Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2012
03/22/2012US20120067628 Printed wiring board
03/22/2012US20120067524 Apparatus for manufacturing semiconductor devices
03/22/2012US20120067521 Vacuum processing system
03/22/2012US20120067283 Systems and Methods for Forming Metal Oxide Layers
03/22/2012DE112008000974B4 Durch Verformung verbesserte Halbleiterbauelemente und Verfahren zu deren Herstellung By deformation of improved semiconductor devices and processes for their preparation
03/22/2012DE10253900B4 Bildung von Gate-Elektroden mit dualer Austrittsarbeit Formation of gate electrodes with dual work function
03/22/2012DE102011113781A1 Vorrichtung und Verfahren zur Herstellung einer Vorrichtung Apparatus and method for manufacturing a device
03/22/2012DE102011083038A1 Transistor und Verfahren zum Herstellen eines Transistors Transistor and method of manufacturing a transistor
03/22/2012DE102011082715A1 Die package used for a semiconductor device comprises a leadframe containing a die attach pad, a conductive layer on a portion of the die attach pad, a boundary feature comprising a bond wire, and a die on the conductive layer
03/22/2012DE102011004238A1 Dichtringstruktur mit Metallpad Sealing ring structure with metal pad
03/22/2012DE102010046215A1 Semiconductor structure for electronic component, has strained monocrystalline region formed between monocrystalline regions made of semiconductor materials having different lattice constants along the reference direction
03/22/2012DE102010046214A1 Wafer test structure has interface that is connected to integrated test circuit, for receiving and outputting test data
03/22/2012DE102010046050A1 Verfahren und Justagevorrichtung zum Ausrichten von Kontaktstiften eines elektrischen Bauteils sowie elektrisches Bauteil A method and adjusting device for aligning contact pins of an electrical component, as well as electrical component
03/22/2012DE102010045783A1 Trägersubstrat für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement A carrier substrate for an optoelectronic component, to processes for its preparation and optoelectronic component
03/22/2012DE102010041129A1 Multifunktionssensor als PoP-mWLP Multifunction sensor as PoP mWLP
03/22/2012DE102010041101A1 Bauelement mit einer Durchkontaktierung Component with a via
03/22/2012DE102010040869A1 Vorrichtung zum Ätzen von Halbleiter-Wafern mit einer Inline-Prozesskontrolle Apparatus for etching semiconductor wafers with an in-line process control
03/22/2012DE102010040061B4 Erhöhte Ladungsträgerbeweglichkeit in p-Kanal Transistoren durch Vorsehen eines verspannungsinduzierenden schwellwerteinstellenden Halbleitermaterials im Kanal Increased charge carrier mobility in p-channel transistors by providing a stress-inducing schwellwerteinstellenden semiconductor material in the channel
03/22/2012DE102007051318B4 Herstellungsverfahren für einen Radarsensor Preparation method for a radar sensor
03/22/2012DE102007049810B4 Simultanes Doppelseitenschleifen von Halbleiterscheiben Simultaneous double side grinding of semiconductor wafers
03/22/2012DE102007001108B4 Diode und Verfahren zu ihrer Herstellung Diode and methods for their preparation
03/22/2012DE102006058493B4 Verfahren und Vorrichtung zum Bonden von Wafern Method and apparatus for bonding wafers
03/22/2012DE10029032B4 Schleif- und Ätzanlage für plattenartige Objekte Grinding and etching equipment for plate-like objects
03/22/2012CA2781665A1 Method for manufacturing semiconductor device
03/21/2012EP2432084A1 Nitride semiconductor light emitting element and epitaxial substrate
03/21/2012EP2432083A1 Group iii nitride semiconductor laser diode, and method for producing group iii nitride semiconductor laser diode
03/21/2012EP2432023A1 Trench gate semiconductor device
03/21/2012EP2432022A1 Insulating gate type bipolar transistor
03/21/2012EP2432020A1 Semiconductor device
03/21/2012EP2432011A1 Device for treating and/or processing substrates
03/21/2012EP2432010A1 Manufacturing method of semiconductor device
03/21/2012EP2432009A1 Purging apparatus and purging method
03/21/2012EP2432008A1 Replaceable substrate masking on carrier and method for processing a substrate
03/21/2012EP2432007A2 Apparatus for manufacturing semiconductor devices
03/21/2012EP2432006A1 Semiconductor chip and structure for mounting same
03/21/2012EP2432005A1 Epitaxial substrate for electronic device and process for producing same
03/21/2012EP2432004A1 Semiconductor device
03/21/2012EP2432003A2 Silicon Carbide Semiconductor Device
03/21/2012EP2432002A1 Silicon carbide substrate and semiconductor device
03/21/2012EP2432001A1 Method for producing semiconductor substrate
03/21/2012EP2432000A1 Silicon carbide substrate, semiconductor device, and method for manufacturing silicon carbide substrate
03/21/2012EP2431986A1 Dielectric-thin-film forming composition, method of forming dielectric thin film, and dielectric thin film formed by the method
03/21/2012EP2431504A1 Method for manufacturing an organic thin fim transistor using a nano-crystalline diamond film
