| Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798) |
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| 02/09/2011 | CN201737744U Processing device realizing reduction of electroplating rinse-wastewater and double-membrane multipoint separate recycling |
| 02/09/2011 | CN201735396U Anticorrosive device for copper dissolving tank |
| 02/09/2011 | CN101967672A Plating tank liquid medicine filtering system |
| 02/09/2011 | CN101967671A Air extracting device for electroplating equipment |
| 02/09/2011 | CN101597785B Device for observing nano material grown by electrochemistry method and control method thereof |
| 02/03/2011 | WO2010120158A3 Electroplating apparatus |
| 02/03/2011 | US20110025294 Method for analyzing electrolytic copper plating solution |
| 02/03/2011 | US20110024300 Electro-deposition of nano-patterns |
| 02/02/2011 | CN101962796A Method for sustainably complementing metallic cations in plating solution |
| 02/02/2011 | CN101962794A Anti-resonance electroplating bath |
| 01/27/2011 | DE4225961C5 Vorrichtung zur Galvanisierung, insbesondere Verkupferung, flacher platten- oder bogenförmiger Gegenstände Apparatus for electroplating, in particular copper plating, flat plate or sheet-like objects |
| 01/26/2011 | CN201722440U Galvanized ammonium salt solvent bath solution analyzer |
| 01/26/2011 | CN101956227A Automatic querying method for controlling gold-plating current of chip capacitor |
| 01/26/2011 | CN101956226A Plating bath anode brush |
| 01/26/2011 | CN101956224A Method for electroplating nano composite plated layer |
| 01/25/2011 | US7875158 Plating apparatus |
| 01/20/2011 | WO2011008212A1 Electroless deposition solutions and process control |
| 01/20/2011 | US20110011743 Low power rf tuning using optical and non-reflected power methods |
| 01/19/2011 | CN101949052A Plate roller clamping device, desk type plate roller loading/unloading equipment and plate roller hoisting automation equipment |
| 01/19/2011 | CN101949049A Molecular sieve plating tank |
| 01/13/2011 | US20110008916 Proximity Head Heating Method and Apparatus |
| 01/12/2011 | EP2173928B1 Plant and process for the electrolytic tinning of steel strips, using an insoluble anode |
| 01/12/2011 | CN101942691A Method and device for controlling electrolysis current density |
| 01/11/2011 | US7867368 Plating apparatus |
| 01/05/2011 | CN201695100U Liquid lifting device for multi-section use of water |
| 01/05/2011 | CN101935862A Cation generating device |
| 01/05/2011 | CN101619463B Method for on-line pickling solution treatment and system thereof |
| 01/05/2011 | CN101497464B Method for processing pickle liquor or electroplating waste liquor |
| 01/04/2011 | US7862693 Apparatus for plating semiconductor wafers |
| 12/29/2010 | CN101928979A Surface structure regulation, control and preparation method of metallic nanocatalyst |
| 12/28/2010 | US7857958 controlling a current density at an interface between the microfeature workpiece and processing liquid by controlling a distance between each of a plurality of points on the vessel surface and the microfeature workpiece to vary inversely with the square of a distance between the points and vessel axis |
| 12/28/2010 | US7857952 Method for treating the surface of object and apparatus thereof |
| 12/22/2010 | CN201678759U PCB board plating solution additive filling device |
| 12/22/2010 | CN201678758U Control system of lifting unit |
| 12/22/2010 | CN101923361A Water-saving control method |
| 12/22/2010 | CN101923360A Water-saving control device |
| 12/22/2010 | CN101553603B Galvanic method with analysis of the electrolyte bath by solid phase extraction |
| 12/21/2010 | US7854828 electrodepositing metal on to a semiconductor wafer; providing the modulation of current density at the wafer surface, improves the uniformity of plated layers; electroplating copper in Damascene integrated circuit |
| 12/21/2010 | US7854824 Method of manufacturing semiconductor device using electrochemical deposition with electric current revised by reflectance of every substrate surface and semiconductor manufacturing apparatus |
| 12/16/2010 | WO2010143623A1 Method for recovering water and metals from plating wastewater resulting from washing |
| 12/15/2010 | CN101387004B Plating device |
| 12/14/2010 | US7850836 reduce the effective aspect ratio of the via and determine the magnitudes of the forward and reverse pulse currents of the subsequent pulse current cycle; forming copper vertically interconnected on 3-D wafer stacking; improve the hydrophilicity of the through-hole via towards an electrolyte |
| 12/14/2010 | CA2449349C Electrodeionization apparatus and method |
| 12/09/2010 | US20100307924 Power control device of a power network of an electrochemical coating facility |
| 12/08/2010 | EP2257498A2 Electrohydraulic and shear cavitation radial counterflow liquid processor |
| 12/08/2010 | CN1920105B Method and apparatus for fluid processing a workpiece |
| 12/08/2010 | CN1603472B Manufacturing method of catelectrode |
| 12/08/2010 | CN101906654A Method for purifying copper electrolyte with minimal chemical reacting dose |
| 12/08/2010 | CN101906653A Internal-circulating plating technology and special combined equipment |
| 12/08/2010 | CN101481157B Process for advanced treatment of electroplating waste by integrated membrane |
| 12/07/2010 | US7846316 electroless metal deposition by ion exchanging; use a membrane to replenish the deposition metal ion |
