| Patents for C22C 13 - Alloys based on tin (1,972) |
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| 03/11/2003 | US6530653 Ultrasonic bonding of ink-jet print head components |
| 03/06/2003 | WO2002063060A3 Nb-based super conductor and method of making |
| 03/06/2003 | US20030044682 Anode thin film for lithium secondary battery and preparation method thereof |
| 03/05/2003 | EP1289033A2 Anode thin film for lithium secondary battery and preparation method thereof |
| 03/05/2003 | CN1400081A Lead-free welding flux alloy |
| 03/04/2003 | US6527881 Depositing tin layer and nickel layer on substrate sequentially forming multilayered film; irradiating laser beams onto the multilayered film to form the tin-nickel alloy film |
| 02/26/2003 | CN1398697A 无铅焊料 Lead-free solder |
| 02/20/2003 | US20030035976 Tin-silver coatings |
| 02/20/2003 | US20030034381 Packaging method using lead-free solder |
| 02/19/2003 | EP1284301A1 Tin-silver coatings |
| 02/12/2003 | CN1396039A Improved of solder |
| 02/11/2003 | US6517602 Solder ball and method for producing same |
| 02/06/2003 | US20030024733 Lead-free solder, and connection lead and electrical component using said lead-free solder |
| 01/30/2003 | US20030021718 Lead-free solder alloy |
| 01/30/2003 | US20030019216 Thermoelectric module, method for making thermoelectric module, thermoelectric device, and fiber floodlight device |
| 01/29/2003 | CN1394155A Alloy for solder and solder joint |
| 01/23/2003 | WO2003006200A1 Improvements in or relating to solders |
| 01/23/2003 | US20030015575 Solder material and electric or electronic device in which the same is used |
| 01/22/2003 | CN1392817A Solder material and electric or electronic device in which same is used |
| 01/16/2003 | WO2003004713A2 Lead-free solder alloy |
| 01/15/2003 | EP1275463A2 Pb-free solder-connected electronic device |
| 01/15/2003 | CN1390672A Leadfree SnZn-base alloy solder containing rare-earth elements |
| 01/09/2003 | US20030007886 Solders |
| 01/08/2003 | EP1273384A1 Lead-free solder alloy |
| 01/02/2003 | US20030003320 Plating film onto an object at a first current density in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. |
| 01/02/2003 | US20030003012 Elongation characteristics to secure high joint reliability |
| 01/02/2003 | US20030003011 Lead-free solder balls and method for the production thereof |
| 01/02/2003 | EP1268874A1 Metal or metal alloy based sputter target and method for the production thereof |
| 12/27/2002 | WO2002103787A1 Substrate for use in joining element |
| 12/25/2002 | CN1386887A Lead-free material for spraying gold and its preparing process |
| 12/19/2002 | US20020192106 Lead-free solder and soldered article |
| 12/12/2002 | WO2002099146A1 Novel high-temperature laed-free solders |
| 12/12/2002 | WO2002098601A1 Soldering flux vehicle additive |
| 12/12/2002 | US20020187364 Electrodeposition; electronics |
| 12/10/2002 | US6492039 Composite multilayer material for plain bearings |
| 12/05/2002 | WO2002097145A1 Compositions, methods and devices for high temperature lead-free solder |
| 11/21/2002 | US20020171157 Electronic device |
| 11/12/2002 | US6478944 Functional Sn-Bi alloy plating using a substitute material for Pb |
| 11/07/2002 | US20020163085 Pb-free solder-connected structure and electronic device |
| 11/05/2002 | US6475643 Lead-free alloy of tin and gallium, oxidation resistance |
| 10/31/2002 | US20020159913 A lead-free solder consisting of: 1.0 to 4.0 wt % of silver, 0.4 to 1.3 wt % of copper; 0.02 to 0.06 wt % of nickel and a balance of tin, nickel serves to lower a copper dissolution rate of solder |
| 10/29/2002 | US6472086 Multilayer; steel support; alloy overcoating; lead-free |
| 10/24/2002 | US20020155024 Lead-free solder compositions |
| 10/24/2002 | US20020153119 Porous sintered metal layer in pores or meshes; 5-40% barium phosphate, 1-30% of a phosphate, 1-10% of a polyimide resin, a phenol resin calcined product and a polyphenylene sulfone, and polytetrafluoroethylene balance |
| 10/23/2002 | EP1250467A1 Soldering alloy |
| 10/17/2002 | US20020149896 Thermoelectric module and method of producing the same |
| 10/16/2002 | EP1249041A1 Organic flip chip packages with an array of through hole pins |
| 10/15/2002 | US6464324 Microfluid device and ultrasonic bonding process |
| 10/15/2002 | US6464122 Soldering method and soldering apparatus |
| 09/24/2002 | US6455804 Continuous metal matrix composite consolidation |
| 09/19/2002 | US20020131887 Lead-free solder and soldered article |
| 09/12/2002 | WO2002070762A1 Member having separation structure and method for manufacture thereof |
| 09/12/2002 | US20020127136 Lead-free solder and soldered article |
