Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2012
03/15/2012US20120061804 Systems and Methods for Enabling Esd Protection on 3-D Stacked Devices
03/15/2012US20120061803 Asymmetrical bidirectional protection component
03/15/2012US20120061798 High capacitance trench capacitor
03/15/2012US20120061797 Semiconductor device and method of fabricating the same
03/15/2012US20120061796 Programmable anti-fuse wire bond pads
03/15/2012US20120061795 Through-Substrate Via Waveguides
03/15/2012US20120061794 Methods of forming through wafer interconnects in semiconductor structures using sacrificial material, and semiconductor structures formed by such methods
03/15/2012US20120061778 Method and Apparatus for Producing Chip Devices, and Chip Device Produced by Means of the Method
03/15/2012US20120061777 Integrally fabricated micromachine and logic elements
03/15/2012US20120061776 Wafer level packaging
03/15/2012US20120061775 Device for use as dual-sided sensor package
03/15/2012US20120061773 Semiconductor device and method of fabricating the same
03/15/2012US20120061772 Transistor having replacement metal gate and process for fabricating the same
03/15/2012US20120061770 Nonvolatile Memory Device and Method of Manufacturing the Same
03/15/2012US20120061767 Semiconductor device and manufacturing method thereof
03/15/2012US20120061766 Semiconductor device and manufacturing method thereof
03/15/2012US20120061765 Anti-fuse based programmable serial number generator
03/15/2012US20120061763 Methods of forming non-volatile memory devices including low-k dielectric gaps in substrates and devices so formed
03/15/2012US20120061762 Asymmetric FinFET devices
03/15/2012US20120061761 Semiconductor integrated circuit device and manufacturing method for semiconductor integrated circuit devices
03/15/2012US20120061759 Extremely Thin Semiconductor-on-Insulator (ETSOI) FET Having a Stair-Shape Raised Source/Drain and a Method of Forming the Same
03/15/2012US20120061758 Semiconductor device and related manufacturing method
03/15/2012US20120061756 Semiconductor device and method for manufacturing the same
03/15/2012US20120061754 Super-junction trench mosfet with resurf stepped oxides and split gate electrodes
03/15/2012US20120061750 Semiconductor device and method for manufacturing the same
03/15/2012US20120061749 Power semiconductor device and method for manufacturing the same
03/15/2012US20120061748 Semiconductor device and method of manufacturing the same
03/15/2012US20120061743 Semiconductor memory device and method for manufacturing same
03/15/2012US20120061739 Method for fabricating capacitor and semiconductor device using the same
03/15/2012US20120061738 Gate Stack Structure, Semiconductor Device and Method for Manufacturing the Same
03/15/2012US20120061737 Semiconductor device, method of fabricating the same, and patterning mask utilizied by the method
03/15/2012US20120061736 Transistor and Method for Forming the Same
03/15/2012US20120061735 Semiconductor device with stress trench isolation and method for forming the same
03/15/2012US20120061734 Micro-Electromechanical System Devices
03/15/2012US20120061733 Methods and apparatus for detecting molecular interactions using fet arrays
03/15/2012US20120061732 Information recording/reproducing device
03/15/2012US20120061730 Semiconductor wafer, electronic device, a method of producing semiconductor wafer, and method of producing electronic device
03/15/2012US20120061729 Nitride semiconductor device and method for fabricating the same
03/15/2012US20120061728 Semiconductor on insulator (xoi) for high performance field effect transistors
03/15/2012US20120061727 Gallium nitride based semiconductor devices and methods of manufacturing the same
03/15/2012US20120061725 Power Semiconductor Package
03/15/2012US20120061721 Power semiconductor device and method of manufacturing the same
03/15/2012US20120061719 Shockley diode having a low turn-on voltage
03/15/2012US20120061690 Led module and packing method of the same
03/15/2012US20120061688 Power semiconductor device and method for manufacturing the power semiconductor device
03/15/2012US20120061686 Silicon carbide substrate, semiconductor device, and method of manufacturing silicon carbide substrate
03/15/2012US20120061683 Group iii nitride semiconductor growth substrate, group iii nitride semiconductor epitaxial substrate, group iii nitride semiconductor element and group iii nitride semiconductor free-standing substrate, and method of producing the same
03/15/2012US20120061682 Sic semiconductor device and method for manufacturing the same
03/15/2012US20120061681 Mechanism of forming sic crystalline on si substrates to allow integration of gan and si electronics
03/15/2012US20120061680 Gallium nitride based semiconductor devices and methods of manufacturing the same
03/15/2012US20120061679 Silicon Polymers, Methods of Polymerizing Silicon Compounds, and Methods of Forming Thin Films From Such Silicon Polymers
03/15/2012US20120061678 Method of laser annealing semiconductor layer and semiconductor devices produced thereby
03/15/2012US20120061675 Transistor structure, manufacturing method of transistor structure, and light emitting apparatus
03/15/2012US20120061673 Method for manufacturing light-emitting display device
03/15/2012US20120061672 Method of providing a flexible semiconductor device at high temperatures and flexible semiconductor device thereof
03/15/2012US20120061670 Method for manufacturing semiconductor device
03/15/2012US20120061669 Chip on film (cof) package having test line for testing electrical function of chip and method for manufacturing same
03/15/2012US20120061665 Liquid crystal display device and manufacturing method thereof
03/15/2012US20120061664 Light-emitting display device and method for manufacturing the same
03/15/2012US20120061663 Semiconductor device and method for manufacturing the same
03/15/2012US20120061661 Semiconductor structure and fabricating method thereof
