Patents for C22C 13 - Alloys based on tin (1,972)
05/2008
05/15/2008WO2008056676A1 Lead-free solder paste, electronic circuit board using lead-free solder paste, and method for manufacturing electronic circuit board
05/14/2008EP1921699A2 Electrode material for anode of rechargeable lithium battery, electrode structural body using said electrode material, rechargeable lithium battery using said electrode structural body, process for producing said electrode structural body, and process for producing said rechargeable lithium battery
05/14/2008EP1540027B1 Sn-based metal-coated steel strip excellent in appearance and process for producing same
05/14/2008CN100388520C Fabrication method of niobium-based superconductor
05/14/2008CN100387741C Sn-Zn-Cr alloy lead-free solder preparation method
05/07/2008EP1918064A1 Lead-free solder
05/02/2008WO2008012729A3 Low-pressure mercury vapor discharge lamp
04/2008
04/30/2008CN100385695C Thermoelectric conversion material, thermoelectric conversion element using the material, and electric power generation method and cooling method using the element
04/24/2008WO2008007404A3 Mercury releasing method
04/23/2008CN100384309C Welding method, component connection welded by such welding method and connection structure
04/23/2008CN100383269C Method for preparing high content stannum-cobalt alloy lithium ion battery cathode material
04/17/2008WO2008043482A1 Lead-free soft solder having improved properties at elevated temperatures
04/16/2008EP1911543A1 SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH
04/16/2008CN101161837A Molten tin antioxidant additive
04/10/2008WO2007081775A3 Lead-free solder with low copper dissolution
04/09/2008EP1908139A1 Alloy compositions for lithium ion batteries
04/09/2008CN101160187A Tin powder-containing colloidal liquid and method for producing same
03/2008
03/27/2008WO2008004531A3 Cream solder and method of soldering electronic part
03/26/2008CN100377389C Positive electrode material, process for producing the same and cell
03/26/2008CN100376704C Temperature fuse element, temperature fuse and battery using the same
03/20/2008WO2008014157A3 Intumescent paint coatings for inhibiting tin whisker growth and methods of making and using the same
03/20/2008US20080070059 Lead-free solder and soldered article
03/19/2008EP1900853A1 High-purity tin or tin alloy and process for producing high-purity tin
03/13/2008US20080061117 A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb or other metals
03/12/2008EP1897649A1 Lead-free solder alloy
03/12/2008EP1897639A1 Tin powder-containing colloidal liquid and method for producing same
03/06/2008WO2008026761A1 Lid for functional part and process for producing the same
03/05/2008CN100373664C Preparation method for high-capacity Sn-Ni alloy compound as lithium ion battery negative electrode material
03/04/2008US7338567 Comprises tin, copper, phosphorus, and germanium; may also contain silver, antimony, nickel, cobalt, iron, manganese, chromium, molybdenum, bismuth, indium and/or zinc; printed circuits; strength
02/2008
02/27/2008EP1716264A4 Lead-free solder composition for substrates
02/27/2008CN101132881A 钎料合金 Solder alloy
02/26/2008US7335269 electrical conductors having improved microstructural stability and reduced formation of slags, when soldering
02/21/2008US20080042111 Copper-Containing Tin Powder, Method for Producing the Copper-Containing Tin Powder and Electro-Conductive Paste Using the Copper-Containing Tin Powder
02/20/2008EP1889684A1 Lead-free solder alloy
02/06/2008CN101120109A Solder alloy
02/06/2008CN100366773C Ti-containing Sn-based alloy and its smelting preparation method
01/2008
01/31/2008WO2008013104A1 Lead-free solder alloy
01/31/2008US20080026240 Solder, and Mounted Components Using the Same
01/30/2008CN100364711C Leadless welding flux
01/23/2008EP1880032A2 Tin alloy solder compositions
01/23/2008EP1825011A4 Lead-free solder alloy
01/23/2008CN101108436A Product used for fluxless brazing and its preparing method
01/17/2008CA2656189A1 Mercury releasing method
01/10/2008WO2008004531A2 Cream solder and method of soldering electronic part
01/10/2008WO2008004428A1 Hydrogen generating method, hydrogen generating alloy and method for manufacturing hydrogen generating alloy
01/02/2008EP1531024B1 Tin-zinc lead-free solder, its mixture, and solder-joined part
01/02/2008CN101098977A Bearing of motor driven fuel pump
01/02/2008CN101096730A Pb-free sn-based material, wiring conductor, terminal connecting assembly, and pb-free solder alloy
12/2007
12/27/2007US20070297937 Method of Forming Sn-Ag-Cu Ternary Alloy Thin-Film on Base Material
12/27/2007US20070295528 Pb-free Sn-based material, wiring conductor, terminal connecting assembly, and Pb-free solder alloy
12/26/2007EP1685586A4 Anti-tombstoning lead free alloys for surface mount reflow soldering
