| Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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| 10/21/2009 | CN101560687A Method and device for continuously preparing high-silicon steel thin strip |
| 10/20/2009 | US7604871 Includes a conductive substrate, a tin layer formed on the substrate, and a barrier coating formed on the tin layer to impede tin whisker growth |
| 10/20/2009 | US7604727 Electroplating method for a semiconductor device |
| 10/20/2009 | US7604726 Platinum aluminide coating and method thereof |
| 10/15/2009 | WO2009089820A3 Strip electroplating plant for the electrochemical reinforcement of an electrically conductive outer layer of a strip |
| 10/15/2009 | WO2009089376A3 Highly electrically conductive surfaces for electrochemical applications |
| 10/15/2009 | US20090255819 Electroplating apparatus |
| 10/15/2009 | DE102008000995A1 Ball sleeve joint for motor vehicles, comprises a spherical piece, at whose ball-shaped joint area connects a ball stud, mounted in a housing, and a sealing bellow protecting the inner joint components against the penetration of impurities |
| 10/14/2009 | CN101555610A Method for local electroplating sheltering and hanging aluminium alloy cavity of communication filter |
| 10/14/2009 | CN101554597A Method for preparing Pt/C nanometer catalyst and device thereof |
| 10/14/2009 | CN100549447C Sliding element |
| 10/14/2009 | CN100549241C Aluminium sheet embossing roll |
| 10/13/2009 | US7601248 Substrate holder and plating apparatus |
| 10/08/2009 | WO2009123157A1 Connecting component metal material and manufacturing method thereof |
| 10/08/2009 | WO2009123144A1 Tinned copper alloy bar with excellent abrasion resistance, insertion properties, and heat resistance |
| 10/08/2009 | WO2009123139A1 Tin-plated cu-ni-si alloy strip with excellent unsusceptibility to thermal tin deposit peeling |
| 10/08/2009 | WO2009121443A1 Structured chrome solid particle layer and method for the production thereof |
| 10/08/2009 | WO2001004928A3 Improved apparatus and method for plating wafers, substrates and other articles |
| 10/08/2009 | US20090253573 Catalyst composition and deposition method |
| 10/08/2009 | DE112007002936T5 Plattierelement und Verfahren zum Herstellen desselben Of the same plating element and method for producing |
| 10/07/2009 | EP1560949B1 Integrated plating and planarization process and apparatus therefor |
| 10/07/2009 | CN101550582A Electroplating device and electroplating method |
| 10/07/2009 | CN101550574A Selective plating device |
| 10/07/2009 | CN100547120C Method for producing electroplating button of mobile phone |
| 10/06/2009 | US7597933 Coating a plastic substrate with a fluid containing a conductive metal powder and pressure-treating; polishing the coating to prevent dust from forming; electroless- or electrodeposition to plate and fix the image; labels; markings; shields to protect from electromagnetic waves |
| 10/01/2009 | WO2009119401A1 METHOD FOR PLATING MANDREL BAR WITH Cr, MANDREL BAR, AND PROCESS FOR PRODUCING SEAMLESS PIPE USING THE METHOD AND THE MANDREL BAR |
| 10/01/2009 | US20090243584 Fabrication of microstructures integrated with nanopillars along with their applications as electrodes in sensors |
| 09/24/2009 | WO2009117475A1 Electrodeposition of dielectric coatings on semiconductive substrates |
| 09/24/2009 | WO2009117072A1 Improved back contact in thin solar cells |
| 09/24/2009 | WO2009116621A1 Bearing |
| 09/24/2009 | WO2009116602A1 Terminal for connector and process for producing the terminal for connector |
| 09/24/2009 | WO2009116601A1 Metallic material for connector and process for producing the metallic material for connector |
| 09/24/2009 | WO2009116426A1 Electronic component and method for manufacturing the same |
| 09/24/2009 | WO2009116347A1 Electronic member wherein barrier-seed layer is formed on base |
| 09/24/2009 | WO2009116346A1 Electronic member wherein barrier-seed layer is formed on base |
| 09/24/2009 | WO2009114965A1 Electrochemical deposition system |
| 09/24/2009 | US20090239372 Seed Layers for Electroplated Interconnects |
| 09/24/2009 | US20090238693 Substrate With Applied Coating and Production Method |
| 09/24/2009 | US20090236627 Method of forming metal wiring |
| 09/24/2009 | US20090236232 Electrolytic plating solution, electrolytic plating method, and method for manufacturing semiconductor device |
| 09/24/2009 | US20090236231 Electrodeposition of dielectric coatings on semiconductive substrates |
| 09/24/2009 | CA2716687A1 Improved back contact in thin film solar cells |
| 09/23/2009 | EP2103716A1 Method for Inhibiting Background Plating |
| 09/23/2009 | EP2102900A1 Self-constrained anisotropic germanium nanostructure from electroplating |
| 09/23/2009 | CN101542022A Device and method for electroplating |
| 09/23/2009 | CN101538730A Electrolytic treatment device and electrolytic treatment method |
| 09/23/2009 | CN101538726A Method for electroplating metals of tin and bismuth |
| 09/23/2009 | CN101537530A Manufacturing method of target structure |