03/15/2012US20120061649 Strain-inducing semiconductor regions
03/15/2012US20120061648 Apparatus, method and computer program product providing radial addressing of nanowires
03/15/2012US20120061569 Thermal infrared sensor and manufacturing method thereof
03/15/2012US20120061288 Composite substrate carrier
03/15/2012US20120060928 Processes for preparing copper tin sulfide and copper zinc tin sulfide films
03/15/2012US20120060925 Surface processing method of silicon substrate for solar cell, and manufacturing method of solar cell
03/15/2012US20120060912 Method of forming conductive electrode structure and method of manufacturing solar cell with the same, and solar cell manufactured by the method of manufacturing solar cell
03/15/2012US20120060887 Asymmetric thermoelectric module and method of manufacturing the same
03/15/2012US20120060869 Single workpiece processing chamber
03/15/2012US20120060759 Falling film plasma reactor
03/15/2012US20120060607 Vibration transducer and its manufacturing method
03/15/2012US20120060587 Gas Detector that Utilizes an Electric Field to Assist in the Collection and Removal of Gas Molecules
03/15/2012DE19960368B4 System zum mikrolithographischen Schreiben mit verbesserter Genauigkeit System for microlithography letter with improved accuracy
03/15/2012DE112008004172T5 Strukturmessgerät und Strukturmessverfahren Structure gauge and structure measurement method
03/15/2012DE112006003059B4 Halbleiteranordnungen und Verfahren zur Herstellung derselben Semiconductor devices and methods of manufacturing the same
03/15/2012DE102011112046A1 Verfahren zur Herstellung einer leitfähigen Elektrodenstruktur und Verfahren zur Herstellung einer Solarzelle durch ein derartiges Verfahren, und eine gemäß dem Verfahren hergestellte Solarzelle A process for preparing a conductive electrode structure and method of manufacturing a solar cell by such a method, and a solar cell manufactured according to the method
03/15/2012DE102011082427A1 Laser beam processing device comprises non-contact support means for supporting workpiece, laser beam application means, processing supply means for supplying workpiece relative to laser beam application means, and fragment tightening means
03/15/2012DE102011077647A1 Dünnschichttransistorsubstrat mit einer widerstandsarmen Busleitungsstruktur und Herstellungsverfahren für dasselbe Thin-film transistor substrate having a low resistance Busleitungsstruktur and manufacturing method for the same
03/15/2012DE102011076954A1 Method for manufacturing single-sided polished semiconductor wafer, involves implementing oxidation separation on rear side of semiconductor wafer, and polishing and cleaning front side of semiconductor wafer
03/15/2012DE102011053518A1 Verfahren zur Herstellung eines Halbleiterchip-Paneels A process for producing a semiconductor chip panel
03/15/2012DE102011053362A1 Leistungs-halbleiterchip-verkapselung Power semiconductor chip encapsulation
03/15/2012DE102011053149A1 Die-Struktur, Die-Anordnung und Verfahren zum Prozessieren eines Dies The structure, the assembly and method for processing a This
03/15/2012DE102011051597A1 Hochspannungsbipolartransistor mit Grabenfeldplatte Hochspannungsbipolartransistor with grave field plate
03/15/2012DE102010045411A1 Vorrichtung zur Behandlung und/oder Bearbeitung von Substraten An apparatus for treating and / or processing of substrates
03/15/2012DE102010045372A1 Producing a semiconductor module having two semiconductor chips and an interposer, which has electrically conductive structures, comprises imprinting the interposer directly on first one of the semiconductor chips
03/15/2012DE102010045098A1 Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten Device and method for the separation and transportation of substrates
03/15/2012DE102010045056A1 Verfahren und Vorrichtung zum Herstellen von Chip-Bauelementen sowie mittels des Verfahrens hergestelltes Chip-Bauelement Method and apparatus for the manufacture of chip components as well as produced by the method of chip component
03/15/2012DE102010045055A1 Verfahren zur Herstellung eines Halbleiterbauelementes mit einer Durchkontaktierung und Halbleiterbauelement mit Durchkontaktierung A process for producing a semiconductor device having a via hole and semiconductor component with through-contact
03/15/2012DE102010040839A1 Verfahren zum Herstellen eines elektronsichen Bauelements und elektronisches Bauelement A process for producing an electrophotographic Sichen component and electronic component
03/15/2012DE102010040535A1 Verfahren zum Sägen eines Werkstücks Method for cutting a workpiece
03/15/2012DE102007014363B4 Halbleitermodul und Verfahren zu dessen Herstellung Semiconductor module and method for its production
03/15/2012DE102007008777B4 Halbleiterbauelement mit Zellenstruktur und Verfahren zur Herstellung desselben Of the same semiconductor device with cell structure and methods for preparing
03/15/2012DE102007005558B4 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same
03/15/2012DE102006049156B4 Herstellungsverfahren für ein Trockenätzgas für Halbleiterverfahren Manufacturing method of a dry etching method for semiconductor
03/15/2012DE102005056426B4 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation
03/15/2012DE102005035144B4 Belichtungsmaskenherstellungsverfahren, Zeichnungsvorrichtung und Halbleiterbauelementherstellungsverfahren Exposure mask manufacturing process, drawing device and semiconductor device manufacturing method
03/15/2012DE102004041883B4 Halbleitervorrichtung Semiconductor device
03/15/2012DE102004017114B4 Vorrichtung zur Handhabung eines scheibenartigen Elements, insbesondere zur Handhabung eines Wafers A device for handling a disc-like element, in particular for handling of a wafer
03/15/2012DE10130626B4 Verfahren zur Herstellung eines Halbleiterspeicherelements mit einem mit einer Kondensatorelektrode verbundenen Anschluss A method for producing a semiconductor memory device having a capacitor electrode connected to a connection