Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2012
03/22/2012US20120070996 Polar regions for electrostatic de-chucking with lift pins
03/22/2012US20120070995 Metal gate transistor and method for fabricating the same
03/22/2012US20120070994 Resist underlayer film forming composition containing silicon having sulfide bond
03/22/2012US20120070993 Passivation of integrated circuits containing ferroelectric capacitors and hydrogen barriers
03/22/2012US20120070992 Method of stripping hot melt etch resists from semiconductors
03/22/2012US20120070991 Chemical mechanical polishing of silicon carbide comprising surfaces
03/22/2012US20120070990 Slurry Composition Having Tunable Dielectric Polishing Selectivity And Method Of Polishing A Substrate
03/22/2012US20120070989 Stabilized, Concentratable Chemical Mechanical Polishing Composition And Method Of Polishing A Substrate
03/22/2012US20120070988 Methods and apparatuses facilitating fluid flow into via holes, vents, and other openings communicating with surfaces of substrates of semiconductor device components
03/22/2012US20120070987 Semiconductor device having decreased contact resistance
03/22/2012US20120070986 Semiconductor device having insulating film with surface modification layer and method for manufacturing the same
03/22/2012US20120070985 Exposure method and method for manufacturing semiconductor device
03/22/2012US20120070984 Method for forming electrode structure
03/22/2012US20120070983 Semiconductor device with gate trench
03/22/2012US20120070982 Methods for forming layers on a substrate
03/22/2012US20120070981 Atomic layer deposition of a copper-containing seed layer
03/22/2012US20120070980 Multi material secondary metallization scheme in mems fabrication
03/22/2012US20120070979 Method of electrolytic plating and semiconductor device fabrication
03/22/2012US20120070978 Semiconductor device manufacturing method
03/22/2012US20120070977 Methods For Forming Contacts in Semiconductor Devices
03/22/2012US20120070976 Methods of manufacturing semiconductor devices
03/22/2012US20120070975 Methods of Forming Gate Structure and Methods of Manufacturing Semiconductor Device Including the Same
03/22/2012US20120070974 Manufacture method for semiconductor device
03/22/2012US20120070973 Methods of Forming Diodes
03/22/2012US20120070972 Non-uniformity reduction in semiconductor planarization
03/22/2012US20120070971 Method for fabricating semiconductor devices using stress engineering
03/22/2012US20120070970 Method for manufacturing a semiconductor device
03/22/2012US20120070969 Semiconductor device and method for manufacturing the same
03/22/2012US20120070968 Substrate processing method and method of manufacturing crystalline silicon carbide (sic) substrate
03/22/2012US20120070967 Method for Forming Gallium Nitride Devices with Conductive Regions
03/22/2012US20120070966 Method for manufacturing semiconductor element
03/22/2012US20120070965 Semiconductor device and manufacturing method for the same
03/22/2012US20120070964 Method for eliminating the metal catalyst residues on the surface of wires produced by catalytic growth
03/22/2012US20120070963 Plasma deposition
03/22/2012US20120070962 Freestanding III-Nitride Single-Crystal Substrate and Method of Manufacturing Semiconductor Device Utilizing the Substrate
03/22/2012US20120070961 Low temperature etchant for treatment of silicon-containing surfaces
03/22/2012US20120070960 Dicing die bond film, method of manufacturing dicing die bond film, and method of manufacturing semiconductor device
03/22/2012US20120070959 Microelectronic device wafers and methods of manufacturing
03/22/2012US20120070958 Method of manufacturing semiconductor device
03/22/2012US20120070957 Air gap formation
03/22/2012US20120070956 Method for Manufacturing Memory Element
03/22/2012US20120070955 Methods of Forming Conductive Contacts to Source/Drain Regions and Methods of Forming Local Interconnects
03/22/2012US20120070954 Methods of forming integrated circuits
03/22/2012US20120070953 Method of forming integrated circuits
03/22/2012US20120070952 Removing method of a hard mask
03/22/2012US20120070951 Semiconductor device and fabrication method therefor
03/22/2012US20120070950 Method of Manufacturing a Semiconductor Device
03/22/2012US20120070949 Semiconductor device and method of fabricating semiconductor device
03/22/2012US20120070948 Adjusting method of channel stress
03/22/2012US20120070947 Inducing stress in fin-fet device
03/22/2012US20120070946 Method for fabricating a thin film transistor substrate
