| Patents for C22C 13 - Alloys based on tin (1,972) |
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| 10/06/2004 | EP1404483B1 Improvements in or relating to solders |
| 10/06/2004 | CN1169997C Lead-free material for spraying gold and its preparing process |
| 09/29/2004 | CN1168571C Leadless solder alloy |
| 09/22/2004 | CN1531472A Solder alloy and soldered joint |
| 09/14/2004 | USRE38588 Does not contain no pb, and also has excellent solderability (or solder wettability) and provides a strong junction with a solder, and does not cause nonuniform thickness of the plated layer even in reflow processing; tin based alloy |
| 09/14/2004 | US6790333 Applying functional alloy plating to an electronic component to be mounted using an electrolytic procedure with a pulse waveform, functional alloy plating comprising tin and silver |
| 09/08/2004 | EP1454383A1 Contact terminal with doped coating |
| 09/08/2004 | EP1453636A1 Lead-free soft solder |
| 09/08/2004 | CN1165400C Method for plugging hole and cooling element manufactured by said method |
| 08/31/2004 | US6783213 Microfluid device and ultrasonic bonding process |
| 08/26/2004 | WO2004047507A3 Coating compositions for solder spheres, powders and preforms, methods of production and uses thereof |
| 08/19/2004 | WO2004038053A3 A lead-free solder, and a lead-free joint |
| 08/18/2004 | EP1446262A1 Improvements in fluxless brazing |
| 08/18/2004 | EP1446261A1 Product and method for low temperature fluxless brazing |
| 08/18/2004 | EP1446260A1 Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals |
| 08/12/2004 | US20040156741 Tin-zinc lead-free solder, its mixture, and solder-joined part |
| 08/12/2004 | US20040156740 improved environmental safety |
| 08/10/2004 | US6774298 Thermoelectric module and method of producing the same |
| 08/05/2004 | US20040151616 Lead-free alloys, composition thereof, methods of preparation and uses for soldering and babbitting |
| 07/28/2004 | CN1159761C Connecting material for electronic elements, and semiconductor device using same |
| 07/22/2004 | US20040141873 Solder composition substantially free of lead |
| 07/21/2004 | EP0985486B1 Leadless solder |
| 07/21/2004 | CN1514759A Soldering flux additive |
| 07/01/2004 | US20040126269 Solder for use on surfaces coated with nickel by electroless plating |
| 07/01/2004 | US20040126268 Electronic device having external terminals with lead-free metal thin film formed on the surface thereof |
| 06/30/2004 | EP1433190A1 Fuse element and method for making same |
| 06/30/2004 | CN1509499A Substrate for use in joining element |
| 06/24/2004 | WO2004038052B1 Friction-resistant alloy for use as a bearing |
| 06/23/2004 | EP1043112B1 Lead-free solder |
| 06/23/2004 | CN1507499A Compositions, methods and devices for high temperature lead-free solder |
| 06/23/2004 | CN1506188A Structure and method for leadless welding flux electronic packaging interconnection |
| 06/17/2004 | US20040115088 Lead-free solder |
| 06/17/2004 | US20040112474 Lead-free solder ball |
| 06/16/2004 | CN1505137A Semiconductor device |
| 06/10/2004 | US20040108597 Member having separation structure and method for manufacture thereof |
| 06/10/2004 | US20040108367 Structure and method for lead free solder electronic package interconnections |
| 06/09/2004 | CN1503295A Alloy type thermal fuse and material for a thermal fuse element |
| 06/09/2004 | CN1503294A Alloy type thermal fuse and material for a thermal fuse element |
| 06/08/2004 | US6746801 Electrode for lithium secondary battery and lithium secondary battery |
| 06/03/2004 | WO2004047507A2 Coating compositions for solder spheres, powders and preforms, methods of production and uses thereof |
| 06/02/2004 | EP1424713A1 Alloy type thermal fuse and material for a thermal fuse element |
| 06/02/2004 | EP1424712A1 Alloy type thermal fuse and material for a thermal fuse element |
| 05/27/2004 | WO2004044254A1 Fuel additive comprising tin and antimony having an open aerated texture |
| 05/27/2004 | WO2002097145B1 Compositions, methods and devices for high temperature lead-free solder |
| 05/27/2004 | US20040100353 Alloy type thermal fuse and material for a thermal fuse element |
| 05/27/2004 | US20040100352 Alloy type thermal fuse and material for a thermal fuse element |
| 05/26/2004 | CN1498713A Lead-less joining material and joining method using such material |
| 05/25/2004 | US6740427 Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same |
| 05/20/2004 | US20040096691 Multilayer; carbon foam insulation overcoated with antioxidant protective coating containing aluminum, or alloy thereof; cryogenic tanks |
| 05/20/2004 | US20040096688 Zinc, tin, bismuth, germanium alloy; joining connectors |
