Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2012
04/04/2012CN102403210A 预非晶化注入的高温Ti自对准硅化物工艺 Pre-amorphization implantation temperature Ti salicide process
04/04/2012CN102403209A Preparation method for ohmic contact electrode based on diamond film field effect transistor
04/04/2012CN102403208A Rfldmos器件中栅极的制备方法 Rfldmos gate device production method
04/04/2012CN102403207A 一种用于薄膜晶体管的多晶硅激光退火方法 A laser annealing method for polycrystalline silicon thin film transistor
04/04/2012CN102403206A Pulse train annealing method and apparatus
04/04/2012CN102403205A 半导体装置的制造方法 The method of manufacturing a semiconductor device
04/04/2012CN102403204A 晶片的加工方法 Wafer processing method
04/04/2012CN102403203A 晶体硅太阳能电池选择性发射极的磷扩散方法 Phosphorus diffusion method crystalline silicon solar cell selective emitter
04/04/2012CN102403202A 一种具有高Ge组分的应变SiGe层的制备方法 A method for preparing a high Ge content with a strained SiGe layer
04/04/2012CN102403201A Method for manufacturing nitride semiconductor crystal layer
04/04/2012CN102403200A I线光刻机用双次光刻法实现0.18μm线宽图形的方法 I-line lithography method implemented with a double width graphics photolithography 0.18μm
04/04/2012CN102403199A 用于晶圆表面颗粒去除的方法 Wafer surface particle removal method for
04/04/2012CN102403198A 金属栅层/高k栅介质层的叠层结构刻蚀后的清洗方法 The cleaning method is etched metal gate layer stacked structure / high-k gate dielectric layer after
04/04/2012CN102403197A 一种激活掺杂原子的方法 A method to activate the doping atoms
04/04/2012CN102403196A 薄片粘贴装置及粘贴方法 Apparatus and method for thin paste paste
04/04/2012CN102403195A 纵型热处理装置及其控制方法 Vertical heat treatment apparatus and control method
04/04/2012CN102403194A 网状物处理装置 Web processing apparatus
04/04/2012CN102403193A 薄化晶片的方法 Wafer thinning method
04/04/2012CN102403192A Cleaning method for substrates
04/04/2012CN102403191A 一种反应腔漏气检测方法及真空反应器控制方法 A reaction to the vacuum chamber leak detection method and reactor control method
04/04/2012CN102403190A 圆片清洗方法 Wafer cleaning method
04/04/2012CN102403183A Plasma etching processing apparatus, plasma etching method, and semiconductor device manufacturing method
04/04/2012CN102402709A Memory card package structure and method for fabricating the same
04/04/2012CN102402635A 一种针对耦合电容影响的化学机械抛光工艺哑元金属填充方法 One for coupling capacitance influence chemical mechanical polishing process dummy metal filling method
04/04/2012CN102402137A 孔的光刻方法 Holes photolithographic method
04/04/2012CN102402126A 一种用于检测光刻过程中照明条件的结构及其检测方法 Structure and detection method for detecting the lighting conditions in the lithography process
04/04/2012CN102402125A 用于制造锗硅碳器件中的光刻标记结构及其制备方法 Manufacture silicon germanium carbon device lithography mark structure and preparation method for
04/04/2012CN102402090A Array substrate and manufacturing method thereof, and liquid crystal display device
04/04/2012CN102402085A Pixel structure of the display panel and preparing method thereof
04/04/2012CN102402082A Liquid crystal display device and method for manufacturing the same
04/04/2012CN102402043A Pixel array and preparing method thereof
04/04/2012CN102401465A Liquid heating unit, liquid processing apparatus including the same, and liquid processing method
04/04/2012CN102400196A By-product mitigation in through-silicon-via plating
04/04/2012CN102399651A 具有改进的基板相容性的无氨碱性微电子清洗组合物 Compatibility of the substrate having an improved non-ammonia alkaline microelectronic cleaning compositions
04/04/2012CN102399648A 一种含氟清洗液 A fluorine-containing cleaning solution
04/04/2012CN102399526A Adhesive composition, circuit connection structure, semiconductor device, and solar cell module
04/04/2012CN102399506A 压敏粘合带 The pressure-sensitive adhesive tape
04/04/2012CN102399505A Dicing die bond film
04/04/2012CN102399504A Pressure-sensitive adhesive tape
04/04/2012CN102398313A 光器件晶片的加工方法 Optical device wafer processing method
04/04/2012CN102398209A 被研磨物的研磨方法及研磨垫 Be polishing method and a polishing pad of the polishing composition
04/04/2012CN101978471B 基板处理装置和方法 The substrate processing apparatus and method
04/04/2012CN101930909B 生产半导体晶片的方法 Method for producing a semiconductor wafer
04/04/2012CN101911277B Arrangements and methods for determining positions and offsets
04/04/2012CN101911268B Heavily doped region in double-diffused source MOSFET (LDMOS) transistor and a method of fabricating the same
04/04/2012CN101901762B 用于形成金属栅极晶体管的方法 The method for forming a metal gate transistor
04/04/2012CN101896994B 用于清洁的设备和方法 Device and method for cleaning
04/04/2012CN101848602B Multi-layer printed board
04/04/2012CN101840929B 一种区域多色有机电致发光显示器及其制造方法 Multi-color organic electroluminescent display and a method of manufacturing an area
04/04/2012CN101834201B 显示器件及其制作方法 Display device and manufacturing method thereof
04/04/2012CN101834119B 衬底处理装置 The substrate processing apparatus