12/25/2007US7312688 Fuse element and method for making same
12/19/2007CN101090797A Lead-free solder flux and solder paste
12/18/2007CA2351912C Pb-free soldering alloy
12/13/2007US20070286762 Gold-containing solder deposit, method for production thereof, soldering method and use
12/12/2007CN101086045A Transitional alloy layer for bearing alloy casting and its preparation method
12/06/2007DE112006000200T5 Lager für eine mit einem Motor betriebene Brennstoffpumpe Bearing for a powered with an engine fuel pump
12/06/2007DE102006026005A1 Kaltgepresste Sputtertargets Cold pressed sputtering targets
12/05/2007CN101082084A Technique for reclaiming smelting refined bismuth from bismuth slag
11/2007
11/29/2007WO2007045191A3 Lead-free solder alloy
11/28/2007CN101080505A Improvements in or relating to solders
11/22/2007WO2007070548A3 Lead-free solder alloys and solder joints thereof with improved drop impact resistance
11/21/2007CN101075670A Anode active substance and battery
11/14/2007CN101072886A Anti-tombstoning lead free alloys for surface mount reflow soldering
11/14/2007CN100349242C Alloy type thermal fuse and material for a thermal fuse element
11/14/2007CN100349241C Alloy type thermal fuse and material for a thermal fuse element
11/13/2007US7293692 Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method
10/2007
10/18/2007US20070243405 Electronic device with lead-free metal thin film formed on the surface thereof
10/18/2007US20070243098 Lead-Free Solder
10/16/2007US7282175 low melting alloys of silver, copper Cu, phosphorus, germanium, gallium, aluminum, silicon, bismuth, indium, zinc, antimony and zinc, having imapct resistance, used for connecting substrates to semiconductor chips; miniaturization
10/16/2007US7282174 Lead-free solder and soldered article
10/10/2007EP1841561A1 Solder alloy
10/10/2007CN101050529A Metal spraying material of tin, zinc, cupper, and chrome without lead
10/10/2007CN101050528A Metal spraying material without lead
10/04/2007US20070228109 bonding an electronic device to a substrate; forming high-strength joints by soldering; low temperature melting
10/03/2007CN101048521A High temperature lead-free solder and package for storing semiconductor element
10/03/2007CN101047223A Thermoelectric material and thermoelectric conversion element using same
10/03/2007CN100340685C Lead-free tin-silver-copper alloy solder composition
09/2007
09/26/2007CN100339177C Brazing product and method of manufacturing a brazing product
09/19/2007EP1834728A1 Lead-free solder flux and solder paste
09/19/2007CN100338246C No-lead gold spraying material
09/13/2007WO2007102589A1 Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member
09/13/2007WO2007102588A1 Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member
09/13/2007CA2541637A1 Pb-free solder alloy compositions comprising essentially tin (sn), silver (ag), copper (cu), phosphorus (p) and rare earth: cerium (ce) or lanthanum (la)
09/12/2007CN101035918A Novel materials for the production of environmentally-friendly ammunition and other applications
09/07/2007WO2007099820A1 PRECURSOR FOR MANUFACTURE OF Nb3Sn SUPERCONDUCTING WIRE ROD, AND Nb3Sn SUPERCONDUCTING WIRE ROD
09/05/2007CN101031385A Solder composition and solder layer forming method using the same
09/05/2007CN101030638A Negative active material, method of preparing same and rechargeable lithium battery including same
08/2007
08/30/2007WO2007050571A3 Technique for increasing the compliance of lead-free solders containing silver
08/29/2007EP1826799A1 Seal material, image display device using seal material, method of producing image display device, and image display device produced by the production method
08/29/2007EP1825011A2 Lead-free solder alloy
08/29/2007EP1824638A1 Pb free solder alloy
08/29/2007CN101027368A Black material, black particle dispersion liquid, black light-blocking film using same, and base with black light-blocking film
08/28/2007US7261760 Member having separation structure and method for manufacture thereof
08/21/2007US7259465 Semiconductor device with lead-free solder
08/21/2007CA2243762C Alloy, in particular a solder alloy, method for joining workpieces by soldering using the solder alloy and use of the alloy for soldering
08/16/2007WO2007068503A3 Sn-containing heavy-duty material composition, method for the production of a heavy-duty coating, and use thereof
08/16/2007US20070190415 Negative active material for rechargeable lithium battery, method of preparing same, and rechargeable lithium battery including same
08/15/2007EP1819003A1 Negative active material, method of preparing same and rechargeable lithium battery including same
08/08/2007EP1815034A1 Improvements in or relating to solders
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