Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2012
03/15/2012US20120064695 Dicing a semiconductor wafer
03/15/2012US20120064694 Forming implanted plates for high aspect ratio trenches using staged sacrificial layer removal
03/15/2012US20120064692 Methods of manufacturing a memory device having a carbon nanotube
03/15/2012US20120064690 Method for manufacturing semiconductor device
03/15/2012US20120064689 Method for manufacturing semiconductor device
03/15/2012US20120064688 Method for manufacturing silicon-germanium heterojunction bipolar transistor
03/15/2012US20120064687 Method of manufacturing semiconductor device
03/15/2012US20120064686 Lateral Uniformity in Silicon Recess Etch
03/15/2012US20120064685 Methods of making random access memory devices, transistors, and memory cells
03/15/2012US20120064684 Method for manufacturing a super-junction trench mosfet with resurf stepped oxides and trenched contacts
03/15/2012US20120064683 Nonvolatile semiconductor memory device and method for manufacturing same
03/15/2012US20120064682 Methods of Manufacturing Three-Dimensional Semiconductor Memory Devices
03/15/2012US20120064681 Semiconductor Memory Device And Method Of Forming The Same
03/15/2012US20120064680 Methods of forming a capacitor structure and methods of manufacturing semiconductor devices using the same
03/15/2012US20120064679 Metal gate transistor and method for fabricating the same
03/15/2012US20120064678 Manufacturing method of thin film transistor array panel
03/15/2012US20120064677 Method for manufacturing semiconductor device
03/15/2012US20120064676 Method of fabricating thin film transistor
03/15/2012US20120064675 Method of forming a multi-channel esd device
03/15/2012US20120064674 Methods of forming semiconductor structures including a movable switching element
03/15/2012US20120064673 Method for fabricating a semiconductor chip panel
03/15/2012US20120064672 Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding
03/15/2012US20120064671 Method for producing chip elements equipped with wire insertion grooves
03/15/2012US20120064670 Apparatus for restricting moisture ingress
03/15/2012US20120064669 Manufacturing method of semiconductor device
03/15/2012US20120064668 Method of manufacture of integrated circuit packaging system with stacked integrated circuit
03/15/2012US20120064667 Semiconductor die package including multiple dies and a common node structure
03/15/2012US20120064666 Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package
03/15/2012US20120064665 Deposition apparatus, apparatus for successive deposition, and method for manufacturing semiconductor device
03/15/2012US20120064664 Method for manufacturing semiconductor device
03/15/2012US20120064663 Device and method for depositing organic material
03/15/2012US20120064656 Method for fabricating thermo-electric generator
03/15/2012US20120064655 Optical device and method of making
03/15/2012US20120064653 Nitride semiconductor device and method for growing nitride semiconductor crystal layer
03/15/2012US20120064650 Manufacturing method of thin film transistor and liquid crystal display device
03/15/2012US20120064647 Method of fabricating microelectromechanical systems devices
03/15/2012US20120064646 Method of manufacturing semiconductor integrated circuit device
03/15/2012US20120064645 Manufacturing method of semiconductor device
03/15/2012US20120064644 Fluid Ejection Device and Method
03/15/2012US20120064643 Methods and System for On-Chip Decoder for Array Test
03/15/2012US20120064642 Method to remove sapphire substrate
03/15/2012US20120064438 Photomask blank and making method, photomask, light pattern exposure method, and design method of transition metal/silicon base material film
03/15/2012US20120063874 Low profile dual arm vacuum robot
03/15/2012US20120063869 Load port apparatus
03/15/2012US20120063281 Semiconductor laser device, optical pickup apparatus, and method of manufacturing semiconductor laser device
03/15/2012US20120063256 Memory device word line drivers and methods
03/15/2012US20120063248 Low cost comparator design for memory bist
03/15/2012US20120063233 EEPROM-based, data-oriented combo NVM design
03/15/2012US20120063213 Semiconductor storage device and method of fabricating the same
03/15/2012US20120063212 Semiconductor device and method of manufacturing the same
03/15/2012US20120063201 Nonvolatile memory element, production method therefor, design support method therefor, and nonvolatile memory device
03/15/2012US20120063198 Methods Of Forming Memory Cells And Methods Of Forming Programmed Memory Cells
03/15/2012US20120063109 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