| 09/11/2002 | CN1090550C 焊料合金 Solder alloy |
| 09/06/2002 | WO2002068897A1 Shotgun shot, pellets and bullets |
| 08/29/2002 | WO2002066705A1 Environmentally friendly surface treated steel sheet for electronic parts excellent in soldering wettability and resistance to rusting and formation of whisker |
| 08/29/2002 | US20020117539 Solder, method for processing surface of printed wiring board, and method for mounting electronic part |
| 08/22/2002 | US20020114726 Electronic device |
| 08/15/2002 | WO2002063060A2 Nb-based super conductor and method of making |
| 08/15/2002 | US20020108932 Continuous metal matrix composite consolidation |
| 08/14/2002 | CN1364106A Microfluid device and ultrasonic bonding process |
| 08/08/2002 | US20020106302 For a Sn-Zn-Bi based solder material, germanium and cooper are added; germanium and further copper are added for a Sn-Bi-Ag based solder material; and germanium and silver are added for a Sn-Zn-In based solder material. |
| 08/06/2002 | US6429388 High density column grid array connections and method thereof |
| 08/06/2002 | US6428745 A solder comprising 2.0 to 3.5 wt % of silver, 5 to 18 wt % of bismuth and rest is tin; used for soldering an electronic part to a circuit board |
| 08/01/2002 | US20020102432 Solder alloy particle scattered or mixed in the flux including Sn and Zn; metal particle scattered or mixed in the flux and including an element in the IB group |
| 08/01/2002 | US20020100986 Electronic device |
| 07/25/2002 | WO2002022913A3 Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
| 07/25/2002 | US20020096662 Base material made of copper or copper alloy having metal coating made of tin-silver alloy and intermetallic phase between base and coating, wherein coating alloy has silver proportion of 1-3.8%; temperature stability, sliding |
| 07/24/2002 | CN1360529A Method for plugging hole and cooling element manufactured by said method |
| 07/09/2002 | US6416883 Lead-free solder |
| 07/04/2002 | US20020086215 Electrode for lithium secondary battery and lithium secondary battery |
| 07/03/2002 | EP1218137A1 Method for plugging a hole and a cooling element manufactured by said method |
| 06/19/2002 | CN1354065A Solder or related to improvement of solder |
| 06/13/2002 | US20020069943 Method for producing a tin-nickel alloy film |
| 06/12/2002 | EP1213089A1 Solder, method for processing surface of printed wiring board, and method for mounting electronic part |
| 06/12/2002 | EP1212164A2 Microfluid device and ultrasonic bonding process |
| 06/12/2002 | EP1151145B1 Plain bearing |
| 05/23/2002 | WO2002040213A1 Lead-free solders |
| 05/23/2002 | US20020060724 Ultrasonic bonding of ink-jet print head components |
| 05/23/2002 | US20020060582 Leadless solder for use at high and low temperatures |
| 05/21/2002 | US6391123 Solder paste |
| 05/16/2002 | US20020057986 Solders |
| 05/02/2002 | WO2002034969A1 Alloy for solder and solder joint |
| 05/02/2002 | US20020051728 Vibrating melt of solder alloy in crucible under pressure to force the melt to drop through crucible orifices, forming droplets in nonoxidizing gas atmosphere, then solidifying; for use in bump connections in semiconductors |
| 05/02/2002 | EP1012354B1 Lead-free tin solder |
| 05/01/2002 | CN1346728A Lead-free alloy solder containing rare-earth and more alloy components |
| 04/11/2002 | US20020040624 Solder paste |
| 04/04/2002 | DE10045991A1 Ternäre Zinn-Zink-Legierungen, galvanische Bäder und galvanisches Verfahren zur Erzeugung von ternären Zinn-Zink-Legierungsschichten Ternary tin-zinc alloy electroplating baths and galvanic method for generating ternary tin-zinc alloy layers |
| 03/26/2002 | US6361742 A lead-free solder having superior mechanical strength is an alloy of tin-silver and a rare earth element |
| 03/26/2002 | US6361626 Solder alloy and soldered bond |
| 03/21/2002 | WO2002022913A2 Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
| 03/21/2002 | WO2002022302A1 Solder material and electric or electronic device in which the same is used |
| 03/21/2002 | US20020033717 Titanium alloy |
| 03/19/2002 | US6357919 Plain bearing |
| 03/14/2002 | WO2001054851A3 Microfluid device and ultrasonic bonding process |
| 03/13/2002 | CN1340108A Plain bearing |
| 02/21/2002 | US20020020051 Constrained filament niobium-based superconductor composite and process of fabrication |
| 02/14/2002 | US20020019077 Lead-free (Pb-free); forming an electrical device by connecting a substrate with a semiconductor device having a lead on which an tin-bismuth alloy layer is formed using bismuth silver tin alloy solder |
| 02/07/2002 | WO2002009936A1 Lead-free alloys with improved wetting properties |
| 02/07/2002 | US20020015856 Bearing material |