| 09/22/2009 | CA2295223C Porous film and method of preparation thereof |
| 09/17/2009 | WO2009010473A3 Method of providing a metallic coating layer and substrate provided with said coating layer |
| 09/17/2009 | WO2008129423A3 Conductive via formation |
| 09/17/2009 | US20090233440 Seed Layers for Metallic Interconnects |
| 09/17/2009 | US20090231782 Solid electrolytic capacitor |
| 09/17/2009 | US20090229984 Methods for the implementation of nanocrystalline and amorphous metals and alloys as coatings |
| 09/16/2009 | EP2100987A1 Surface treated copper foil, surface treated copper foil with very thin primer resin layer, method for manufacturing the surface treated copper foil, and method for manufacturing the surface treated copper foil with very thin primer resin layer |
| 09/16/2009 | EP2099954A1 Device and method for electroplating |
| 09/16/2009 | CN201309972Y Injector of electric plating solution |
| 09/16/2009 | CN100541844C Silver layer and its manufacture method, substrate for mounting LED using the silver layer and its manufacture method |
| 09/16/2009 | CN100541746C Electropolishing metal layers on wafers having trenches or vias with dummy structures |
| 09/15/2009 | US7588836 Solid solutions; corrosion resistance; blackening resistance; for household electric appliances |
| 09/11/2009 | WO2009110598A1 Ruthenium-palladium alloy-plated product and manufacturing method of the same |
| 09/11/2009 | WO2009016292A3 Unit and method for the electrolytic tinning of steel bands, using a soluble anode |
| 09/11/2009 | WO2008103027A9 Device for treating a band-shaped substrate with a liquid |
| 09/10/2009 | US20090223827 Pulse Reverse Electrolysis of Acidic Copper Electroplating Solutions |
| 09/10/2009 | DE19502358B4 Verfahren für die Vernickelung großflächiger Bauelemente Procedure for the nickel-plating of large-area devices |
| 09/10/2009 | DE102009011657A1 Galvanisierverfahren Electroplating |
| 09/10/2009 | DE102009011541A1 Abdichtvorrichtung und Galvanisiervorrichtung Sealing and plating apparatus |
| 09/10/2009 | DE102008045260B3 Apparatus for galvanizing substrate, e.g. wafer or solar cell, has component with anode support, central space and electrolyte flow adjusting operating device to give even layer thickness |
| 09/09/2009 | EP2097928A1 Instantaneous electrodeposition of metal nanostructures on carbon nanotubes |
| 09/09/2009 | CN101525761A 电镀方法 Electroplating method |
| 09/09/2009 | CN100539034C Substrate proximity processing structures and methods for using and making the same |
| 09/08/2009 | US7585398 Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| 09/03/2009 | US20090218231 Plating apparatus |
| 09/03/2009 | US20090218127 Plating processing method, light-transmitting conductive film and electromagnetic wave-shielding film |
| 09/01/2009 | US7582199 Plating method |
| 09/01/2009 | US7581403 Energy storage arrangement |
| 08/27/2009 | DE112007002468T5 Platierungsvorrichtung Platierungsvorrichtung |
| 08/26/2009 | EP1514957B1 Method for manufacturing plated resin film |
| 08/26/2009 | CN201296799Y Horizontal electrogalvanizing zinc anode device for steel wire |
| 08/26/2009 | CN101517734A Elastic contact and method for bonding between metal terminals using the same |
| 08/26/2009 | CN101517132A Plating apparatus |
| 08/26/2009 | CN101514476A Plating jig and plating method for electronic component by using the same |
| 08/26/2009 | CN101514464A Rolled thin steel plate galvanizing technique |
| 08/26/2009 | CN100533686C Plating method |
| 08/25/2009 | US7579275 Electric plating method, electric plating apparatus, program for plating, recording medium, and manufacturing method and manufacturing apparatus for semiconductor device |
| 08/25/2009 | US7579269 Microelectronic spring contact elements |
| 08/25/2009 | US7578923 Electropolishing system and process |
| 08/25/2009 | US7578886 Substrate processing apparatus, substrate processing method, and substrate holding apparatus |
| 08/25/2009 | CA2533633C Method for producing hardened parts from sheet steel |
| 08/19/2009 | EP1999302B1 Method for electrochemically structuring a conductuve or semiconductor material, and device for implementing it |
| 08/19/2009 | EP1087039B9 Wafer plating jig |
| 08/19/2009 | CN101509141A Method for electroplating tin-copper |
| 08/19/2009 | CN100528550C Heat resistant film, its manufacturing method, and electrical and electronic parts |
| 08/19/2009 | CN100528484C Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
| 08/18/2009 | US7575664 Plating method |
| 08/18/2009 | US7575636 Substrate processing apparatus and substrate processing method |
| 08/18/2009 | CA2533327C Method for producing a hardened steel part |
| 08/13/2009 | US20090202913 Negative electrode for nonaqueous secondary battery |
| 08/13/2009 | US20090202382 High manganese steel strips with excellent coatability and superior surface property, coated steel strips using steel strips and method for manufacturing the steel strips |
| 08/13/2009 | US20090200173 Cleaning, pickling and electroplating apparatus |