| 12/02/2010 | US20100300888 Pulse sequence for plating on thin seed layers |
| 12/02/2010 | US20100300886 Continuous micro anode guided electroplating device and method thereof |
| 12/01/2010 | CN201660704U Small plating tank with purification function |
| 12/01/2010 | CN101899702A Water-saving method in chromium plating |
| 11/30/2010 | US7842169 Method and apparatus for local polishing control |
| 11/25/2010 | WO2010060408A4 Pickling method and pickling plant |
| 11/25/2010 | US20100295225 Method and apparatus for fluid processing a workpiece |
| 11/25/2010 | US20100294082 Method for Collection of Valuable Metal from ITO Scrap |
| 11/24/2010 | CN201650885U Loss prevention structure of filter pump for printed circuit board electroplating |
| 11/24/2010 | CN201648558U Vibrating mechanism with gas cylinder |
| 11/24/2010 | CN201648557U Drying equipment |
| 11/24/2010 | CN201648542U Printed circuit board plating line target falling preventive mechanism |
| 11/24/2010 | CN1584129B Method for separating copper from copper-containing waste liquid |
| 11/24/2010 | CN101896640A Method and apparatus for plating solution analysis and control |
| 11/24/2010 | CN101892509A Treatment device of chromium aging liquid |
| 11/24/2010 | CN101580957B Method and device for purifying and recycling chromium electroplating solution and waste solution thereof |
| 11/23/2010 | US7837851 Current densities are calculated from the measured differential voltages and correlated to thickness values of plated materials; a real time thickness profile is then generated by integrating current values associated with the differential voltage values |
| 11/23/2010 | US7837850 charge coupled video for bubble detection during copper electroplating for a semiconductor |
| 11/18/2010 | DE102009003072A1 Vorrichtung und Verfahren zum gleichzeitigen Be- oder Entschichten einer Mehrzahl von Werkstücken und Werkstück Apparatus and method for simultaneous loading or stripping a plurality of workpieces and workpiece |
| 11/17/2010 | EP2250301A1 Coating method for a work piece |
| 11/17/2010 | EP1015669B1 Electroplating method for forming a multilayer structure |
| 11/17/2010 | CN101886287A Operation limiting alarm program device of electricplating vehicle |
| 11/16/2010 | US7833404 Electrolytic phosphate chemical treatment method |
| 11/10/2010 | EP1644557B1 Electrochemical processing cell |
| 11/04/2010 | WO2010127094A2 High speed copper plating bath |
| 11/04/2010 | WO2010062162A3 Method for green chlorination of silver |
| 11/04/2010 | US20100276291 Device and method for the electrochemical deposition of chemical compounds and alloys with controlled composition and/or stoichiometry |
| 11/04/2010 | US20100276290 Patterning method, patterning apparatus, and method for manufacturing semiconductor device |
| 11/03/2010 | EP2245216A1 Indium electroplating baths for thin layer deposition |
| 11/03/2010 | CN201620201U Cooling water system of energy-saving and emission-reducing device |
| 10/28/2010 | WO2010123333A2 Single tub-type washing apparatus |
| 10/28/2010 | DE202010011352U1 Managementsystem für Galvanotechnische Gestelle Management System for Electroplating racks |
| 10/27/2010 | CN101871108A Electrolyte vacuum boiling type high speed electro-deposition method and device thereof |
| 10/26/2010 | US7820535 Method for analyzing copper electroplating solution, apparatus for the analysis, and method for fabricating semiconductor product |
| 10/26/2010 | CA2423854C Ionic liquids and their use |
| 10/21/2010 | WO2010120158A2 Electroplating apparatus |
| 10/21/2010 | WO2010119575A1 Surface-mounted led lead frame and method for manufacturing same |
| 10/21/2010 | WO2010119018A1 Removal of metallic salt-containing ionic fluids from surface-treated work pieces and recycling of said fluids |
| 10/21/2010 | US20100264037 Method for Electrochemical Fabrication |
| 10/20/2010 | EP2240626A2 Method and apparatus for plating solution analysis and control |
| 10/13/2010 | CN1732291B Lead free bump and method of forming the same |
| 10/12/2010 | US7811424 Reducing mechanical resonance and improved distribution of fluids in small volume processing of semiconductor materials |
| 10/07/2010 | WO2010060408A3 Pickling method and pickling plant |
| 10/06/2010 | CN101852693A Improvement of chemical analytical method of pure tin electroplate liquid additive AO |
| 10/05/2010 | US7807035 Separating the anode from the alkaline electrode by an ion-exchange membrane to prevent reaction of amines at the nickel anode to avoid undesirable secondary reactions in an alkali zinc/nickel electroplating bath; no bath renewal; cyanide-free; quality; protective coatings; corrosion resistance |
| 09/30/2010 | US20100243460 System, method and apparatus for measuring electrolysis cell operating conditions and communicating the same |
| 09/30/2010 | DE102005009024B4 Verfahren und System zum Steuern einer vertikalen Substratposition in einem elektrochemischen Prozess zur Herstellung von mikrostrukturierten integrierten Schaltungen A method and system for controlling a vertical position of substrate in an electrochemical process for the production of integrated circuits microstructured |
| 09/29/2010 | CN201592100U Hull cell test device for tinning |
| 09/29/2010 | CN101845660A Continuous electroplating zero-discharge automatic production device |