Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2012
04/04/2012CN102403343A Vertical parasitic PNP device in BiCMOS (bipolar complementary metal oxide semiconductor) process and manufacturing method
04/04/2012CN102403342A 一种铪基氧化物高k栅介质层及其能带调控方法 One kind of hafnium-based high-k gate dielectric oxide layer and can take regulatory methods
04/04/2012CN102403340A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
04/04/2012CN102403338A SiC半导体器件及其制造方法 SiC semiconductor device and its manufacturing method
04/04/2012CN102403335A Mos器件及其制造方法 Mos device and its manufacturing method
04/04/2012CN102403333A Light-emitting display device and method for manufacturing same
04/04/2012CN102403332A 集成发光器件和太阳电池片的半导体结构及其制作方法 Integrated semiconductor structure and method of manufacturing a light emitting device and solar cell sheet
04/04/2012CN102403321A Semiconductor device and preparation method thereof
04/04/2012CN102403320A Array substrate, fabricating method for same and liquid crystal display panel
04/04/2012CN102403318A System with logic and embedded MIM capacitor
04/04/2012CN102403316A Monolithic microwave integrated circuit
04/04/2012CN102403314A 双极cmos工艺中的有源区边墙及制造方法 Bipolar cmos process sidewall and method of manufacture of the active region
04/04/2012CN102403313A Semiconductor Element And Method For Making The Same
04/04/2012CN102403312A Device region on substrate and method of designing layout of devices
04/04/2012CN102403311A 阵列基板及其制造方法和液晶显示器 The method of manufacturing the array substrate and the liquid crystal display
04/04/2012CN102403308A 一种不对称多芯片系统级集成封装器件及其封装方法 A multi-chip system-level integration package device and packaging method asymmetry
04/04/2012CN102403304A Interconnection structure and manufacturing method thereof
04/04/2012CN102403303A 在片上系统中使用动态随机存取存储器部件的方法及系统 Using a dynamic random access memory means in the on-chip system, a method and system for
04/04/2012CN102403302A Mechanism of forming SiC crystalline on Si substrates to allow integration of GAN and si electronics
04/04/2012CN102403301A 双镶嵌结构及其制造方法 Dual damascene structure and manufacturing method
04/04/2012CN102403299A 电路板结构及其制法 Circuit board structure Jiqizhifa
04/04/2012CN102403298A Lead frame for semiconductor devices
04/04/2012CN102403296A Semiconductor module and method for production thereof
04/04/2012CN102403295A Semiconductor packaging through metallic bonding and method for same
04/04/2012CN102403294A 半导体器件 Semiconductor devices
04/04/2012CN102403293A Die structure, die arrangement and method of processing a die
04/04/2012CN102403291A Semiconductor Part And Method For Making The Same
04/04/2012CN102403290A Semiconductor device and method for fabricating semiconductor device
04/04/2012CN102403283A Ball grid array packaging structure with basic islands and manufacturing method thereof
04/04/2012CN102403282A Packaging structure with basic islands and without pins at four sides and manufacturing method thereof
04/04/2012CN102403280A Heat-radiating substrate and method for manufacturing same
04/04/2012CN102403279A Power semiconductor chip package
04/04/2012CN102403278A Connector assembly and manufacture method
04/04/2012CN102403277A Method for constructing an electrical circuit, and electrical circuit
04/04/2012CN102403276A Method for producing chip elements equipped with wire insertion grooves
04/04/2012CN102403275A Package on package structure and fabricating method for same
04/04/2012CN102403274A 非易失性闪速存储单元、阵列及其制造方法 A non-volatile flash memory cells, the array and its manufacturing method
04/04/2012CN102403273A 在sonos制造工艺中生长厚栅极氧化层的方法 Growth of a thick gate oxide layer in the manufacturing process of the method sonos
04/04/2012CN102403272A 高压互补金属氧化物半导体的制备方法 Preparation of high-voltage complementary metal oxide semiconductor
04/04/2012CN102403271A Method for manufacturing film transistor substrate and transflective liquid crystal display
04/04/2012CN102403270A 硅通孔互连结构的形成方法 The method for forming silicon via interconnect structure
04/04/2012CN102403269A 干法刻蚀第一金属层的方法 Dry-etching the first metal layer is a method
04/04/2012CN102403268A Methods for filling a contact hole in a chip package arrangement and chip package arrangements
04/04/2012CN102403267A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
04/04/2012CN102403266A 制作半导体器件结构的线接触孔的方法 Method of making line contact hole of a semiconductor device structure
04/04/2012CN102403265A 一种半导体器件通孔的形成方法 The method for forming a semiconductor device of the through-hole
04/04/2012CN102403264A 金属栅mos器件的接触孔刻蚀方法 Contact hole etching metal gate mos devices
04/04/2012CN102403263A 双大马士革结构中的沟槽刻蚀方法 Dual damascene structure, a trench etching method
04/04/2012CN102403262A 一种真空填孔技术 A vacuum sealer technology
04/04/2012CN102403261A 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof
04/04/2012CN102403260A 一种基于SiN埋绝缘层的晶圆级单轴应变SOI的制作方法 Based on the buried insulating layer SiN uniaxial strain SOI wafer level fabrication method
