device, el display panel, el display device, thin-film transistor array device manufacturing method, el display panel manufacturing method
03/29/2012US20120074421 Thin-film transistor array device, el display panel, el display device, thin-film transistor array device manufacturing method, el display panel manufacturing method
03/29/2012US20120074417 Method of Bonding Wafers
03/29/2012US20120074408 Organic light emitting display device and method of manufacturing the same
03/29/2012US20120074407 Semiconductor device and method for manufacturing the same
03/29/2012US20120074405 Process for the Simultaneous Deposition of Crystalline and Amorphous Layers with Doping
03/29/2012US20120074404 Supporting substrate, bonded substrate, method for manufacturing supporting substrate, and method for manufacturing bonded substrate
03/29/2012US20120074401 Test pattern for detecting piping in a memory array
03/29/2012US20120074387 Microelectronic transistor having an epitaxial graphene channel layer
03/29/2012US20120074386 Non-planar quantum well device having interfacial layer and method of forming same
03/29/2012US20120074385 Semiconductor Devices And Methods of Manufacturing The Same
03/29/2012US20120074374 Conductive path in switching material in a resistive random access memory device and control
03/29/2012US20120074372 Memristors with an electrode metal reservoir for dopants
03/29/2012US20120074368 Semiconductor memory device and manufacturing method thereof
03/29/2012US20120074367 Counter doping compensation methods to improve diode performance
03/29/2012US20120074301 Method and apparatus for device with minimized optical cross-talk
03/29/2012US20120074102 Substrate processing apparatus and substrate processing method
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