03/15/2012US20120063096 Semiconductor package with integrated substrate thermal slug
03/15/2012US20120063090 Cooling mechanism for stacked die package and method of manufacturing the same
03/15/2012US20120062974 Apparatus and methods for wide temperature range operation of micrometer-scale silicon electro-optic modulators
03/15/2012US20120062809 Semiconductor device and method of fabricating the same
03/15/2012US20120062439 Semiconductor package integrated with conformal shield and antenna
03/15/2012US20120062308 Power switch design and method for reducing leakage power in low-power integrated circuits
03/15/2012US20120062266 Scan or jtag controllable capture clock generation
03/15/2012US20120061880 Molding apparatus and molding method for packaging semiconductor
03/15/2012US20120061860 Method for Constructing an Electrical Circuit, and Electrical Circuit
03/15/2012US20120061859 Integrated circuit packaging system with encapsulant containment and method of manufacture thereof
03/15/2012US20120061858 Semiconductor Device and Method of Forming Mold Underfill Using Dispensing Needle Having Same Width as Semiconductor Die
03/15/2012US20120061857 Electronic Packaging With A Variable Thickness Mold Cap
03/15/2012US20120061856 Apparatus and Methods for High-Density Chip Connectivity
03/15/2012US20120061855 Integrated circuit packaging system with film encapsulation and method of manufacture thereof
03/15/2012US20120061854 Integrated circuit packaging system with package-on-package and method of manufacture thereof
03/15/2012US20120061853 Semiconductor chip device with underfill
03/15/2012US20120061852 Semiconductor chip device with polymeric filler trench
03/15/2012US20120061851 Simulated wirebond semiconductor package
03/15/2012US20120061850 Semiconductor device and method of manufacturing the same
03/15/2012US20120061848 Chip assembly with a coreless substrate employing a patterned adhesive layer
03/15/2012US20120061846 Compliant printed circuit area array semiconductor device package
03/15/2012US20120061845 Methods for filling a contact hole in a chip package arrangement and chip package arrangements
03/15/2012US20120061844 Copper alloy for wiring, semiconductor device, method for forming wiring, and method for manufacturing semiconductor device
03/15/2012US20120061843 Semiconductor package and method for manufacturing the same
03/15/2012US20120061842 Stack package and method for manufacturing the same
03/15/2012US20120061838 Barrier layer formation for metal interconnects through enhanced impurity diffusion
03/15/2012US20120061837 Method of manufacturing semiconductor device and semiconductor device
03/15/2012US20120061835 Die structure, die arrangement and method of processing a die
03/15/2012US20120061834 Semiconductor chip, stacked chip semiconductor package including the same, and fabricating method thereof
03/15/2012US20120061833 Embedded ball grid array substrate and manufacturing method thereof
03/15/2012US20120061831 Semiconductor package and method for making the same
03/15/2012US20120061829 Method for manufacturing substrate for semiconductor element, and semiconductor device
03/15/2012US20120061828 Semiconductor device and layout method of semiconductor device
03/15/2012US20120061825 Chip scale package and method of fabricating the same
03/15/2012US20120061824 Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in fo-wlcsp
03/15/2012US20120061823 Semiconductor device having pad structure with stress buffer layer
03/15/2012US20120061822 Semiconductor Device and Method of Forming Base Substrate With Cavities Formed Through Etch-Resistant Conductive Layer for Bump Locking
03/15/2012US20120061821 Semiconductor chip with redundant thru-silicon-vias
03/15/2012US20120061819 Semiconductor Module and Method for Production Thereof
03/15/2012US20120061815 Power semiconductor module having sintered metal connections, preferably sintered silver connections, and production method
03/15/2012US20120061814 Semiconductor Device and Method of Forming Leadframe Interposer Over Semiconductor Die and TSV Substrate for Vertical Electrical Interconnect
03/15/2012US20120061813 Package Structure for DC-DC Converter
03/15/2012US20120061812 Power Semiconductor Chip Package
03/15/2012US20120061811 Apparatus and method configured to lower thermal stresses
03/15/2012US20120061808 Semiconductor packages having increased input/output capacity and related methods
03/15/2012US20120061806 Systems and methods for drying a rotating substrate
03/15/2012US20120061805 Dicing die bond film
1 ... 1086 1087 1088 1089 1090 1091 1092 1093 1094 1095 1096 1097 1098 1099 1100 1101 1102 1103 1104 1105 1106 ... 6590