| 05/19/2004 | CN1496780A Leadless welding flux |
| 05/18/2004 | US6736907 Tin, zinc alloy mixed with flux |
| 05/13/2004 | WO2004039533A1 Lead-free solder and soldered article |
| 05/13/2004 | US20040091385 Wt. % tin, 30-65 wt. % zinc and 0.1-15 wt. % metal from the following group as a third alloy component; iron, cobalt, nickel. Alloy coatings can be produced by means of electrolytic deposition from aqueous galvanic electroplating |
| 05/13/2004 | US20040089945 Semiconductor device |
| 05/12/2004 | EP1218137B1 Method for plugging a hole and a cooling element manufactured by said method |
| 05/12/2004 | EP1073539B1 Use of lead-free solder alloy powder paste in pcb production |
| 05/06/2004 | WO2004038053A2 A lead-free solder, and a lead-free joint |
| 05/06/2004 | WO2004038052A1 Friction-resistant alloy for use as a bearing |
| 05/06/2004 | WO2004026517A3 Solder hierarchy for lead free solder joint |
| 05/06/2004 | US20040085178 Alloy type thermal fuse and wire member for a thermal fuse element |
| 05/06/2004 | EP1416508A1 Alloy type thermal fuse and wire member for a thermal fuse element |
| 05/05/2004 | CN1494101A Alloy type temp fuse and wire for temp fuse element |
| 04/28/2004 | CN1492946A Environmentally friendly surface treated steel sheet for electronic parts excellent in soldering wettability and resistance to rusting and formation of whisker |
| 04/28/2004 | CN1492525A Electrode material, electrode structure body, lithium secondary cell and method for producing them |
| 04/27/2004 | US6726780 Lead-free solder, and paste solder composition |
| 04/27/2004 | US6725517 Method for plugging a hole and a cooling element manufactured by said method |
| 04/22/2004 | US20040076541 Tin matrix of copper, antimony, and bismuth; creep rupture resistance at elevated temperatures |
| 04/21/2004 | EP1410871A1 Lead-free solder ball |
| 04/20/2004 | CA2140948C Building material coating |
| 04/15/2004 | US20040072012 Lead-free |
| 04/14/2004 | EP1406745A1 Soldering flux vehicle additive |
| 04/08/2004 | US20040066268 Alloy type thermal fuse and wire member for a thermal fuse element |
| 04/07/2004 | EP1404483A1 Improvements in or relating to solders |
| 04/07/2004 | CN1486813A Soft brazing method |
| 04/07/2004 | CN1144649C Lead-free soft solder |
| 04/01/2004 | WO2004026527A1 Soldering filler metal, assembly method for semiconductor device using same, and semiconductor device |
| 04/01/2004 | WO2004026517A2 Solder hierarchy for lead free solder joint |
| 04/01/2004 | US20040062679 Comprises tin, copper, phosphorus, and germanium; may also contain silver, antimony, nickel, cobalt, iron, manganese, chromium, molybdenum, bismuth, indium and/or zinc; printed circuits; strength |
| 03/31/2004 | EP1402989A1 Leach-resistant solder alloys for silver-based thick-film conductors |
| 03/31/2004 | EP1402988A1 The use of a solder on surfaces coated with nickel by electroless plating |
| 03/31/2004 | CN1486514A Constrained filament niobium-based superconductor composite and process of fabrication |
| 03/25/2004 | WO2004024975A1 Sn-based metal-coated steel strip excellent in appearance and process for producing same |
| 03/24/2004 | EP1399600A1 Compositions, methods and devices for high temperature lead-free solder |
| 03/24/2004 | CN1142843C Pb-free solder-connected structure and electronic device |
| 03/18/2004 | WO2004022118A1 Biomaterial member |
| 03/18/2004 | US20040050904 Solder hierarchy for lead free solder joint |
| 03/18/2004 | US20040050903 Solder ball |
| 03/17/2004 | CN1482266A Industrial pure tin with resistance to liquid surface oxidizing and application |
| 03/17/2004 | CN1481970A Tin-zinc base plumbum-free solder alloy and its preparing technology |
| 03/11/2004 | US20040048093 Sn-based metal-coated steel strip excellent in appearance and process for producing same |
| 03/09/2004 | US6702176 Solder, method for processing surface of printed wiring board, and method for mounting electronic part |
| 03/04/2004 | WO2004018719A1 Negative volume expansion lead-free electrical connection |
| 03/04/2004 | WO2004018146A1 Tin-zinc lead-free solder and solder-joined part |
| 03/04/2004 | WO2004018145A1 Tin-zinc lead-free solder, its mixture, and solder-joined part |
| 03/04/2004 | WO2003004713A3 Lead-free solder alloy |
| 03/04/2004 | CA2466949A1 Tin-zinc lead-free solder, its mixture, and solder-joined part |
| 03/04/2004 | CA2466948A1 Tin-zinc lead-free solder and solder-joined part |
| 02/17/2004 | US6692691 Prevents much copper comprised in the printed-circuit board from being reduced to be diffused in the soldering alloy, keeps mechanical strength at soldered part |
| 02/10/2004 | US6689470 Thermal protection system |