03/22/2012US20120070945 Organic semiconductor device, manufacturing method of same, organic transistor array, and display
03/22/2012US20120070944 Methods of Manufacturing Three Dimensional Semiconductor Devices
03/22/2012US20120070943 Chip packaging method and structure thereof
03/22/2012US20120070942 Process for forming thin film encapsulation layers
03/22/2012US20120070941 Module with silicon-based layer
03/22/2012US20120070940 Fixture to constrain laminate and method of assembly
03/22/2012US20120070939 Stacked die assemblies including tsv die
03/22/2012US20120070937 Method for Producing Compound Semiconductor, Method for Manufacturing Photoelectric Conversion Device, and Solution for Forming Semiconductor
03/22/2012US20120070936 Annealing thin films
03/22/2012US20120070931 Methods for reduced stress anchors
03/22/2012US20120070930 Method and apparatus to fabricate polymer arrays on patterned wafers using electrochemical synthesis
03/22/2012US20120070929 Method for fabricating wafer product and method for fabricating gallium nitride based semiconductor optical device
03/22/2012US20120070919 Semiconductor device, method of manufacturing thereof, and method of manufacturing base material
03/22/2012US20120070918 Method of manufacturing semiconductor device
03/22/2012US20120070917 Apparatus and method for mounting semiconductor light emitting element
03/22/2012US20120070916 Movable injectors in rotating disc gas reactors
03/22/2012US20120070915 Method for copper hillock reduction
03/22/2012US20120070914 Temperature control module using gas pressure to control thermal conductance between liquid coolant and component body
03/22/2012US20120070913 Method of manufacturing a semiconductor device and substrate processing apparatus
03/22/2012US20120070767 Set of masks, method of generating mask data and method for forming a pattern
03/22/2012US20120069669 Nonvolatile semiconductor storage device and method of controlling and manufacturing the same
03/22/2012US20120069651 EEPROM-based, data-oriented combo NVM design
03/22/2012US20120069632 Current control, memory element, memory device, and production method for current control element
03/22/2012US20120069624 Reactive metal implated oxide based memory
03/22/2012US20120069543 Led illuminator module with high heat-dissipating efficiency and manufacturing method therefor
03/22/2012US20120069530 Semiconductor device and method of manufacturing the same
03/22/2012US20120069329 Surface inspection apparatus and method thereof
03/22/2012US20120069286 Array substrate and manufacturing method thereof, and liquid crystal display
03/22/2012US20120068691 di/dt Current Sensing
03/22/2012US20120068689 Eeprom cell with charge loss
03/22/2012US20120068681 Integrated Circuit Package With Reduced Parasitic Loop Inductance
03/22/2012US20120068622 Flexible Distributed LED-Based Light Source and Method for Making the Same
03/22/2012US20120068365 Metal can impedance control structure
03/22/2012US20120068364 Device and Method for Manufacturing a Device
03/22/2012US20120068363 Integrated circuit packaging system with die paddles and method of manufacture thereof
03/22/2012US20120068362 Semiconductor device having semiconductor member and mounting member
03/22/2012US20120068361 Stacked multi-die packages with impedance control
03/22/2012US20120068359 Semiconductor device and method for manufacturing semiconductor device
03/22/2012US20120068358 Semiconductor package and method for making the same
03/22/2012US20120068356 Component having a VIA
03/22/2012US20120068355 Semiconductor device and method for manufacturing the same
03/22/2012US20120068354 Semiconductor memory device and method for manufacturing the same
03/22/2012US20120068353 Semiconductor Device and Method of Forming Dam Material With Openings Around Semiconductor Die for Mold Underfill Using Dispenser and Vacuum Assist
03/22/2012US20120068352 Stacked chip assembly having vertical vias
03/22/2012US20120068351 Chip assembly having via interconnects joined by plating
03/22/2012US20120068347 Method for processing semiconductor structure and device based on the same
03/22/2012US20120068346 Structure for nano-scale metallization and method for fabricating same
03/22/2012US20120068344 Interconnect structure with a planar interface between a selective conductive cap and a dielectric cap layer
03/22/2012US20120068343 Semiconductor device and method for manufacturing the same
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