03/21/2012EP2431503A1 Method of manufacturing an organic electroluminescent device or an organic photoelectric receiving device using a nano-crystalline diamond film
03/21/2012EP2431494A1 Barrier film for semiconductor wiring, sintered sputtering target, and method of manufacturing sputtering targets
03/21/2012EP2431434A1 Polishing Composition for Noble Metals
03/21/2012EP2430656A1 System-in packages
03/21/2012EP2430654A2 Electrostatic chuck with polymer protrusions
03/21/2012EP2430653A1 Porous lift-off layer for selective removal of deposited films
03/21/2012EP2430652A1 Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
03/21/2012EP2430651A1 Diffused junction termination structures for silicon carbide devices and methods of fabricating silicon carbide devices incorporating same
03/21/2012EP2430650A1 Patterning a single integrated circuit layer using automatically-generated masks and multiple masking layers
03/21/2012EP2430649A1 Method and apparatus for controlled laser ablation of material
03/21/2012EP2430648A1 Photovolaic device
03/21/2012EP2430499A2 Composition for post chemical-mechanical polishing cleaning
03/21/2012EP2345070B1 High-yield method of exposing and contacting through-silicon vias
03/21/2012EP2308079B1 Method and device for producing photovoltaic modules
03/21/2012EP2158602B1 Transport pod interface
03/21/2012EP2140974B1 Synthetic grindstone
03/21/2012EP2050128B1 Raised sti structure and superdamascene technique for nmosfet performance enhancement with embedded silicon carbon
03/21/2012EP1997135B1 Method and device for electrostatically fixing substrates having a conductive layer
03/21/2012EP1984467B1 Barrier slurry compositions and barrier cmp methods
03/21/2012EP1939926B1 Bonding apparatus
03/21/2012EP1934015B1 Cmp of copper/ruthenium substrates
03/21/2012EP1891665B1 Method of etching nickel silicide and method of forming conductive lines
03/21/2012EP1784853B1 Structure formation
03/21/2012EP1779438B8 Iii-v hemt devices
03/21/2012EP1694467B1 Flexible formed sheets for treating surfaces
03/21/2012EP1667214B1 Method for cleaning a multilayer substrate and method for bonding substrates and method for producing bonded wafer
03/21/2012EP1625336B9 Use of a layer of solid fuel, method for producing such a layer and associated heating unit
03/21/2012EP1483628B1 Full phase shifting mask in damascene process
03/21/2012EP1376699B1 Production method for simox substrate and simox substrate
03/21/2012EP1364400B9 Method for producing thin layers on a specific support and an application thereof
03/21/2012EP1143045B1 Silicon single crystal wafer for epitaxial wafer, epitaxial wafer and methods for producing the same and evaluating the same
03/21/2012EP0942459B1 Method of growing nitride semiconductors
03/21/2012CN202172091U Oled玻璃面板多头吸拾笔 Oled glass panels long pick-up pen
03/21/2012CN202172085U 一种用于自动上料机插入硅片工序的石英舟 An automatic feeder insert wafer process quartz boat
03/21/2012CN202169426U 半导体元器件的焊接装置 Welding device semiconductor components
03/21/2012CN1991586B An optical metrology system and metrology mark characterization device
03/21/2012CN1988109B Process for producing a free-standing III-N layer, and free-standing III-N substrate
03/21/2012CN1955131B Glass-ceramics and a method for manufacturing the same
03/21/2012CN1954264B Positive photosensitive resin composition, and interlayer dielectrics and micro lenses made therefrom
03/21/2012CN1940729B Lithographic apparatus, device manufacturing method and device manufactured thereby
03/21/2012CN1909190B Gallium nitride device substrate containing a lattice parameter altering element
03/21/2012CN1855431B Semiconductor manufacturing method
03/21/2012CN1790671B Method for preparing semiconductor device
03/21/2012CN1681084B Method for creating a pattern in a material and semiconductor structure processed therewith
03/21/2012CN1664704B Lithographic apparatus and device manufacturing method
03/21/2012CN1612322B Fabrication method of semiconductor integrated circuit device
03/21/2012CN102388453A Robust ESD protection circuit, method and design structure for tolerant and failsafe designs
03/21/2012CN102388452A Integrated circuit device with stress reduction layer
03/21/2012CN102388451A Reduction of thickness variations of a threshold semiconductor alloy by reducing patterning non-uniformities prior to depositing the semiconductor alloy
03/21/2012CN102388450A Through substrate vias
03/21/2012CN102388449A Providing superior electromigration performance and reducing deterioration of sensitive low-k dielectrics in metallization systems of semiconductor devices
03/21/2012CN102388448A Formation of thin layers of semiconductor materials
03/21/2012CN102388447A Fabrication and structure of asymmetric field-effect transistors using l-shaped spacers
03/21/2012CN102388446A Carrier plate for forming external electrodes, and manufacturing method
03/21/2012CN102388445A Wafer transfer method and wafer transfer apparatus
03/21/2012CN102388444A Conveying system having endless drive medium and conveying method
03/21/2012CN102388443A Enhancement mode gallium nitride transistor with improved gate characteristics
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