04/04/2012CN101826547B 有源矩阵有机发光二极管像素结构及其制造方法 The active matrix organic light emitting diode pixel structure and its manufacturing method
04/04/2012CN101821833B Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device
04/04/2012CN101819964B Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board
04/04/2012CN101809723B 蚀刻蚀刻层的方法和装置 Method and apparatus for etching the etch layer
04/04/2012CN101809722B 混合型电容耦合和电感耦合等离子处理系统的方法和设备 Method and apparatus for hybrid capacitive and inductive coupling plasma processing system
04/04/2012CN101807585B Tft-lcd阵列基板及其制造方法 Tft-lcd array substrate and a method of manufacturing
04/04/2012CN101796623B 探测组件及其制造方法 The sensor package and method for manufacturing
04/04/2012CN101789367B 半导体元件的制法 Method semiconductor element
04/04/2012CN101779282B 基板输送机械手 Substrate transfer robot
04/04/2012CN101772834B Semiconductor device, method for manufacturing the same and image display
04/04/2012CN101765900B Method and apparatus for cleaning a substrate surface
04/04/2012CN101755333B 用于在包含密间隔线的结构上形成具增加可靠度的层间介电材料的技术 Is used in the structure comprising a dense partition lines forming technique increases the reliability of inter-layer dielectric material
04/04/2012CN101755240B 一种光刻胶清洗剂 A resist cleaning agents
04/04/2012CN101752308B 形成像素结构的方法 The method of forming the pixel structure
04/04/2012CN101752217B 半导体装置制造用薄膜及其制造方法 A semiconductor device and its manufacturing method for manufacturing a thin film
04/04/2012CN101750814B 液晶显示设备及其制造方法 The liquid crystal display device and manufacturing method thereof
04/04/2012CN101692420B 一种工作台倾角调整结构 A service station reclining structure
04/04/2012CN101691024B 一种半导体晶片粗磨精磨组合砂轮主轴结构 A semiconductor wafer combination of coarse grinding wheel spindle structure
04/04/2012CN101689512B 元件移载装置 Component transfer means
04/04/2012CN101689492B Apparatus and method for processing a substrate edge region
04/04/2012CN101689409B Anisotropic conductive material, connected structure, and production method thereof
04/04/2012CN101685218B 液晶显示面板阵列基板及其制造方法 Panel array substrate and a method of manufacturing a liquid crystal display
04/04/2012CN101681872B 电荷库结构 Charge library structure
04/04/2012CN101667549B Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier
04/04/2012CN101656254B 动态随机存取内存结构及其制造方法 Dynamic random access memory structure and its manufacturing method
04/04/2012CN101647104B 成膜装置和成膜方法 Film forming apparatus and film forming method
04/04/2012CN101644862B 显示装置及显示装置的制造方法 The method of manufacturing a display device and a display device
04/04/2012CN101641781B Semiconductor device and process for producing the same
04/04/2012CN101641775B 通过高温热退火改善薄层品质 Improve quality through a thin layer of high-temperature thermal annealing
04/04/2012CN101635260B 半导体装置、晶体管及其制造方法 A semiconductor device, and manufacturing method of the transistor
04/04/2012CN101622376B 使用超临界溶剂在半导体基片上形成金属膜的组合物和方法 Using supercritical solvent compositions and methods for forming a metal film on a semiconductor substrate
04/04/2012CN101604615B Method for etching an ultra thin film and etching liquid
04/04/2012CN101597754B 形成高质量的低温氮化硅膜的方法和设备 Methods and apparatus for forming a high quality low temperature silicon nitride film
04/04/2012CN101587272B 液晶显示器件及其制造方法 The liquid crystal display device and manufacturing method thereof
04/04/2012CN101582403B Semiconductor package featuring flip-chip die sandwiched between metal layers
04/04/2012CN101558482B Method for generating a capping layer on electrically conductive regions and a device
04/04/2012CN101542716B 其上形成了电子器件的金属衬底 A metal substrate on which an electronic device is formed of
04/04/2012CN101540302B Sheet structure and method of manufacturing sheet structure
04/04/2012CN101539697B 一种薄膜晶体管液晶显示器像素结构及其制造方法 A thin film transistor liquid crystal display pixel structure and its manufacturing method
04/04/2012CN101533798B 静电吸盘 Electrostatic chuck
04/04/2012CN101529598B 碳化硅半导体器件的制造方法 The method of manufacturing a silicon carbide semiconductor device
04/04/2012CN101523298B 一种光刻胶清洗剂 A resist cleaning agents
04/04/2012CN101520580B TFT-LCD array substrate structure and manufacturing method thereof
04/04/2012CN101506614B Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components
04/04/2012CN101501831B Disc wafer inspecting device and inspecting method
04/04/2012CN101479830B Repairing and restoring strength of etch-damaged low-k dielectric materials
04/04/2012CN101399182B 基板处理装置及基板处理方法 Substrate processing apparatus and substrate processing method
04/04/2012CN101388410B Flash memory device and method for fabricating the same
04/04/2012CN101373736B Interconnect, interconnect forming method, thin film transistor, and display device
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