04/04/2012CN102403259A 基于机械弯曲台的单轴应变GeOI晶圆的制作方法 The bending station based on the mechanical uniaxial strain GeOI wafer production method
04/04/2012CN102403258A 浅沟槽隔离结构的制作方法 The method of making a shallow trench isolation structure
04/04/2012CN102403257A 改善超级结器件深沟槽刻蚀边界形貌的方法 Super-junction devices to improve border morphology deep trench etch method
04/04/2012CN102403256A Buried layer and manufacturing method, long hole contact and triode
04/04/2012CN102403255A 机械卡盘及刻蚀机 Mechanical chuck and etcher
04/04/2012CN102403254A Silicon wafer clamping device in single wafer washing equipment
04/04/2012CN102403253A 一种利用复合传输路径来实现硅片传输的方法 A use of the composite transmission path to achieve the wafer transfer method
04/04/2012CN102403252A 一种辅助刻蚀工艺的自动硅片装片机 An auxiliary etching process automatic wafer loading machine
04/04/2012CN102403251A 一种晶体硅片预清洗液及其预清洗工艺 A crystalline silicon wafer pre-washing liquid and pre-cleaning process
04/04/2012CN102403250A 传输模块压力平衡设备 Transmission module pressure balance equipment
04/04/2012CN102403249A 真空传输制程设备及方法 Vacuum transfer process equipment and methods
04/04/2012CN102403248A Nondestructive testing method of fault and dislocation defects of silicon polished wafers or epitaxial wafers
04/04/2012CN102403247A 试料检查装置以及试料检查方法 Sample inspection apparatus and method for sample inspection
04/04/2012CN102403246A 检测掩模板污染的方法 Detecting contamination of mask
04/04/2012CN102403245A 测试光阻胶层对离子注入阻挡能力的方法 Test photoresist layer on the ion implantation method of blocking the ability of the
04/04/2012CN102403244A Method for manufacturing semiconductor chip
04/04/2012CN102403243A Method for reducing UBM undercut in metal bump structures
04/04/2012CN102403242A Method for protecting chip to be detected from damage during re-bonding
04/04/2012CN102403241A Lga的双面塑封方法 Lga sided plastic method
04/04/2012CN102403240A 一种芯片的封胶方法 A method of sealing glue chip
04/04/2012CN102403239A Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in fo-wlcsp
04/04/2012CN102403238A Method for fabricating semiconductor chip panel
04/04/2012CN102403237A 一种高强度芯片封装方法 A high-strength chip packaging method
04/04/2012CN102403236A 芯片外露的半导体器件及其生产方法 Chip semiconductor device and a method of producing the exposed
04/04/2012CN102403235A 一种晶圆级封装vdrdl重新布局技术 One kind of wafer-level packaging technology vdrdl Relayout
04/04/2012CN102403234A 利用自对准技术制备具有高k金属栅的鳍形场效应晶体管的方法 Fin-shaped field-effect transistors preparation method uses self-aligned technology with high-k metal gate
04/04/2012CN102403233A Method for manufacturing tunnel transistor of vertical channel
04/04/2012CN102403232A Process for total dose radiation hardening of factory region
04/04/2012CN102403231A 使用纳米压印和接触式光刻制备硅纳米线晶体管的方法 Use of nano-imprint lithography preparation and exposure to silicon nanowire transistors
04/04/2012CN102403230A 一种半导体器件结构的制作方法 Method of manufacturing a semiconductor device structure
04/04/2012CN102403229A 台阶状硅锗源/漏结构的制造方法 The method of manufacturing a stepped SiGe source / drain structure
04/04/2012CN102403228A 具有锗硅外延层的pmos晶体管的制备方法 The method for preparing a silicon-germanium epitaxial layer having a pmos transistor
04/04/2012CN102403227A 台阶状硅锗源/漏结构的制造方法 The method of manufacturing a stepped SiGe source / drain structure
04/04/2012CN102403226A 晶体管及其制造方法 Transistor and its manufacturing method
04/04/2012CN102403225A 沟渠双扩散金属氧化半导体制作方法及装置 Metal oxide semiconductor manufacturing method and apparatus ditches double diffusion
04/04/2012CN102403224A 具有横向pin结构的超结vdmos的制备方法 Having a lateral pin structure in the preparation of super-junction vdmos
04/04/2012CN102403223A 改善贮存时间Ts一致性的功率晶体管制造方法 To improve the consistency of the storage time Ts of the power transistor manufacturing method
04/04/2012CN102403222A 锗硅异质结双极晶体管的制造方法 The method of manufacturing a silicon germanium heterojunction bipolar transistor
04/04/2012CN102403221A 半导体元件的制造方法 The method of manufacturing a semiconductor device
04/04/2012CN102403220A 一种SiCN扩散阻挡层制备工艺 One kind of SiCN diffusion barrier layer preparation process
04/04/2012CN102403219A 一种铜制程等离子刻蚀方法 One kind of plasma etching method for copper
04/04/2012CN102403218A Etching method for contact holes
04/04/2012CN102403217A 一种超薄芯片的制备方法 A method for preparing ultra-thin chips
04/04/2012CN102403216A 使用湿法刻蚀制备超级结器件的方法 Using wet etching method for the preparation of a super junction devices
04/04/2012CN102403215A Plasma texturing reaction apparatus
04/04/2012CN102403214A Method for manufacturing a mono-crystalline silicon solar cell and etching method thereof
04/04/2012CN102403213A 硅、氧化硅和氮化硅的堆栈结构刻蚀方法 Silicon, silicon oxide and silicon nitride etching method stack structure
04/04/2012CN102403212A 硅通孔晶片的抛光方法和用于该方法的抛光组合物 TSV wafer polishing method and a polishing composition used in the process of
04/04/2012CN102403211A 制备金属硅化物的方法 The method of producing a metal silicide
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